Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

Why not use a conventional SMT machine for bare dies?

Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability beyond normal feeder-based placement.

Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement, subject to wafer format, die condition, known-good-die data and the installed wafer configuration.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

What is the maximum published placement performance of the SIPLACE CA2?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement.

Can one SIPLACE CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers for multi-die production.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate together with relevant production data.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

What information is needed to match a used SIPLACE CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, machine condition and destination.

Ukubekwa kweWafer ngqo kwiPakethe ePhambili

I-ASM SIPLACE CA2Isisombululo seDie Attach kunye neFlip-Chip Production

I-SIPLACE CA2 yenzelwe iimveliso ezingasalungelani kakuhle nokuba kumgca we-SMT wesiqhelo okanye inkqubo yokubopha i-die-bonding ezimele zodwa. Idibanisa ukubekwa kwe-SMD okusekelwe kwi-feeder kunye nokuthathwa ngqo kwee-semiconductor dies ezivela kwii-wafers ezisakiweyo, okuvumela i-SiP kunye nabavelisi bokupakisha abaphambili ukuba balawule izinto ezixutyiweyo, i-die attach, i-flip-chip placement, i-survey kunye ne-traceability ngaphakathi kweqonga elinye lemveliso eliqhagamshelweyo.

Jonga ukulingana kweNkqubo Xoxa ngoCwangciso lwe-CA2

Ukuya kuthi ga kwi-76,000 cphUkubekwa kwe-SMT okusekwe kwi-feeder

Ukuya kuthi ga kwi-54,000 cphI-Die Attach evela kwi-Wafer

Ukuya kuthi ga kwi-51,000 cphI-Flip-Chip evela kwi-Wafer

Ukuya kuthi ga kwi-10 µmIklasi yokuChaneka kwi-3 Sigma

Ingxaki Yokuvelisa

Kutheni i-SIPLACE CA2 ikhona

Iimodyuli zeNkqubo ezikwiPhakheji kunye nezinye iimveliso ze-elektroniki eziphambili zihlala zidibanisa iintsapho ezimbini ezahlukeneyo zezinto kwi-substrate enye: izixhobo ze-SMD eziqhelekileyo ezinikezelwa kwiireyile, kunye nee-semiconductor dies ezingafakwanga zinikezelwa kwii-wafers ezisakiweyo. Imveliso yendabuko yahlula ezi zinto phakathi komatshini wokubeka i-SMT kunye ne-die bonder.

Loo mahluko unokungenisa ukuguqulwa kwezinto ezongezelelweyo, indawo yokugcina izinto ephakathi, ukudluliselwa kwemveliso, iindawo zokucwangcisa kunye neendlela zokulandelela umkhondo. Iidayi ezingenanto zinokufuna ukudluliselwa kwiteyiphu ngaphambi kokuba zingene kwinkqubo esekwe kwi-feeder, ngelixa iimveliso ezixutyiweyo zihamba phakathi kwezixhobo eziyilwe ngokwemigaqo eyahlukeneyo yemveliso.

I-ASM SIPLACE CA2 liqonga lokubeka elidibeneyo elenzelwe ukuvala esi sikhewu.Izisa ukuphathwa kwe-wafer die ngqo kwindawo yemveliso ejolise kwi-SMT, ngoko ke izinto ezincedisayo, imisebenzi ye-die attach kunye ne-flip-chip zinokulungelelaniswa ngokujikeleze ukuhamba kwemveliso okufanayo.

Luluphi utshintsho xa iidayi zingena kumgca we-SMT?

Iidayi ezaziwayo zinokukhethwa ngokuthe ngqo kulwazi lwemephu ye-wafer.
Ii-SMD ezibonelelwa ngokutya kunye nee-wafer ezibonelelwa ngee-die zingabekwa kwindawo enye.
Ukulungiswa kunye nokubekwa kwedayi kunokudityaniswa ngokufaka i-buffer.
Idayi nganye inokudityaniswa ukusuka kwindawo yayo ye-wafer ukuya kwindawo yayo yokugqibela ye-substrate.
Unxibelelwano lwe-SMT kunye ne-semiconductor lunokuthatha inxaxheba kumjelo omnye oqhagamshelweyo wefektri.

Isigqibo seNkqubo

I-SIPLACE CA2 Ivakala Njani?

Ii-application ze-CA2 ezinamandla azichazwa ngegama elinye lephakheji. Zichazwa ngokudityaniswa komthombo wezinto ezibonakalayo, ulandelelwano lwenkqubo, ukuchaneka, ukulandeleka kunye nomthamo wemveliso.

✓

Ukulingana okuqinileyo kwe-CA2

Le mveliso inye isebenzisa ii-SMD ezibonelelwa ngokutya kunye nee-bare dies.
Iidayi kufuneka zikhethwe ngqo kwi-wafer enye okanye ezininzi ezisarhiweyo.
Imveliso ibandakanya i-die attach, i-flip chip okanye zombini iinkqubo.
Iindidi ezininzi zeedayi kufuneka zitshintshwe ngaphandle kokuphathwa ngesandla.
Ukubekwa kufuna iiklasi zokuchaneka kwe-20 µm, 15 µm okanye 10 µm.
Ukulandelelana kweedayi nganye nganye kuyafuneka ukusuka kwi-wafer ukuya kwimveliso egqityiweyo.
Umenzi ufuna ukunciphisa ukubethelwa kweedayi kunye nezinto ezinxulumene noko.
Umgca kufuneka uqhagamshelene neenkqubo zefektri ze-SMT kunye ne-semiconductor.

Ifuna uHlolo lweNkqubo olongezelelweyo

Le nkqubo ifuna ukufudumeza okukhethekileyo, ukuphilisa okanye amandla aphezulu okubopha.
Ubukhulu okanye ubukhulu be-die buwela ngaphandle koluhlu lokuphatha olufakiweyo.
Imveliso idinga imisebenzi yokukhupha okanye yokubopha engafakwanga kumatshini.
I-substrate ifuna i-carrier okanye imo yokuthutha engabandakanywanga kulungiselelo.
Umthamo wemveliso uphantsi kakhulu ukuba ungafanela iqonga elidibeneyo elikhawulezayo.
Ukuhamba kwefektri ekhoyo kwakhiwe ngeeseli ezizimeleyo ezibopha ii-die-bonding.
Uhlolo olufunekayo okanye i-metrology kufuneka yenziwe kwizixhobo ezizodwa ezizodwa.
Umatshini osetyenzisiweyo okhoyo awunazo iinketho ze-wafer, intloko okanye isoftware ezifunekayo.

Uyilo loomatshini

Iinkqubo Ezintlanu Ezichaza Ubuchule Benkqubo ye-CA2

Igama lemodeli lichaza iqonga, kodwa ezi nkqubo zifakiweyo zimisela indlela umatshini ngamnye anokuzicubungula ngayo iiwafers, izinto kunye neesubstrates.

01 / IGALELO LEZINTO EZIPHATHEKAYO

IiSMT feeders kunye neeTreyi

Ii-feeders ezihambelanayo zibonelela ngee-passives kunye nee-semiconductors ezipakishiweyo, ngelixa iitreyi ezikhethiweyo kunye neendlela zokuthwala zixhasa iifomathi ezongezelelweyo zecandelo.

02 / UKUPHATHWA KWEWAFER

Inkqubo yokuTshintshiselana ngeWafer

Inkqubo ye-wafer igcina kwaye iveza iintlobo ezininzi ze-wafer, nto leyo evumela iimveliso eziqulathe iintlobo ezahlukeneyo zeedayi ezingenanto.

03 / INKQUBO EFANELEYO

Ukubhafa

Ukwahlulwa kwedayi kunye nokulungiswa kwayo kungahamba ngaxeshanye nokubekwa kwayo, kunciphisa isohlwayo sesantya esiqhele ukunxulunyaniswa nokuthathwa kwe-wafer ngqo.

04 / UKUBEKWA KWENDAWO

Uqwalaselo lweNtloko yeCP20

Iintloko ezikhawulezayo ziphatha izinto ezincinci nezinobuthathaka nge-pickup engenachukumisi, indawo elawulwayo kunye neeklasi zokuchaneka ukuya kuthi ga kwi-10 µm.

05 / ULAWULO LWENKQUBO

Ukuhlolwa kunye nokulandelelwa

Ukuqonda iinxalenye, ukujonga imeko yokubola, ukuhlolwa kokuntywila kunye nedatha yemveliso kuxhasa isivuno esizinzileyo kunye neerekhodi zenqanaba lokubola.

Ukuhamba Kokuhlanganiswa Kwe-Hybrid

Indlela iMixed SMD kunye neBare-Die Product ezihamba ngayo kwi-CA2

Ulandelelwano oluchanekileyo luyatshintsha ngokwemveliso, kodwa inkqubo idla ngokuqhagamshela ukuchongwa kwezinto, ukuphathwa ngokuthe ngqo kwe-wafer, ukubekwa ngokuchanekileyo kunye neerekhodi zemveliso.

Layisha Idatha yeMveliso

Iinkqubo ze-substrate, idatha yecandelo, iimephu ze-wafer, iiparameter zenkqubo kunye neemfuno zokulandelelwa ziyalungiswa.

Lungisa izixhobo

Iireli ze-SMD, iitreyi, iiwafer, iifreyimu zewafer, ii-nozzles kunye nezinto zokuntywila zibekwe kwisetingi yemveliso.

Khetha iiFa ezidumileyo

Inkqubo ye-wafer ichonga i-wafer efunekayo kwaye isebenzisa idatha yemephu ukukhetha iidayi ezisebenzisekayo kwimveliso.

I-Buffer kunye ne-Orient Dies

Ii-die ziyasuswa, zihlolwe, zifakwe i-buffer kwaye zijijeke xa i-assembly ifuna uqhagamshelo olujongene nobuso.

Beka Izinto Ezixutyiweyo

Izinto ezisetyenziswa kwisondlo kunye nee-wafer dies zifakwa kusetyenziswa i-SMT echaziweyo, i-die-attach, i-flip-chip okanye i-dipping sequence.

Idatha yeNkqubo yeRekhodi

Umthombo wokuthathwa, iziphumo zokuhlolwa kunye nendawo yokugqibela yokubekwa zinokunxulunyaniswa nesiseko kunye nerekhodi yemveliso.

Idatha yeQonga eliPapashiweyo

Iinkcukacha zobugcisa ze-ASM SIPLACE CA2

Amaxabiso apapashiweyo achaza amandla eqonga le-CA2 elifumanekayo. Ukusebenza okwenyani kuxhomekeke kwiseti yentloko efakiweyo, iphakheji yokuchaneka, iimodyuli ze-wafer, i-conveyor, umxube wezinto kunye neendlela zenkqubo.

Into yoBugcisa	Ubuchule obupapashweyo	Isizathu Sokuba Kubalulekile
Isantya sokubekwa kwe-SMT	Ukufikelela kwi-76,000 components ngeyure	Ixhasa ukubekwa ngobuninzi bezinto ezisetyenziswa kwi-feeder kunye nezinto ezipakishiweyo.
I-die incamathisele kwi-wafer	Kufa abantu abangama-54,000 ngeyure	Ivumela ukufakwa kwedayi ejonge phezulu kwi-wafer ngqo ngaphandle kwenkqubo yokutheyipha ephakathi.
Ukubekwa kwe-flip-chip kwi-wafer	Kufa abantu abafikelela kuma-51,000 ngeyure	Ixhasa ukubekwa kwee-dies ngesantya esiphezulu icala lokudibanisa lijonge kwi-substrate.
Iiklasi zokuchaneka	20 µm, 15 µm kunye ne-10 µm kwi-3 sigma	Ivumela ukufana kwenkqubo kwiisayizi ezahlukeneyo zedayi, iipitshi, ububanzi bebhola kunye nokunyamezelana kwe-substrate.
Umthamo we-wafer	Ukuya kuthi ga kwiiwafers ezingama-50 ezahlukeneyo	Ibonelela ngamandla okudaya izinto ezininzi kwiimveliso eziqulethe imisebenzi eyahlukeneyo ye-semiconductor.
Ukutshintshiselana nge-wafer	Ngaphantsi kwemizuzwana eli-13	Inciphisa ukulibaziseka kotshintsho lwezinto ezibonakalayo kwiimveliso ezitshintshana phakathi kwemithombo emininzi ye-wafer.
Ifomathi ye-substrate enomgca omnye	Ukuya kuthi ga kwi-620 × 700 mm, kuxhomekeke kuqwalaselo	Ixhasa iiphaneli, ii-PCB ezifakwe ngaphakathi kunye nee-substrates ezinkulu ezikhethekileyo.
Ifomathi ye-substrate eneendlela ezimbini	Ukuya kuthi ga kwi-375 × 260 mm kwimo emiselweyo echaziweyo	Ixhasa ukuthuthwa okuhambayo kwi-PCBs eziqhelekileyo kunye ne-SiP substrates.
Ubukhulu bomatshini	Malunga ne-2.56 × 2.50 × 1.85 m	Ibonelela ngesiseko socwangciso lomgangatho, ukususwa kwendlela yokungena kunye nokuhlolwa koyilo lwemigca.
Iindawo zonxibelelwano	I-IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 kunye ne-SECS/GEM	Iqhagamshela umatshini neenkqubo zolawulo lomgca we-SMT kunye neenkqubo zefektri ye-semiconductor.
Indawo yokuvelisa	Ukuhambelana kwegumbi lokucoca leKlasi yesi-7 kunye nenkxaso ye-SEMI S2/S8	Ixhasa ukusasazwa kwiindawo ezilawulwayo zokupakisha eziphambili kunye nemveliso ye-semiconductor.

Umatshini onikezelwayo kufuneka ujongwe ngokuthelekisa i-nameplate yawo, iintloko ezifakiweyo, udidi lokuchaneka, inkqubo ye-wafer, ulungiselelo lokuhambisa, iilayisensi zesoftware kunye neemodyuli zenkqubo. Ubuninzi beplatifomu abuchazi ngokuzenzekelayo iyunithi nganye nganye.

Ukuchaneka kunye nokuThuthwa

Utshintsho kubungakanani be-Substrate ngeKlasi yokuChaneka okufunekayo

Ifomathi exhaswa kakhulu kunye nokuchaneka okuqinileyo azisoloko zifumaneka kwindawo enye yokusebenza. Olu lwalamano kufuneka luhlolwe ngaphambi kokukhetha umatshini.

I-Conveyor / Imo Yokusebenza	Iklasi yokuchaneka	Ifomathi yeSubstrate epapashweyo	Indawo yokuHlola eqhelekileyo
Umthuthi wendlela enye	20 µm @ 3 sigma	Ukuya kuthi ga kwi-620 × 700 mm	Iipaneli ezinkulu kunye neefomathi zebhodi efakiweyo.
Umthuthi wendlela enye	15 µm @ 3 sigma	Ukuya kuthi ga kwi-620 × 700 mm	Ifomathi enkulu eneemfuno zokubekwa eziqinileyo.
Imo ye-quadrant yomzila omnye	12 µm @ 3 sigma	Ukuya kuthi ga kwi-620 × 700 mm, ivavanywe nge-300 × 300 mm quadrant	Qinisekisa uyilo lwemveliso ngokumalunga nendawo yokusebenza efanelekileyo.
Umthuthi wendlela enye	10 µm @ 3 sigma	Ukuya kuthi ga kwi-300 × 300 mm	I-SiP echanekileyo kakhulu kunye nokusetyenziswa kweedayi ezixineneyo.
Umthuthi wendlela ezimbini	20 µm @ 3 sigma	Ukuya kuthi ga kwi-375 × 260 mm	Imveliso ye-PCB okanye ye-SiP ehambelanayo.
Imowudi yendlela enye ephindwe kabini	20 µm @ 3 sigma	Ukuya kuthi ga kwi-375 × 430 mm	Ifomathi eyandisiweyo kusetyenziswa iqonga le-dual-conveyor.
Umthuthi wendlela ezimbini	15 µm okanye 10 µm @ 3 sigma	Ukuya kuthi ga kwi-250 × 100 mm	Ii-substrates ezincinci ezifuna udidi oluqinileyo lokuchaneka.

Uthelekiso lweNdlela yeMveliso

Iindlela Ezintathu Zokudibanisa Imveliso Exutyiweyo Ye-SMD Ne-Bare-Die

I-CA2 yenye yeendlela ezinokwenzeka zokuvelisa. Eyona ndlela ilungileyo ixhomekeke kubunzima bemveliso, ubungakanani bayo, izixhobo ezikhoyo kunye nemisebenzi yenkqubo efunekayo.

Indlela A

Iiseli ze-SMT kunye ne-Die-Bonding ezahlulweyo

Izixhobo ezipakishiweyo kunye needayi ezingenanto zicutshungulwa kumaqonga ezixhobo ezizimeleyo.

Iluncedo xa imisebenzi ekhethekileyo yokubopha idalwe kakhulu
Ivumela ukwenziwa ngcono kwezixhobo ezizimeleyo
Ifuna ukudluliselwa kunye nokulandeleka kwenkqubo enqamlezileyo
Isenokufuna indawo engaphezulu yomgangatho kunye nokuphathwa okuphakathi

Indlela B

Tape iiDies zokubekwa kwe-SMT

Iidayi ezingenanto ziguqulwa zibe yifomathi yeteyiphu ehambelana ne-feeder ngaphambi kokuba zihlanganiswe.

Isebenzisa ukuhamba kwezinto okuqhelekileyo okusekelwe kwi-feeder
Yongeza imisebenzi yokutheyipha, yokugcina kunye nokulawula umgangatho
Yenza izinto zokuthwala kunye neemfuno zokulahla
Inganciphisa ukuguquguquka xa kukho iintlobo ezininzi zokufa ezibandakanyekayo

Indlela C

Ukubekwa kweHybrid yeWafer ethe ngqo

I-CA2 icubungula ii-SMD ezivela kwi-feeders kwaye iyafa ngokuthe ngqo kwii-wafers kwiqonga elinye elidibeneyo.

Inciphisa ukuguqulwa kwedayi kunye nokuphathwa okuphakathi
Ixhasa imveliso ye-multi-wafer kunye ne-multi-die
Idibanisa iirekhodi zedayi kunye nezikhundla zokugqibela zokubekwa
Ifuna i-wafer echanekileyo, intloko kunye noqwalaselo lwenkqubo

Uyilo lweMigca yeMveliso

I-CA2 ingasebenza njengeZiko leNkqubo yeHybrid yoMgca weSiP

Kwimveliso yeSiP enomthamo ophezulu, i-CA2 inokudityaniswa ne-SIPLACE TX micron okanye esinye isixhobo esifanelekileyo. Ukubekwa kwe-feeder ekhawulezayo, ukucubungula i-wafer ngqo kunye nokuhlolwa kunokulinganiswa kwiimashini ezixhunyiweyo endaweni yokunyanzela yonke imisebenzi kwisitishi esinye.

Inqanaba 01Ukuprinta okanye ukusetyenziswa kwezinto

Intlama yokuncamathelisa, iglu okanye iflux iyasetyenziswa kwaye ihlolwe ngokwenkqubo.

Inqanaba lesi-02Ukubekwa kweSMD ekhawulezayo

Izixhobo ezisebenzisa ukutya okuninzi zingafakwa kwiqonga elilinganiselayo lesantya esiphezulu.

Inqanaba 03I-CA2 Wafer kunye nokubekwa kweHybrid

Iidayi ze-wafer ezithe ngqo, ii-flip chips kunye namanyathelo akhethekileyo okubeka izinto ezixutyiweyo agqityiwe.

Ukufaneleka kwesicelo

Iimveliso Ezixhamlayo Kwi-Direct-Wafer kunye Nokubekwa Kwezinto Ezixutyiweyo

I-CA2 ibaluleke kakhulu apho iifomathi ezininzi zezakhi kufuneka zilungelelaniswe ngokuchanekileyo okuphezulu, imveliso ephezulu kunye neerekhodi zezinto ezineenkcukacha.

Iimodyuli zeNkqubo kwiPhakheji

Iiprosesa, imemori, ii-RF ziyafa, ii-IC ezipakishiweyo kunye nee-passives ezidityaniswe kwi-substrate eqhelekileyo.

Iindibano ze-Power Semiconductor

Izixhobo zamandla ziyafa kwaye zixhasa izixhobo ze-SMD ezibekwe kwiindawo ezikhethekileyo zeenkqubo zeemoto kunye nezamandla.

Ukupakishwa kweNqanaba leWafer

Ukubekwa kwedayi ngendlela echanekileyo kunye nemisebenzi yokusebenza kwe-chip-on-wafer efuna ukuphathwa kwe-wafer elawulwayo.

Ukupakishwa kweNqanaba lePhaneli

Iiphaneli ezinkulu kunye nezakhiwo ezifakwe ngaphakathi ezifuna ukuthuthwa ngokuchanekileyo kunye nokubekwa kwamacandelo.

Iimodyuli zeSensor kunye noNxibelelwano

Iimveliso ezidityanisiweyo ezidibanisa i-bare sensing okanye i-RF dies kunye nee-control ICs kunye nezinto ezingasebenziyo.

Iimveliso zePCB ezifakiweyo

Iidayi ezingenanto zifakwe kwizakhiwo eziprintiweyo eziphambili okanye kwizakhiwo eziphucukileyo ezineemfuno ezikhethekileyo zokuphatha.

Inkcazo yoBume

Iindawo ezine ekufuneka zichazwe ngaphambi kokuba ufanise umatshini we-CA2

Ukukhetha okuthembekileyo kuqala ngemveliso kunye nenkqubo ekujoliswe kuyo, kungekuphela nje kwimodeli yomatshini.

Izinto eziphathekayo

Chaza ubukhulu bediyi, ubukhulu, ububanzi be-wafer, ifomathi yemephu ye-wafer, uluhlu lweephakheji ze-SMD, ububanzi beteyiphu kunye nenani leentlobo zidiyi.

Ukuchaneka kunye neziphumo

Qinisekisa ukunyamezelana kokubekwa, ukungqubana okanye ukuphosa ibhola, imveliso yeyure nganye ekujoliswe kuyo, umxube wemveliso kunye notshintsho olulindelekileyo.

Uthutho olungaphantsi komhlaba

Cacisa ubukhulu be-substrate, ubukhulu, i-warpage, uyilo lwenkampani, ukuhamba komzila omnye okanye emibini kunye necala lokulayisha.

Ulawulo lweNkqubo

Chaza iimfuno zokudipha, ukuhlola, ukulandeleka, igumbi lokucoca, unxibelelwano lwefektri kunye neemfuno ezivaliweyo.

Ukuqinisekiswa kwezixhobo

Yintoni Ekufuneka Ihlolwe KwiSIPLACE CA2 Efumanekayo

Oomatshini ababini abanegama elifanayo lemodeli ye-CA2 banokuxhasa iinkqubo ezahlukeneyo. Uqwalaselo olupheleleyo olufakelweyo kufuneka luhlolwe ngaphambi kokuba kukho isicatshulwa, ukufuduswa okanye ucwangciso lomgca.

Ubume bomatshiniUbizo olupheleleyo, inombolo ye-serial, unyaka wokwenziwa, igama kunye nembali yokusebenza.

Iintloko zokubekwaIintloko ze-CP20 ezifakiweyo, iilebheli zeentloko, iiyure zokusebenza, i-nozzle interfaces kunye nolwazi olufumanekayo lokulinganisa.

Iklasi yokuchanekaUbume be-20 µm, 15 µm okanye 10 µm kunye nendawo yokusebenza efanelekileyo.

Izixhobo zeWaferIyunithi yokutshintshiselana nge-wafer, iifreyimu ze-wafer ezixhaswayo, i-ejector, i-buffer, iyunithi yokujika kunye nokukwazi kwe-wafer-map.

Inkqubo yokuhambisaUlungiselelo lwendlela enye, indlela ezimbini, ekhohlo/ekhohlo okanye olukhethekileyo lokuthwalwa kunye ne-substrate.

Iimodyuli zenkquboIyunithi yokuntywila emgceni, ukuva izinto, ukuhlolwa kwedayi, ukuhlolwa ngaphakathi kunye neendlela zokulandelela.

Isoftware kunye neendawo zokunxibelelanaInguqulelo yesoftware efakiweyo, iilayisenisi, i-SECS/GEM, i-CFX, i-HERMES kunye nokudibanisa idatha yemveliso.

Ububanzi boboneleloIzinto zokondla, ii-nozzles, izixhobo ze-wafer, amaxwebhu, iindawo ezingasetyenziswanga, ulwazi lovavanyo kunye nokupakisha kwamanye amazwe.

Inkxaso yezixhobo kunye neenxalenye

Izixhobo Ezinxulumene Neprojekthi ye-CA2

Ukukhethwa komatshini kufuneka kulungelelaniswe nezixhobo zokuphakela ezifunekayo, izixhobo ze-wafer, iintloko zokubeka, ii-nozzles kunye nenkqubo yokupakisha ephucukileyo ejikelezileyo.

Udidi lweZixhobo

Izixhobo zeDie Bonder

Hlola izixhobo ezongezelelweyo ze-semiconductor die-attach kunye nezixhobo zokupakisha eziphambili ukuze ufumane iimfuno ezahlukeneyo zenkqubo.

Hlola iiBonders → Ubonelelo lwezinto

Iziphakeli ze-ASM SIPLACE

Ububanzi beteyiphu yokulinganisa, ubungakanani be-feeder kunye neemfuno zobonelelo lwecandelo kwicala le-SMT lenkqubo.

Jonga ii-ASM feeders → Inkxaso yoQwalaselo

Ukufaniswa koMatshini we-CA2 kunye neenxalenye

Ngenisa inkqubo, i-wafer, idayisi, i-substrate kunye neemfuno zokuchaneka ukuze kuhlolwe umatshini kunye neendawo ezitshintshiweyo.

Xoxa ngeMfuno yakho →

Imibuzo ebuzwa qho

Imibuzo yeNkqubo kunye noQwalaselo lwe-SIPLACE CA2

Iimpendulo zamaqela avavanya umatshini wokubeka i-wafer ngqo, imveliso ye-SiP kunye nokupakishwa okuphucukileyo.

Ingaba i-ASM SIPLACE CA2 ngumatshini we-SMT okanye yi-die bonder?

Ngumatshini wokubeka izinto oxutyiweyo. Udibanisa ukufakwa kwezinto ze-SMT ezisekelwe kwi-feeder kunye ne-direct-from-wafer die attach kunye ne-flip-chip processing, ngoko ke isebenza kuzo zombini iindawo zokwenza.

Kutheni ungasebenzisi umatshini we-SMT oqhelekileyo kwiidayi ezingenanto?

Umatshini we-SMT oqhelekileyo udla ngokulungiswa kwiinxalenye ezibonelelwa kwii-feeders okanye kwiitreyi. Ukucubungula i-wafer ngqo kufuna idatha ye-wafer-map, ukwahlulahlula i-die, imisebenzi ye-ejector kunye ne-flip, i-die buffering, ukuhlolwa okukhethekileyo kunye nokulandeleka kwe-die-level.

Ngaba i-CA2 ingakwazi ukucubungula ii-SMD kunye nee-bare dies kwi-substrate efanayo?

Ewe. Olu buchule bezinto ezixutyiweyo luyinjongo ephambili yeqonga. Ulandelelwano oluchanekileyo luxhomekeke kwii-feeders ezifakiweyo, inkqubo ye-wafer, iintloko zokubeka, iimodyuli zenkqubo kunye nenkqubo yemveliso.

Ngaba i-direct wafer pickup iyayisusa i-die taping?

Ingasusa isidingo sokuguqula iidayi ezifanelekileyo zibe yiteyiphu ngaphambi kokuba zibekwe. Ukuba oku kuyafaneleka na kuxhomekeke kwifomathi ye-wafer, imeko yedayi, idatha eyaziwayo kunye noqwalaselo lokuphathwa kwe-wafer olufakiweyo.

I-CA2 igcina njani isantya xa ukukha kubulawa yi-wafer?

Iqonga lisebenzisa i-die buffering kunye nokulungiselela okulinganayo. Ii-dies zinokususwa kwaye zilungiswe ngelixa intloko yokubeka iqhubeka nokucubungula ezinye izinto, ukunciphisa ukulibaziseka okunxulunyaniswa nokuthathwa kwe-wafer ngqo.

Ingakanani intsebenzo ephezulu yokubekwa kwindawo epapashweyo?

Amaxabiso eqonga elipapashiweyo afikelela kwi-76,000 yeenxalenye ngeyure zokubekwa kwe-SMT, ii-dies ezingama-54,000 ngeyure zokufakwa kwe-die attach ezivela kwi-wafer kunye nee-dies ezingama-51,000 ngeyure zokufakwa kwe-flip-chip. Imveliso yokwenyani ixhomekeke kulwakhiwo lomatshini kunye nemveliso.

Ngaba iseti enye ye-CA2 ingasebenzisa iintlobo ezahlukeneyo ze-wafer?

Ngoqwalaselo olufanelekileyo lokutshintshiselana nge-wafer, iqonga linokuthwala ukuya kuthi ga kwii-wafers ezingama-50 ezahlukeneyo. Oku kuxhasa iimveliso ezidibanisa iintlobo ezahlukeneyo ze-die, kuxhomekeke kwinkqubo ye-wafer efakiweyo kunye nokuseta inkqubo.

Kuthetha ukuthini ukulandeleka kwenqanaba elinye?

Kuthetha ukuba idayisi nganye inokudityaniswa ukusuka kwindawo yayo yokuthatha kwi-source wafer ukuya kwindawo yayo yokugqibela yokubeka kwi-substrate, kunye nedatha efanelekileyo yemveliso kunye nokuhlolwa.

Ngaba i-CA2 ingayitshintsha yonke i-die bond ezinikeleyo?

Hayi. Ii-aplikeshini ezifuna amandla okubopha akhethekileyo, ukufudumeza, ukunyanga, ukusasaza okanye iifomathi zokufa ezingaphandle koluhlu olufakiweyo zisenokufuna izixhobo zokuhlanganisa ze-semiconductor ezizinikeleyo.

Ngaba i-CA2 ingasetyenziswa ne-SIPLACE TX micron?

Ewe. Oomatshini banokucwangciswa kumgca ofanayo wemveliso yeSiP, kunye nokubekwa kwe-feeder ngesantya esiphezulu okanye ngokuchaneka okuphezulu okulungelelaniswe ngokuchaneka ngqo kunye nemisebenzi yokubeka i-hybrid.

Loluphi ulwazi olufunekayo ukuze kuhambelane nomatshini we-CA2 osetyenzisiweyo?

Nika iinkcukacha zedayi kunye ne-wafer, ubukhulu be-substrate, ukuchaneka okufunekayo, uluhlu lwezakhi, imveliso ekujoliswe kuyo, ukhetho lokuhambisa, ukhetho lwenkqubo, iimfuno zokulandelela, imeko yomatshini okhethwayo kunye nendawo oya kuyo.

Vavanya i-SIPLACE CA2 kwiNkqubo yakho yokuPakisha ePhambili

Thumela ifomathi ye-wafer, ubukhulu bedayi, ubungakanani be-substrate, umxube wezinto, injongo yokuchaneka, imveliso elindelekileyo kunye neendlela ezifunekayo zenkqubo yokujonga uqwalaselo.

Cela uHlolo loBume