Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

Why not use a conventional SMT machine for bare dies?

Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability beyond normal feeder-based placement.

Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement, subject to wafer format, die condition, known-good-die data and the installed wafer configuration.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

What is the maximum published placement performance of the SIPLACE CA2?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement.

Can one SIPLACE CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers for multi-die production.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate together with relevant production data.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

What information is needed to match a used SIPLACE CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, machine condition and destination.

Meelaynta Tooska ah ee Wafer-ka ee Baakadaha Sare

ASM SIPLACE CA2Xalka Soo-saarka Die Attach & Flip-Chip

SIPLACE CA2 waxaa loo sameeyay alaabada aan hadda si nadiif ah ugu habboonayn khadka SMT ee caadiga ah ama habka isku xidhka dhimashada oo keliya. Waxay isku daraysaa meelaynta SMD ee ku salaysan quudinta iyo soo qaadashada tooska ah ee meydadka semiconductor-ka ee laga soo qaado wafers-ka la gooyay, taasoo u oggolaanaysa SiP iyo soosaarayaasha baakadaha horumarsan inay maareeyaan qaybaha isku dhafan, ku lifaaqa dhimaha, meelaynta jajabka, kormeerka iyo raad-raaca hal goob wax soo saar oo isku xiran.

Hubi Hab-raaca Ku Habboon Ka wada hadal habaynta CA2

Ilaa 76,000 cphMeelaynta SMT ee Ku-saleysan Quudiyaha

Ilaa 54,000 cphKu lifaaq Die oo ka socda Wafer

Ilaa 51,000 cphFlip-Chip oo ka yimid Wafer

Hoos ilaa 10 µmFasalka Saxnaanta ee 3 Sigma

Dhibaatada Wax Soo Saarka

Sababta SIPLACE CA2 u Jirto

Modules-ka Nidaamka ku jira Xirmada iyo alaabada kale ee elektaroonigga ah ee horumarsan waxay inta badan isku daraan laba qoys oo agab ah oo aad u kala duwan hal substrate: qaybaha caadiga ah ee SMD ee lagu bixiyo giraangiraha, iyo meydadka semiconductor-ka ee aan la baakayn ee lagu bixiyo wafers-ka la gooyay. Wax soo saarka dhaqameedku wuxuu kala soocaa agabkan mashiinka meelaynta SMT iyo xidhmo die ah.

Kala soociddaasi waxay keeni kartaa beddel dheeraad ah oo agab ah, kaydinta dhexe, wareejinta badeecadaha, jawiga barnaamijyada iyo is-dhexgalka raad-raaca. Dhimashadu waxay u baahan kartaa in lagu wareejiyo cajalad ka hor inta aysan gelin hab ku salaysan quudin, halka alaabada isku dhafan ay u kala socdaan qalabka loogu talagalay mabaadi'da wax soo saarka ee kala duwan.

ASM SIPLACE CA2 waa goob meelayn isku dhafan oo loo sameeyay si loo xiro farqigan.Waxay keentaa maaraynta tooska ah ee wafer-ka jawiga wax soo saarka ee ku saleysan SMT, sidaa darteed qaybaha quudinta, hawlaha ku lifaaqan die-ka iyo rogidda-chip-ka ayaa la isku duwi karaa iyada oo loo marayo socodka badeecadaha isku midka ah.

Maxaa isbeddela marka dhimashadu gasho khadka SMT?

Qalabka la yaqaan ee la yaqaan waxaa si toos ah looga soo xulan karaa macluumaadka khariidadda wafer-ka.
SMD-yada quudiya iyo meydadka wafer-ka la keeno ayaa lagu dhejin karaa isla substrate-ka.
Diyaarinta iyo meelaynta meydka waxaa lagu barbar dhigi karaa iyada oo loo marayo kaydinta.
Dhinac kasta waxaa laga xiri karaa booska wafer-kiisa ilaa booska ugu dambeeya ee substrate-ka.
Is-dhexgalka isgaarsiinta SMT iyo semiconductor-ka ayaa ka qayb qaadan kara hal socod warshadeed oo isku xiran.

Go'aanka Habka

Goorma ayay SIPLACE CA2 macno samaynaysaa?

Codsiyada ugu xooggan ee CA2 laguma qeexo hal magac oo xirmo ah. Waxaa lagu qeexaa isku-darka isha agabka, taxanaha habka, saxnaanta, raad-raaca iyo mugga wax soo saarka.

✓

Ku habboon CA2 oo xooggan

Alaab isku mid ah waxay isticmaashaa labadaba SMD-yada quudinta iyo kuwa aan lahayn.
Diisha waa in si toos ah looga soo qaataa hal ama dhowr wafer oo la jarjaray.
Wax soo saarku wuxuu ka kooban yahay isku-xidhka diet attach, flip chip ama labada hab-raac.
Noocyo badan oo la jarjaray waa in la beddelaa iyada oo aan la isticmaalin gacan-ku-hayn ballaaran.
Meelayntu waxay u baahan tahay fasallo sax ah oo 20 µm, 15 µm ama 10 µm ah.
Raad-raac shaqsiyeed ayaa looga baahan yahay laga bilaabo wafer ilaa badeecad dhammaystiran.
Soo-saaruhu wuxuu rabaa inuu yareeyo cajaladda la duubay iyo saadka walxaha la xiriira.
Khadku waa inuu ku xidhmaa nidaamyada warshadda SMT iyo semiconductor-ka.

Waxay u baahan tahay Dib-u-eegis Dheeraad ah oo Hawsha ah

Hawshu waxay u baahan tahay kuleyl gaar ah, bogsiin ama xoog isku xidhnaan sare leh.
Cabbirrada ama dhumucda dhimashadu waxay ka baxsan yihiin heerka maaraynta ee la rakibay.
Badeecadu waxay u baahan tahay hawlo qaybinta ama isku xidhka oo aan lagu rakibin mashiinka.
Substrate-ku wuxuu u baahan yahay qaab qaadis ama qaab qaadis ah oo aan ku jirin qaabeynta.
Mugga wax soo saarku aad ayuu u hooseeyaa si loo caddeeyo madal isku dhafan oo xawaare sare leh.
Socodka warshadda ee jira waxa uu ku dhisan yahay unugyada madaxa-bannaan ee isku xidha dhimashada.
Kormeerka ama hab-raaca loo baahan yahay waa in lagu sameeyaa qalab gaar ah oo takhasus leh.
Mashiinka la isticmaalay ee la heli karo ma laha wafer-ka lagama maarmaanka ah, madaxa ama fursadaha software-ka.

Naqshadeynta Mashiinka

Shan Nidaam oo Qeexa Awoodda Habka CA2

Magaca moodeelka ayaa tilmaamaya goobta, laakiin nidaamyadan la rakibay waxay go'aamiyaan sida mashiin shaqsi ah uu dhab ahaantii u farsameyn karo wafers-ka, qaybaha iyo substrates-ka.

01 / GELITAANKA ALAABTA

Quudiyeyaasha SMT iyo Saxannada

Quudiyeyaasha la jaanqaadaya waxay bixiyaan qalab aan firfircoonayn iyo semiconductors-ka la baakadeeyay, halka xulashooyinka saxaaradda iyo side-ka la xushay ay taageeraan qaabab dheeraad ah oo ka kooban.

02 / MAAMULKA WAFER

Nidaamka Sarrifka Wafer

Nidaamka waferku wuxuu kaydiyaa oo soo bandhigaa noocyo badan oo wafer ah, taasoo suurtogalinaysa alaabada ay ku jiraan dhowr nooc oo wafer ah oo kala duwan.

03 / HABKA ISKU BARBARDHIGGA

Kaydinta

Kala soocidda iyo diyaarinta ayaa si barbar socda u socon kara meelaynta, taasoo yaraynaysa ganaaxa xawaaraha ee sida caadiga ah lala xiriiriyo qaadista tooska ah ee wafer-ka.

04 / MEELAYNTA

Qaabeynta Madaxa CP20

Madaxyada xawaaraha sare leh waxay qabtaan qaybo yaryar oo xasaasi ah oo leh soo qaadis aan taabasho lahayn, meelayn la xakameeyey iyo fasallo sax ah oo ilaa 10 µm ah.

05 / XAKAMEYNTA HABKA

Kormeerka iyo Dabagalka

Dareen-celinta qaybaha, hubinta xaaladaha dhimashada, kormeerka hoos u dhaca iyo xogta wax soo saarka waxay taageeraan diiwaannada wax soo saarka ee deggan iyo heerka dhimashada.

Socodka Isku-dhafka Isku-dhafan

Sidee Badeecada Isku-dhafka ah ee SMD iyo Bare-Die ugu Gudubtaa CA2

Taxanaha saxda ah wuxuu ku beddelaa badeecada, laakiin habku wuxuu caadi ahaan isku xiraa aqoonsiga agabka, maaraynta wafer-ka tooska ah, meelaynta saxda ah iyo diiwaannada wax soo saarka.

Soo rar Xogta Alaabta

Barnaamijyada substrate-ka, xogta qaybaha, khariidadaha wafer-ka, xuduudaha habka iyo shuruudaha raad-raaca ayaa la diyaariyey.

Diyaari Agabka

Qalabka SMD, saxaaradaha, buskudka, qaababka buskudka, buskudka iyo walxaha quusitaanka ayaa loo qoondeeyay dejinta wax soo saarka.

Xullo Qalabka La Yaqaano-Good

Nidaamka waferku wuxuu aqoonsadaa waferka loo baahan yahay wuxuuna adeegsadaa xogta khariidadda si uu u doorto nalalka la isticmaali karo ee badeecada.

Kaydka iyo Orient wuu dhintaa

Qalabka korontada waa la kala saaraa, la kormeeraa, la kaydiyaa oo la rogaa marka qalabka la isku xidho oo loo baahdo in la isku xidho wejiga hoos.

Dhig Qaybaha Isku Dhafan

Qaybaha quudinta iyo meydadka wafer-ka waxaa la dhigayaa iyadoo la adeegsanayo SMT-ga la qeexay, die-attach, flip-chip ama taxanaha quusitaanka.

Xogta Habka Diiwaanka

Isha laga soo qaadayo, natiijada kormeerka iyo booska meelaynta kama dambaysta ah waxaa lagu xiri karaa qoraalka iyo diiwaanka wax soo saarka.

Xogta Madal ee la daabacay

Tilmaamaha Farsamada ee ASM SIPLACE CA2

Qiimayaasha la daabacay waxay qeexayaan awoodda madal CA2 ee la heli karo. Waxqabadka dhabta ah wuxuu ku xiran yahay madaxa la rakibay, xirmada saxnaanta, modules-ka wafer-ka, gudbiyaha, isku darka qaybaha iyo xulashooyinka habka.

Shayga Farsamada	Awoodda La Daabacay	Sababta ay Muhiim u tahay
Xawaaraha meelaynta SMT	Ilaa 76,000 oo qaybood saacaddii	Waxay taageertaa meelaynta mugga sare ee walxaha aan la isticmaalin ee quudiyaha la keeno iyo qaybaha la baakadeeyay.
Die ku lifaaq wafer ka soo qaad	Ilaa 54,000 oo qof ayaa saacaddii u dhinta cudurka	Waxay awood u siineysaa meelaynta wejiga tooska ah ee wafer-ka iyada oo aan la isticmaalin habka duubista dhexe.
Meelaynta jajabka ee laga soo qaaday wafer-ka	Ilaa 51,000 oo qof ayaa saacaddii u dhinta cudurka	Waxay taageertaa meelaynta xawaaraha sare ee dhimaha iyadoo dhinaca isku xirka uu wajahayo substrate-ka.
Fasallada saxnaanta	20 µm, 15 µm iyo 10 µm marka la eego 3 calaamadood	Waxay u oggolaanaysaa isku-dubaridka habka cabbirrada kala duwan ee dhimaha, boodhadhka, dhexroorka kubadda iyo dulqaadka substrate-ka.
Awoodda Wafer-ka	Ilaa 50 nooc oo kala duwan oo ah buskud	Waxay bixisaa awood badan oo loogu talagalay alaabada ay ku jiraan dhowr hawlood oo semiconductor ah.
Beddelka Wafer-ka	Wax ka yar 13 ilbiriqsi	Waxay yareysaa dib u dhaca isbeddelka walxaha ee alaabada isku bedbeddela ilaha wafer-ka badan.
Qaab substrate-ka hal-jid ah	Ilaa 620 × 700 mm, waxay ku xiran tahay qaabaynta	Waxay taageertaa guddiyada, PCB-yada ku dhex jira iyo substrate-yada waaweyn ee gaarka ah.
Qaab substrate laba-geesood ah	Ilaa 375 × 260 mm qaabka caadiga ah ee la sheegay	Waxay taageertaa gaadiidka barbar socda ee PCB-yada caadiga ah iyo substrates-ka SiP.
Cabbirka mashiinka	Qiyaastii 2.56 × 2.50 × 1.85 m	Waxay bixisaa saldhig loogu talagalay qorsheynta dabaqa, nadiifinta marin-u-helka iyo dib-u-eegista qaab-dhismeedka khadka.
Is-dhexgalka isgaarsiinta	IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 iyo SECS/GEM	Wuxuu mashiinka ku xiraa nidaamyada xakamaynta khadka SMT iyo warshadaha semiconductor-ka.
Deegaanka wax soo saarka	Iswaafajinta qolka nadiifinta ee fasalka 7aad iyo taageerada SEMI S2/S8	Waxay taageertaa meelaynta meelaha la xakameeyey ee baakadaha horumarsan iyo wax soo saarka semiconductor-ka.

Mashiinka la bixiyay waa in lagu hubiyaa calaamadda magaciisa, madaxyada la rakibay, heerka saxnaanta, nidaamka wafer-ka, habaynta gudbiyaha, shatiyada software-ka iyo modules-ka habka. Ugu badnaan madalku si toos ah uma qeexayo cutub kasta oo shaqsiyeed.

Saxnaanta iyo Gaadiidka

Isbeddellada Cabbirka Substrate-ka iyadoo la adeegsanayo Fasalka Saxnaanta Loo Baahan Yahay

Qaabka ugu weyn ee la taageerayo iyo saxnaanta ugu adag had iyo jeer lagama heli karo isla goobta shaqada. Xiriirkan waa in dib loo eegaa ka hor inta aan la dooran mashiin.

Qaab-dhismeedka / Habka Shaqada	Fasalka Saxnaanta	Qaabka Substrate-ka ee la daabacay	Barta Dib u Eegista Caadiga ah
Qaade hal haad ah	20 µm @ 3 calaamadood	Ilaa 620 × 700 mm	Guddiyo waaweyn iyo qaabab loox ah oo ku dhex jira.
Qaade hal haad ah	15 µm @ 3 calaamadood	Ilaa 620 × 700 mm	Qaab weyn oo leh shuruudaha meelaynta oo adag.
Qaabka afargeeska hal-haad	12 µm @ 3 calaamadood	Ilaa 620 × 700 mm, oo lagu qiimeeyay rubuc 300 × 300 mm	Xaqiiji qaab-dhismeedka badeecada marka loo eego goobta shaqada ee u qalanta.
Qaade hal haad ah	10 µm @ 3 calaamadood	Ilaa 300 × 300 mm	SiP sax ah oo heer sare ah iyo codsiyo si adag u kala fog.
Qaade laba-geesood ah	20 µm @ 3 calaamadood	Ilaa 375 × 260 mm	Wax soo saarka PCB ama SiP ee heerka is barbar socda.
Qaab hal-haad ah oo labanlaab ah	20 µm @ 3 calaamadood	Ilaa 375 × 430 mm	Qaab la dheereeyay iyadoo la adeegsanayo madal laba-gudbiye ah.
Qaade laba-geesood ah	15 µm ama 10 µm @ 3 calaamadood	Ilaa 250 × 100 mm	Substrate-yada yaryar ee u baahan fasalka saxnaanta adag.

Isbarbardhigga Wadada Wax Soo Saarka

Saddex Siyaabood oo lagu soo ururiyo Badeeco Isku-dhafan oo SMD ah iyo Bare-Die ah

CA2 waa hal qaab-dhismeed wax soo saar oo suurtagal ah. Wadada ugu wanaagsan waxay ku xiran tahay kakanaanta badeecada, mugga, qalabka jira iyo hawlaha habka loo baahan yahay.

Wadada A

Kala sooc Unugyada SMT iyo kuwa Die-Bonding

Qaybaha baakadaysan iyo meydadka qaawan waxaa lagu farsameeyaa goobaha qalabka ee madaxa-bannaan.

Waxtar leh marka hawlaha takhasuska leh ee isku xidhka dhimashadu ay xukumaan
Waxay u oggolaanaysaa hagaajinta qalabka madaxa-bannaan
Waxay u baahan tahay wareejin iyo raad-raac nidaam-isdhaafsi ah
Waxay u baahan kartaa meel bannaan oo dheeraad ah iyo maareyn dhexdhexaad ah

Wadada B

Cajalad ku dheji Qalabka loogu talagalay Meelaynta SMT

Qalabka bareegga ah waxaa loo beddelaa qaab cajalad ah oo ku habboon quudinta ka hor inta aan la isku darin.

Wuxuu adeegsadaa qulqulka walxaha ku salaysan quudinta ee la yaqaan
Waxay ku dartaa duubista, kaydinta iyo hawlgallada xakamaynta tayada
Waxay abuurtaa shuruudaha walxaha side iyo qashin-qubka
Waxay xaddidi kartaa dabacsanaanta marka noocyo badan oo dhimasho ah ay ku lug leeyihiin

Wadada C

Meelaynta Isku-dhafka ah ee Tooska ah ee Wafer

CA2 waxay ka shaqeysaa SMD-yada quudinta waxayna si toos ah uga dhimataa wafers-ka hal goob oo isku xiran.

Waxay yareysaa beddelka meydka iyo maaraynta dhexdhexaadka ah
Waxay taageertaa wax soo saarka multi-wafer iyo multi-die
Waxay isku xirtaa diiwaanka meydka boosaska ugu dambeeya ee meelaynta
Waxay u baahan tahay wafer-ka saxda ah, madaxa iyo habaynta habka

Naqshadeynta Khadka Wax-soo-saarka

CA2 waxay u shaqayn kartaa sidii Xarunta Hawsha Isku-dhafka ah ee Khadka SiP

Soo saarista SiP ee mugga sare leh, CA2 waxaa lagu dari karaa SIPLACE TX micron ama qalab kale oo khadka ku habboon. Meelaynta quudinta xawaaraha sare leh, habaynta tooska ah iyo kormeerka ayaa markaa lagu dheellitiri karaa mashiinnada isku xiran halkii lagu qasbi lahaa hawlgal kasta hal saldhig.

Marxaladda 01aadDaabacaadda ama Codsiga Qalabka

Koolada alxanka, dhejiska ama qulqulka ayaa la mariyaa oo la kormeeraa iyadoo loo eegayo habka loo marayo.

Marxaladda 02aadMeelaynta SMD-ga Xawaaraha Sare leh

Qaybaha quudinta ee xoogga leh waxaa lagu dhejin karaa goob xawaare sare leh oo dheellitiran.

Marxaladda 03aadMeelaynta Ca2 Wafer iyo Isku-dhafka ah

Tallaabooyinka loogu talagalay in lagu sameeyo walxaha tooska ah ee wafer-ka, jajabyada rogrogmada iyo tallaabooyinka meelaynta isku dhafan ee gaarka ah ayaa la dhammaystiray.

Ku Habboon Codsiga

Alaabooyinka ka faa'iidaysta meelaynta Tooska ah iyo Qaybaha Isku-dhafan

CA2 waa kan ugu qiimaha badan halkaas oo qaabab badan oo ka kooban ay tahay in la isku duwo saxnaan sare, wax soo saar sare iyo diiwaanno agab oo faahfaahsan.

Qaybaha Nidaamka-ku-jira Xidhmada

Processor-rada, xusuusta, RF dies, IC-yada la xirxiray iyo kuwa aan firfircoonayn ee lagu soo ururiyay substrate isku dhafan oo caadi ah.

Isku-duwayaasha Korontada ee Semiconductor-ka

Qalabka korontada iyo qaybaha taageerada SMD ee lagu dhejiyay substrate gaar ah oo loogu talagalay nidaamyada baabuurta iyo tamarta.

Baakadda Heerka Wafer-ka

Meelaynta saxda ah ee maaskarada iyo socodka shaqada ee jajab-ku-samaynta ee u baahan maaraynta wafer-ka la xakameeyey.

Baakadaha Heerka-Gudiga

Guddiyo qaab-dhismeed weyn leh iyo qaab-dhismeedyo ku dhex jira oo u baahan gaadiid sax ah iyo meelayn qaybaha ah.

Qalabka Dareemaha iyo Isgaarsiinta

Alaabooyin is haysta oo isku daraya dareemaha qaawan ama RF dials oo leh ICs kontorool iyo qaybo aan firfircoonayn.

Products PCB-ga la geliyay

Qalabka Bare ee lagu dhex daray ama lagu daray dhismayaasha wareegga daabacan ee horumarsan oo leh shuruudo gaar ah oo maaraynta.

Qeexitaanka Qaabeynta

Afar Meelood oo la Cayimi Kahor Inta aan la Isku Waafajin Mashiinka CA2

Xulasho la isku halleyn karo waxay ka bilaabataa badeecada iyo habka loogu talagalay, ma aha oo kaliya qaabka mashiinka.

Qalabka

Qeex cabbirrada dhididka, dhumucda, dhexroorka dhididka, qaabka dhididka-khariidadda, baaxadda xirmada SMD, ballaca cajaladda iyo tirada noocyada dhididka.

Saxnaanta iyo Wax Soo Saarka

Xaqiiji dulqaadka meelaynta, garaaca ama garaaca kubadda, wax soo saarka saacadlaha ah ee bartilmaameedka ah, isku darka badeecada iyo inta jeer ee la filayo in la beddelo.

Gaadiidka dhulka hoostiisa mara

Qeex cabbirrada substrate-ka, dhumucda, warpage-ka, naqshadda side-ka, socodka hal-haad ama laba-geesoodka ah iyo jihada rarista.

Xakamaynta Habka

Qeex shuruudaha quusitaanka, kormeerka, raad-raaca, qolka nadiifka ah, isgaarsiinta warshadda iyo wareegga xiran.

Xaqiijinta Qalabka

Maxaa Loo Baahan Yahay In Laga Hubiyo SIPLACE CA2 La Heli Karo

Laba mashiin oo wata magaca moodeelka CA2 oo isku mid ah ayaa taageeri kara habab kala duwan. Qaabeynta dhameystiran ee la rakibay waa in dib loo eegaa ka hor inta aan la soo xigan, la rarin ama la qorsheynin xariiqda.

Aqoonsiga mashiinkaMagacaabidda oo dhammaystiran, lambarka taxanaha ah, sanadka wax soo saarka, calaamadda magaca iyo taariikhda hawlgalka.

Madaxyada meelayntaMadaxyada CP20, calaamadaha madaxa, saacadaha shaqada, is-dhexgalka afka iyo macluumaadka cabbiraadda ee la heli karo.

Fasalka saxnaantaQaabeynta 20 µm, 15 µm ama 10 µm iyo aagga shaqada ee u qalma.

Qalabka Wafer-kaQaybta beddelka Wafer, qaababka wafer ee la taageerayo, ejector-ka, kaydka, cutubka rogrogmada iyo awoodda khariidadda wafer-ka.

Nidaamka GudbintaHal-haad, laba-haad, bidix-gal/bidix ama habayn gaar ah oo side iyo substrate ah.

Modules-ka hab-raacaQalabka quusitaanka toosan, dareemaha qaybaha, kormeerka dhimaha, kormeerka saaran iyo xulashooyinka raadraaca.

Software-ka iyo interface-kaNooca software-ka ee la rakibay, shatiyada, SECS/GEM, CFX, HERMES iyo isdhexgalka xogta wax soo saarka.

Baaxadda sahaydaQuudiyeyaasha, af-xidhka, agabka buskudka, dukumentiyada, qaybaha dayactirka, macluumaadka tijaabada iyo baakadaha dhoofinta.

Qalabka iyo Taageerada Qaybaha

Kheyraadka Qalabka La Xiriira ee Mashruuca CA2

Xulashada mashiinka waa in lala jaanqaadaa quudiyeyaasha loo baahan yahay, qalabka wafer-ka, madaxyada meelaynta, af-xidhka iyo habka baakadaynta horumarsan ee ku xeeran.

Qaybta Qalabka

Qalabka Bonder Die

Dib u eeg qalabka dheeraadka ah ee semiconductor-ka iyo baakadaha horumarsan ee shuruudaha kala duwan ee habka.

Sahamin Bonders-ka → Sahayda Agabka

Quudiyeyaasha ASM SIPLACE

Ballaca cajaladda isku dheelitiran, tirada quudiyaha iyo shuruudaha sahayda qaybaha ee dhinaca SMT ee habka.

Eeg Quudiyeyaasha ASM → Taageerada Habaynta

Isku-xidhka Mashiinka CA2 iyo Qaybaha

Soo gudbi shuruudaha habka, wafer-ka, maydka, substrate-ka iyo saxnaanta dib u eegista mashiinnada iyo qaybaha beddelka ah.

Ka hadal Shuruudahaaga →

Su'aalaha Inta Badan La Isweydiiyo

Su'aalaha Habka iyo Habaynta SIPLACE CA2

Jawaabaha kooxaha qiimeynaya mashiinka si loogu meeleeyo wafer-ka tooska ah, wax soo saarka SiP iyo baakadaha horumarsan.

Ma ASM SIPLACE CA2 waa mashiin SMT ah mise waa qalab lagu xiro qalabka?

Waa mashiin meelayn isku dhafan. Waxay isku daraysaa meelaynta qaybaha SMT ee ku salaysan quudinta iyo habka loo yaqaan 'sprint-from-chip processing', sidaas darteed waxay ka shaqeysaa labada deegaan ee wax soo saarka.

Maxaad u isticmaali weyday mashiinka SMT ee caadiga ah ee loogu talagalay meydadka qaawan?

Mashiinka SMT ee caadiga ah waxaa caadi ahaan loo habeeyaa qaybaha lagu bixiyo quudinta ama saxaaradaha. Hagaajinta wafer-ka tooska ah waxay u baahan tahay xogta khariidadda wafer-ka, kala-soocidda maydka, hawlaha ejector-ka iyo rogrogmada, kaydinta maydka, kormeerka gaarka ah iyo raad-raaca heerka maydka.

CA2 ma farsamayn kartaa SMD-yada iyo meydadka qaawan ee isku substrate-ka ah?

Haa. Awooddan isku dhafan ee walxaha waa ujeedo muhiim ah oo loogu talagalay madal. Taxanaha saxda ah wuxuu ku xiran yahay quudiyeyaasha la rakibay, nidaamka wafer-ka, madaxyada meelaynta, modules-ka habka iyo barnaamijka wax soo saarka.

Soo qaadista tooska ah ee wafer ma baabi'isaa dhejiska la duubay?

Waxay meesha ka saari kartaa baahida loo qabo in loo beddelo maydka ku habboon cajalad ka hor inta aan la dhigin. Haddii ay tani ku habboon tahay waxay ku xiran tahay qaabka maydka, xaaladda maydka, xogta la yaqaan ee wanaagsan iyo habaynta maaraynta maydka ee la rakibay.

Sidee ayay CA2 u ilaalisaa xawaaraha marka la soo qaadayo meydadka ka soo baxaya wafer?

Madalku wuxuu isticmaalaa kaydinta iyo diyaarinta barbar socota. Qalabka la kala saari karo oo la diyaarin karo inta madaxa meelaynta uu sii wado farsamaynta qaybaha kale, taasoo yaraynaysa dib u dhaca la xiriira soo qaadista wafer-ka tooska ah.

Waa maxay waxqabadka ugu badan ee meelaynta la daabacay?

Qiimaha madal ee la daabacay wuxuu gaarayaa ilaa 76,000 oo qaybood saacaddii meelaynta SMT, 54,000 oo dhimasho saacaddii qalabka lagu lifaaqo ee laga helo wafer iyo 51,000 dhimasho saacaddii meelaynta jajabka. Wax soo saarka dhabta ahi wuxuu ku xiran yahay habaynta mashiinka iyo badeecada.

Hal hab oo CA2 ah ma isticmaali karaa noocyo kala duwan oo wafer ah?

Iyada oo la adeegsanayo habaynta isweydaarsiga wafer-ka ee khuseeya, madalku waxay qaadi kartaa ilaa 50 wafer oo kala duwan. Tani waxay taageertaa alaabada isku daraysa noocyo kala duwan oo diafe ah, iyadoo ku xiran nidaamka wafer-ka ee la rakibay iyo dejinta barnaamijka.

Maxay ka dhigan tahay raad-raac heer-hal-dhimis ah?

Waxay la macno tahay in qofka la shito laga xiriirin karo booska uu ka soo qaadayo wafer-ka isha ilaa booska ugu dambeeya ee uu ku yaal substrate-ka, oo ay weheliso xogta wax soo saarka iyo kormeerka ee khuseeya.

CA2 ma beddeli kartaa bonder kasta oo u heellan?

Maya. Codsiyada u baahan xoog gaar ah oo isku xidhka, kulaylinta, bogsashada, qaybinta ama qaababka dhimaha ee ka baxsan xadka la rakibay ayaa wali u baahan kara qalab isu-imaatinka semiconductor-ka ee gaarka ah.

CA2 ma loo isticmaali karaa micron SIPLACE TX ah?

Haa. Mashiinnada waxaa lagu habeyn karaa isla khadka wax soo saarka SiP, iyadoo la adeegsanayo meelaynta quudinta xawaaraha sare ama saxnaanta sare leh oo dheellitiran marka loo eego hawlgallada tooska ah ee wafer-ka iyo meelaynta isku-dhafka ah.

Macluumaadkee ayaa loo baahan yahay si loogu waafajiyo mashiinka CA2 ee la isticmaalay?

Bixi qeexitaannada dhimaha iyo wafer-ka, cabbirrada substrate-ka, saxnaanta loo baahan yahay, baaxadda qaybaha, wax soo saarka bartilmaameedka, doorbidka gudbiyaha, xulashooyinka habka, shuruudaha raad-raaca, xaaladda mashiinka la doorbidayo iyo meesha loo socdo.

Qiimee SIPLACE CA2 Habkaaga Baakadaha Sare

Soo dir qaabka wafer-ka, cabbirrada dhimaha, cabbirka substrate-ka, isku darka qaybaha, bartilmaameedka saxnaanta, wax soo saarka la filayo iyo xulashooyinka habka loo baahan yahay si loo eego dib u eegista qaabeynta.

Codso Dib u Eegista Qaabeynta