Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

Why not use a conventional SMT machine for bare dies?

Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability beyond normal feeder-based placement.

Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement, subject to wafer format, die condition, known-good-die data and the installed wafer configuration.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

What is the maximum published placement performance of the SIPLACE CA2?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement.

Can one SIPLACE CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers for multi-die production.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate together with relevant production data.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

What information is needed to match a used SIPLACE CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, machine condition and destination.

Paakeejii Sadarkaa Ol’aanaaf Kallatti-Wafer Kaa’uu

ASM SIPLACE CA2Furmaata Omishaa Die Attach & Flip-Chip

SIPLACE CA2 oomishaalee kana booda sarara SMT barame ykn adeemsa of danda’ee die-bonding keessatti qulqullinaan hin galleef kan hojjetamedha. Innis feeder-based SMD placement fi kallattiin semiconducctor dies sawn wafers irraa fudhachuu waliin walitti fida, SiP fi oomishtoonni advanced-packaging qaamolee walmakaa, die attach, flip-chip placement, inspection fi traceability waltajjii oomishaa walitti hidhame tokko keessatti akka bulchan taasisa.

Adeemsa Walsimsiisu ilaali Qindeessituu CA2 tokko irratti mari'adhaa

Hanga 76,000 cphIddoo SMT Nyaachisaa irratti Hundaa’e

Hanga 54,000 cphDie Attach Wafer irraa

Hanga 51,000 cphFlip-Chip kan Wafer irraa argame

Gara 10 μm gadi bu’aGitaa Sirrummaa 3 Sigma irratti

Rakkoo Omishaa

SIPLACE CA2 Maaliif Jira

Moojuloonni Sirna-Paakeejii keessaa fi oomishaaleen elektirooniksii sadarkaa olaanaa qaban biroo yeroo baay’ee maatii meeshaalee baay’ee adda ta’an lama substrate tokko irratti walitti fidu: qaamolee SMD barame kanneen reelii keessatti dhiyaatan, fi daayiwwan semiikondaaktarii hin paakeejii ta’an kanneen weefroota sawn irratti dhihaatan. Omishni aadaa meeshaalee kana maashinii SMT kaa’uu fi die bonder gidduutti addaan baasa.

Addaan bahuun sun jijjiirraa meeshaa dabalataa, kuusaa gidduugaleessaa, dabarsuu oomishaa, naannoo sagantaa fi walqunnamtii hordoffii fiduu danda’a. Bare dies adeemsa nyaachisaa irratti hundaa’e seenuu isaanii dura gara teeppiitti dabarfamuu barbaachisuu danda’a, oomishoonni walmakaa ammoo meeshaalee naannoo seera oomishaa adda addaatti dizaayiniin hojjetaman gidduutti socho’u.

ASM SIPLACE CA2 waltajjii iddoo walmakaa qaawwa kana cufuuf uumame dha.Innis qabannaa daayi kallattii-wafer gara naannoo oomishaa SMT-oriented fida, kanaaf qaamolee nyaataa, hojiiwwan daayi attach fi flip-chip naannoo dhangala’aa oomishaa walfakkaataa qindoomina qabaachuu danda’u.

Yeroo daayiin sarara SMT seenu maaltu jijjiirama?

Daayiin gaariin beekamaan kallattiin odeeffannoo wafer-map irraa filatamuu danda’a.
SMDn nyaachisaan dhihaataniifi daayiin weeferiin dhihaatu substrate tokko irratti kaa’amuu danda’a.
Qophii fi kaa’iinsi daayi karaa buffering parallelized ta’uu danda’a.
Tokkoon tokkoon daayi bakka weefarii isaa irraa gara bakka sabsteeretii isaa isa dhumaa walitti hidhamuu danda’a.
Interfeesoonni qunnamtii SMT fi semiconductor dhangala’aa warshaa tokko walitti hidhame keessatti hirmaachuu danda’u.

Murtee Adeemsaa

SIPLACE CA2 Yoom Hiika Qaba?

Appilikeeshiniiwwan CA2 ciccimoon maqaa paakeejii tokkoon hin ibsaman. Isaanis walitti makamuu madda meeshaa, tartiiba adeemsaa, sirrii ta’uu, hordofamuu fi baay’ina oomishaatiin ibsama.

✓

CA2 Fit cimaa

Omishni walfakkaataan SMD feeder-supplied fi bare dies lamaan fayyadama.
Daayiin kallattiin wafer sawn tokko ykn hedduu irraa fudhatamuu qaba.
Omishni die attach, flip chip ykn adeemsa lamaan of keessatti qabata.
Gosoonni daayi hedduu osoo harkaan bal’inaan hin qabatin jijjiiramuu qabu.
Kaa’uun gita sirrii ta’uu 20 μm, 15 μm ykn 10 μm barbaada.
Wafer irraa kaasee hanga oomisha xumurameetti hordoffiin daayi dhuunfaa barbaachisaadha.
Oomishtoonni kun daayi teeppii fi loojistikii meeshaalee kanaan walqabatan hir’isuu barbaadu.
Sararri kun sirna warshaa SMT fi semiconductor waliin walqabsiisuu qaba.

Irra Deebiin Adeemsa Dabalataa Barbaachisa

Adeemsi kun humna hoo’isuu addaa, fayyisuu ykn humna walitti hidhamiinsa olaanaa barbaada.
Dimshaashumatti ykn furdinni daayii daangaa qabannaa dhaabameen ala ni kufa.
Omishni kun dalagaalee kennuu ykn walitti hidhamiinsa maashinicha irratti hin fe’amne barbaada.
Substrate carrier ykn haala geejjibaa qindeessaa keessatti hin hammatamne barbaada.
Haalli oomishaa baay’ee gadi aanaa waan ta’eef waltajjii saffisa olaanaa walitti makame mirkaneessuuf.
Dhangala’aan warshaa jiru naannoo seelii of danda’e die-bonding irratti ijaarame.
Inspeekshiniin ykn meetrooloojiin barbaachisu meeshaalee ispeeshaalistii adda addaa irratti raawwatamuu qaba.
Maashiniin fayyadame jiru filannoo wafer, head ykn software barbaachisaa hin qabu.

Arkiteekcharii Maashinii

Sirnoota Shan Dandeettii Adeemsa CA2 Ibsan

Maqaan moodeela waltajjii adda baasa, garuu sirnoonni fe’aman kun akkaataa maashiniin dhuunfaa tokko qabatamaan wafers, components fi substrates adeemsisuu danda’u murteessu.

01 / GALTEE MEESHALEE

Nyaataa fi Saanii SMT

Nyaachiftoonni walsimsiisan dabarsoowwanii fi semiikondaaktaroota paakeejii ta'an kan dhiyeessan yoo ta'u, filannoowwan saanii fi geejjibaa filataman bifa qaama dabalataa ni deeggaru.

02 / WAFER HANDLING

Sirna Jijjiirraa Wafer

Sirni weefarii gosoota weefer hedduu kuusaa fi dhiheessa, oomishaalee bare dies adda addaa hedduu of keessaa qaban dandeessisa.

03 / Adeemsa PARALLEL

Kan Buffering jedhamu

Daayi addaan baasuu fi qopheessuun bakka kaa’uu wajjin walfaana fiiguu danda’a, kunis adabbii saffisa yeroo idilee kallattiin weefar fudhachuu wajjin walqabatu hir’isa.

04 / DHAABBATA

CP20 Qindeessituu Mataa

Mataan saffisa guddaa qabu qaamolee xixiqqoo fi miira namaa kakaasan kan qabatu yoo ta’u, tuqa malee fudhachuu, kaa’uu to’atamee fi gita sirrii ta’uu hanga 10 μm gadi bu’a.

05 / TO'ANNOO ADDUMMAA

Inspeekshinii fi Hordoffii

Component sensing, die-condition checks, dipping inspection fi daataa oomishaa galmee oomisha tasgabbaa’aa fi sadarkaa die ni deeggara.

Dhangala’aa Yaa’ii Walmakaa

Akkaataa Omishni SMD fi Bare-Die Walmakaa CA2 Keessa Socho'u

Tartiiba sirrii oomishaan ni jijjiirama, garuu adeemsichi akka idileetti adda baasuu meeshaa, kallattiin weefar qabachuu, sirritti kaa’uu fi galmee oomishaa walqabsiisa.

Daataa Omishaa Fe'uu

Sagantaawwan substrate, daataa kompaawundii, kaartaa weefar, paaraameetota adeemsaa fi barbaachisoo hordoffii ni qophaa’u.

Meeshaalee Qopheessuu

SMD reels, trays, wafers, wafer frames, nozzles fi meeshaaleen cuuphaa setup oomishaa irratti ramadamu.

Du'a Beekamaa-Gaarii filadhu

Sirni weefarii weefar barbaachisu adda baasuun daataa kaartaa fayyadamuun oomishaaf daayii fayyadamuu danda’an filata.

Buffer fi Orient Du'a

Daayiin yeroo walgahiin walqunnamtii fuula gadi barbaadutti addaan baafamu, sakatta’amu, buffered fi garagalfama.

Qaamolee Walmakaa Kaa'i

Qaamonni nyaataa fi daayi weefer tartiiba SMT, daayi-attach, flip-chip ykn dipping ibsame fayyadamuun kaa’amu.

Daataa Adeemsa Galchuu

Maddi fudhannaa, bu’aan inspeekshinii fi bakki kaa’uu dhumaa galmee substrate fi oomishaa wajjin walqabsiisuu ni danda’ama.

Daataa Waltajjii Maxxanfame

ASM SIPLACE CA2 Ijaarsa Teeknikaa

Gatiin maxxanfame dandeettii waltajjii CA2 jiru ibsu. Raawwiin qabatamaan tuuta mataa fe’ame, paakeejii sirrii, moojuulota weefar, konveyeerii, makaa qaamaa fi filannoowwan adeemsaa irratti hundaa’a.

Meeshaa Teeknikaa	Dandeettii Maxxanfame	Maaliif Barbaachisaa Ta'a
Saffisa kaa’uu SMT	Sa'aatii tokkotti hanga qaamolee 76,000 ta'u	Kaa'uu ulfaatinaa ol'aanaa kan feeder-dhiyeessan passives fi qaamolee paakeejii ni deeggara.
Die attach irraa wafer	Sa'aatii tokkotti hanga 54,000 du'u	Adeemsa teeppii gidduugaleessaa malee kallattiin-wafer face-up die kaa'uu dandeessisa.
Flip-chip kaa'uu wafer irraa	Sa'aatii tokkotti hanga 51,000 du'u	Saffisa guddaadhaan kaa'uu daayisii gama walqunnamtii substrate fuuldura jiruun ni deeggara.
Gitoota sirrii ta’uu	20 μm, 15 μm fi 10 μm 3 sigma irratti	Adeemsa walsimsiisuun guddina daayi adda addaa, dirree, daayameetira kubbaa fi obsa substrate ni hayyama.
Dandeettii wafer	Hanga wafer adda addaa 50	Oomishaalee dalagaalee semiikondaaktarii hedduu of keessaa qabaniif dandeettii multi-die ni kenna.
Jijjiirraa wafer	Sekondii 13 gadi	Oomishaalee maddoota weefer hedduu gidduutti wal jijjiiran keessatti harkifannaa jijjiirama meeshaa ni hir’isa.
Akkaataa substrate daandii tokkoo	Hanga 620 × 700 mm, qindaa'ina irratti kan hundaa'e	Paanaalii, PCB embedded fi substrates addaa gurguddoo ni deeggara.
Akkaataa substrate daandii lamaa	Haala istaandaardii ibsame keessatti hanga 375 × 260 mm	Geejjibaa walfakkaatu PCB istaandaardii fi SiP substrates ni deeggara.
Safara maashinii	Tilmaamaan 2.56 × 2.50 × 1.85 m	Karoora lafaa, qulqullina qaqqabummaa fi gamaaggama haala sararaaf bu’uura ni kenna.
Walqunnamsiistota qunnamtii	IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 fi SECS/GEM jedhaman irraa kan fudhatame	Maashinicha to’annoo sarara SMT fi sirna warshaa semiikondaaktarii wajjin wal qunnamsiisa.
Naannoo oomishaa	Walsimsiisaa kutaa qulqulluu gita 7 fi deeggarsa SEMI S2/S8	Naannoowwan oomisha paakeejii sadarkaa olaanaa fi semiikondaaktarii to’atame keessatti bobbii ni deeggara.

Maashiniin dhiyaate gabatee maqaa isaa, mataa fe’ame, gita sirrii ta’uu isaa, sirna weefar, qophii geejjibaa, hayyama sooftiweerii fi moojuulota adeemsaa wajjin ilaalamuu qaba. Maximumoonni waltajjii ofumaan yuunitii dhuunfaa hunda hin ibsan.

Sirrummaa fi Geejjibaa

Jijjiirama Guddina Substrate Gita Sirrummaa Barbaachisaa Waliin

Akkaataan deeggaramee guddaan fi sirrummaan cimaan yeroo hunda naannoo hojii tokko irratti hin argamu. Hariiroon kun maashinii filachuu dura gamaaggamuu qaba.

Konveyeerii / Haala Hojii	Gitaa Sirrummaa	Akkaataa Substrate Maxxanfame	Qabxii Irra Deebiin Ilaaluu Idilee
Konveyeerii daandii tokkoo	20 μm @ 3 sigmaa ta’a	Hanga 620 × 700 mm	Paanaalii gurguddoo fi bifa gabatee ukkaamfame.
Konveyeerii daandii tokkoo	15 μm @ 3 sigmaa ta’a	Hanga 620 × 700 mm	Bifa guddaa kan barbaachisummaa iddoo ciccimoo qabu.
Haala kudhaama daandii tokkoo	12 μm @ 3 sigmaa ta’a	Hanga 620 × 700 mm, 300 × 300 mm kuadraantiin madaalame	Haala oomishaa naannoo hojii ulaagaa guutee wajjin walqabatee mirkaneessuu.
Konveyeerii daandii tokkoo	10 μm @ 3 sigmaa ta’a	Hanga 300 × 300 mm	Sirrummaa olaanaa SiP fi hojiiwwan daayi addaan fageenya cimaa qaban.
Konveyeerii daandii lamaa	20 μm @ 3 sigmaa ta’a	Hanga 375 × 260 mm	Omisha PCB ykn SiP istaandaardii walfakkaatu.
Akka haala daandii tokkootti lama	20 μm @ 3 sigmaa ta’a	Hanga 375 × 430 mm	Waltajjii geejjibaa lamaa fayyadamuun bifa dheeraa.
Konveyeerii daandii lamaa	15 μm ykn 10 μm @ 3 sigma	Hanga 250 × 100 mm	Substrates xixiqqoo gita sirrii ta’uu cimaa barbaadan.

Walbira Qabsiisuu Daandii Omishaa

Karaalee Sadii Oomisha SMD fi Bare-Die Walmakaa Walitti Qaban

CA2n ijaarsa oomishaa ta'uu danda'u keessaa isa tokkodha. Daandiin hundarra gaariin walxaxiinsa oomishaa, baay’ina, meeshaalee jiranii fi dalagaalee adeemsaa barbaachisan irratti hundaa’a.

Karaa A

Seelii SMT fi Die-Bonding adda baasuu

Qaamonni paakeejii ta’anii fi daayiin qullaa ta’e waltajjiiwwan meeshaalee of danda’an irratti hojjetamu.

Yeroo dalagaaleen ispeeshaalistii die-bonding ol’aantummaa qabaatan faayidaa qaba
Meeshaalee of danda'an optimization ni hayyama
Jijjiirraa fi hordoffii sirna qaxxaamuraa barbaada
Bakka lafaa dabalataa fi qabannaa gidduugaleessaa barbaachisuu danda’a

Daandii B

Teeppiidhaan Dies for SMT Placement

Bare dies walitti qabamuu dura gara bifa teeppii feeder-compatible tti jijjiirama.

Dhangala’aa meeshaa nyaachisaa irratti hundaa’e kan barame fayyadama
Hojiiwwan teeppii, kuusaa fi to'annoo qulqullinaa dabalata
Meeshaa geejjibaa fi barbaachisummaa gatamuu ni uuma
Yeroo gosootni die hedduun hirmaatan flexibility daangessuu danda'a

Daandii C

Kallatti-Wafer Hybrid Placement

CA2n SMDs feeders irraa adeemsisuun kallattiin wafers irraa waltajjii walqabate tokko keessatti du'a.

Jijjiirraa daayii fi qabannaa gidduugaleessaa ni hir'isa
Oomisha multi-wafer fi multi-die ni deeggara
Galmeewwan die iddoowwan kaa'iinsa dhumaa wajjin walqabsiisa
Qindaa'ina wafer, mataa fi adeemsa sirrii barbaada

Arkiteekcharii Sarara Omishaa

CA2 Akka Giddugala Adeemsa Walmakaa Sarara SiP Hojjechuu Danda'a

Oomisha SiP ulfaatina olaanaa qabuuf CA2n SIPLACE TX micron ykn meeshaalee sararaa mijatoo biroo wajjin walitti makamuu danda’a. Sana booda hojii hunda gara buufata tokkotti dirqisiisuu mannaa, kaa’uu nyaataa saffisa olaanaa, adeemsa kallattii-wafer fi sakatta’iinsi maashiniiwwan walitti hidhaman irratti madaalamuu danda’a.

Sadarkaa 01ffaaMaxxansa ykn Fayyadama Meeshaa

Solder paste, adhesive ykn flux dibamee akkaataa adeemsaatti ni sakatta’ama.

Sadarkaa 02ffaaSaffisa Ol'aanaa SMD Kaa'uu

Qaamonni nyaata baay’ee barbaadan waltajjii saffisa olaanaa madaalawaa ta’e irratti kaa’amuu danda’u.

Sadarkaa 03ffaaCA2 Wafer fi Hybrid Placement

Direct-wafer dies, flip chips fi tarkaanfiiwwan addaa walmakaa-kaa’uu xumuramaniiru.

Appilikeeshinii Fit

Oomishaalee Kallatti-Wafer fi Mixed-Component Placement Irraa Faayidaa Argatan

CA2n baay’ee gatii kan qabu bakka bifa qaamolee hedduun sirrii ta’uu olaanaa, oomisha olaanaa fi galmee meeshaa bal’aa ta’een qindoomina qabaachuu qaba.

Moojuulota Sirna-Paakeejii Keessatti

Proosesaroota, mimoorii, RF dies, ICs paakeejii fi passives kan walitti qabaman compact substrate waliigalaa irratti.

Yaa'iiwwan Semikondaaktarii Humnaa

Humna du’aa fi qaamolee SMD deeggaran kanneen sirna konkolaataa fi anniisaaf substrates addaa irratti kaa’aman.

Paakeejii Sadarkaa Waafer

Sirritti kaa’uu daayi fi adeemsa hojii chip-on-wafer kan to’annoo weefar qabachuu barbaadu.

Paakeejii Sadarkaa Paanaalii

Paanaalii bifa guddaa fi caasaa ukkaamfame geejjibaa sirrii fi kaa'uu qaamolee barbaadan.

Moojuulota Sensara fi Walqunnamtii

Oomishaalee kompaaktii bare sensing ykn RF dies IC to’annoo fi qaamolee passive waliin walitti fidan.

Oomishaalee PCB Embedded

Bare dies ijaarsa sarkiyuutii maxxanfame sadarkaa olaanaa qabu keessatti ykn irratti kan walitti makame yoo ta’u, barbaachisummaa qabannaa addaa qabu.

Hiika Qindeessituu

Maashinii CA2 Walsimsiisuun Dura Naannoowwan Afur Ifa gochuu Qaban

Filannoon amanamaan oomishaa fi adeemsa yaadame irraa eegala malee moodeela maashinii qofa miti.

Meeshaalee

Safartuuwwan daayi, furdina, daayameetira weefar, bifa wafer-map, hanga paakeejii SMD, bal'ina teeppii fi baay'ina gosoota daayi ibsi.

Sirrummaa fi Bu’aa

Obsa iddoo, dirree bump ykn kubbaa, oomisha sa’aatii galma, makaa oomishaa fi frequency jijjiirraa eegamu mirkaneessuu.

Geejjibaa Substrate

Safartuuwwan substrate, furdina, warpage, dizaayinii geejjibaa, yaa’a daandii tokkoo ykn lamaa fi kallattii fe’umsaa ifteessi.

To’annoo Adeemsaa

Dipping, inspection, traceability, cleanroom, qunnamtii warshaa fi cufame-looppii barbaachisu ni ibsu.

Mirkaneessa Meeshaalee

SIPLACE CA2 Argamu Irratti Maaltu Sakatta'amuu Qaba

Maashiniiwwan lama maqaa moodeela CA2 walfakkaataa qaban adeemsa adda addaa deeggaru danda'u. Qindaa'inni guutuun fe'ame caqasa, jijjiirraa ykn karoora sararaa dura ilaalamuu qaba.

Eenyummaa maashiniiMaqaa guutuu, lakkoofsa tartiiba, bara omishaa, gabatee maqaa fi seenaa hojii.

Mataa ramaddiiMataa CP20, asxaa mataa, sa’aatii hojii, interfeesii noozii fi odeeffannoo safartuu jiru kan dhaabame.

Gitaa sirrii ta’uu20 μm, 15 μm ykn 10 μm configuration fi naannoo hojii gahumsa qabu walgitu.

Meeshaalee waferYuunitii jijjiirraa weefer, furmaata weefer deeggarame, ejector, buffer, flip unit fi dandeettii wafer-map.

Sirna geejjibaaLaan tokko, daandii lamaa, bitaa-seensa/bitaa-ba’e ykn qophii geejjibaa fi substrate addaa.

Moojuulota adeemsaaYuunitii sarara cuuphaa, kompaawundii miira, sakatta’iinsa daayi, sakatta’iinsa doonii keessaa fi filannoowwan hordoffii.

Software fi interfeesiiVershinii sooftiweerii fe’ame, hayyama, SECS/GEM, CFX, HERMES fi walitti makamuu oomisha-daataa.

Daangaa dhiyeessiiNyaachisaa, noozlii, meeshaalee weefar, sanadoota, meeshaalee dabalataa, odeeffannoo qorannoo fi kuusaa al-ergii.

Deeggarsa Meeshaalee fi Kutaalee

Qabeenya Meeshaalee Walqabatan Pirojektii CA2

Filannoon maashinii nyaachiftoota barbaachisan, meeshaalee weefar, mataa kaa’uu, noozlii fi adeemsa qaphxii sadarkaa olaanaa naannoo isaa jiru waliin qindoomina qabaachuu qaba.

Ramaddii Meeshaalee

Meeshaalee Die Bonder

Meeshaalee dabalataa semiconductor die-attach fi advanced-packaging adeemsa adda addaa barbaachisu ilaaluu.

Qorannoo The Bonders → Dhiyeessii Meeshaalee

Nyaachiftoota ASM SIPLACE

Bal’ina teeppii, baay’ina nyaachisaa fi dhiyeessii qaamolee gama SMT adeemsaaf barbaachisu walsimsiisuu.

Nyaataa ASM ilaali → Deeggarsa Qindeessituu

CA2 Maashinii fi Kutaalee Walsimsiisuu

Adeemsa, wafer, die, substrate fi sirrii ta’uu barbaachisummaa maashinii fi bakka bu’iinsa-kutaalee gamaaggama dhiyeessu.

Ulaagaalee Keessan irratti mari'adhaa →

Gaaffiiwwan Irra Deddeebiin Gaafataman

SIPLACE CA2 Gaaffiiwwan Adeemsaa fi Qindeessituu

Deebii gareewwan maashinicha kallattiin-wafer kaa’uu, oomisha SiP fi qaphxii sadarkaa olaanaa madaalan.

ASM SIPLACE CA2 maashinii SMT moo die bonder dha?

Maashinii kaa'uu walmakaa (hybrid placement machine) dha. Innis feder-based SMT component placement with direct-from-wafer die attach fi flip-chip processing walitti fida, kanaaf naannoo omishaa lamaan keessatti hojjeta.

Maaliif maashinii SMT barame kan bare dies hin fayyadamnu?

Maashiniin SMT barame akka idileetti qaamolee nyaachisaa ykn saanii keessatti dhiyaataniif kan mijatudha. Adeemsi weefar kallattiin daataa wafer-map, addaan bahuu daayi, faankishinii ejector fi flip, die buffering, inspeekshinii addaa fi hordoffii sadarkaa daayi barbaada.

CA2n SMD fi bare dies substrate tokko irratti adeemsisuu danda'aa?

Eeyyee. Dandeettiin meeshaa walmakaa kun kaayyoo giddugaleessaa waltajjichaati. Tartiiba sirrii nyaachiftoota fe’aman, sirna wafer, mataa kaa’uu, moojuulota adeemsaa fi sagantaa oomishaa irratti hundaa’a.

Kallattiin wafer pickup die taping ni dhabamsiisaa?

Barbaachisummaa daayii hojiirra oolu gara teeppiitti jijjiiruu osoo hin kaa’iin dura dhabamsiisuu danda’a. Kun mijachuu fi dhiisuu isaa bifa wafer, haala die, deetaa beekamaa-gaarii-die fi qindeessaa wafer-handling fe'ame irratti hundaa'a.

CA2n yeroo daayi weefar irraa fudhatu akkamitti saffisa eega?

Waltajjiin kun die buffering fi qophii parallelized fayyadama. Daayiin addaan baafamee qophaa’uu kan danda’u yoo ta’u, mataan kaa’uu qaamolee biroo hojjechuu itti fufee jira, kunis harkifannaa kallattiin weefar fudhachuu wajjin walqabatee dhufu hir’isa.

Raawwiin ramaddii ol’aanaa maxxanfame maali?

Gatiin waltajjii maxxanfame SMT kaa’uuf sa’aatii tokkotti hanga qaamolee 76,000, wafer irraa die attach’f sa’aatii tokkotti daayi 54,000 fi flip-chip kaa’uuf sa’aatii tokkotti daayi 51,000 ga’a. Bu’aan qabatamaan qindeessaa maashinii fi oomisha irratti hundaa’a.

Setup CA2 tokko gosoota wafer adda addaa hedduu fayyadamuu danda'aa?

Qindaa'ina jijjiirraa weefer hojiirra jiruun, waltajjiin kun hanga weefer adda addaa 50 qabachuu danda'a. Kunis oomishaalee gosoota daayi hedduu walitti fidan, sirna wafer fe'amee fi sagantaa sagantaa jalatti kan hundaa'e deeggara.

Hordoffii sadarkaa du’a tokkoo jechuun maal jechuudha?

Daayiin dhuunfaa tokko bakka fudhannaa isaa madda weefer irratti irraa kaasee hanga bakka dhumaa kaa’uu isaa substrate irratti, daataa oomishaa fi sakatta’iinsa barbaachisaa ta’e waliin walqabsiisuu ni danda’ama jechuudha.

CA2n die bonder of kenne hunda bakka bu'uu danda'aa?

Lakkii hojiiwwan humna walitti hidhamiinsa addaa, hoo’isuu, fayyisuu, kennuu ykn bifa daayiin daangaa fe’ameen ala barbaadan ammallee meeshaalee walgahii semiikondaaktarii adda ta’an barbaaduu danda’u.

CA2n SIPLACE TX micron waliin fayyadamuu ni danda'amaa?

Eeyyee. Maashiniiwwan sarara oomishaa SiP walfakkaataa keessatti qindaa’uu kan danda’an yoo ta’u, kaa’iinsi nyaataa saffisa guddaa ykn sirrii ta’e kan hojiiwwan kaa’uu kallatti-wafer fi hybrid wajjin madaalawaa ta’e qaba.

Maashinii CA2 fayyadame waliin walsimsiisuuf odeeffannoo akkamii barbaachisa?

Ispeesifikeeshinii daayii fi weefer, safara sabsteeretii, sirrii ta’uu barbaachisu, fageenya qaama, oomisha galma, filannoo geejjibaa, filannoo adeemsaa, barbaachisummaa hordoffii, haala maashinii filatamaa fi bakka itti geessu ni kenna.

Adeemsa-Paakeejii Ol'aanaa Keessaniif SIPLACE CA2 madaali

Akkaataa weefar, safara daayi, guddina substrate, makaa qaama, galma sirrii ta'uu, oomisha eegamuu fi filannoowwan adeemsa barbaachisan gamaaggama qindeessuuf ergi.

Irra Deebiin Qindeessituu Gaaffii