Is the ASM SIPLACE CA2 an SMT machine or a die bonder?

The ASM SIPLACE CA2 is a hybrid placement machine that combines feeder-based SMT component placement with direct-from-wafer die attach and flip-chip processing.

Why not use a conventional SMT machine for bare dies?

Direct wafer processing requires wafer-map data, die separation, ejector and flip functions, die buffering, specialized inspection and die-level traceability beyond normal feeder-based placement.

Can the SIPLACE CA2 process SMDs and bare dies on the same substrate?

Yes. The platform is designed to place feeder-supplied SMD components and bare dies taken directly from sawn wafers within one coordinated production flow.

Does direct wafer pickup eliminate die taping?

It can eliminate the need to convert applicable dies into tape before placement, subject to wafer format, die condition, known-good-die data and the installed wafer configuration.

How does the SIPLACE CA2 maintain speed when picking dies from a wafer?

The platform uses die buffering and parallelized preparation so dies can be detached and prepared while other placement operations continue.

What is the maximum published placement performance of the SIPLACE CA2?

Published platform values reach up to 76,000 components per hour for SMT placement, 54,000 dies per hour for die attach from wafer and 51,000 dies per hour for flip-chip placement.

Can one SIPLACE CA2 setup use several different wafer types?

With the applicable wafer exchange configuration, the platform can hold up to 50 different wafers for multi-die production.

What does single-die-level traceability mean?

It means an individual die can be linked from its pickup position on the source wafer to its final placement position on the substrate together with relevant production data.

Can the SIPLACE CA2 replace every dedicated die bonder?

No. Processes requiring specialized bonding force, heating, curing, dispensing or unsupported die formats may still require dedicated semiconductor assembly equipment.

Can the SIPLACE CA2 be used with a SIPLACE TX micron?

Yes. The machines can be arranged in the same SiP production line to balance feeder placement with direct-wafer and hybrid placement operations.

What information is needed to match a used SIPLACE CA2 machine?

Provide the die and wafer specifications, substrate dimensions, required accuracy, component range, target output, conveyor preference, process options, machine condition and destination.

Malo Okhazikika Molunjika a Wafer kuti Agwiritsidwe Ntchito Pakapangidwe Kapamwamba

ASM SIPLACE CA2Yankho Lopanga Die Attach & Flip-Chip

SIPLACE CA2 idapangidwa kuti igwiritsidwe ntchito pazinthu zomwe sizikugwirizana bwino ndi mzere wachikhalidwe wa SMT kapena njira yodziyimira yokha yolumikizirana ndi die-bonding. Imaphatikiza malo osungira a SMD opangidwa ndi chakudya ndi kunyamula mwachindunji ma semiconductor dies ochokera ku ma wafer odulidwa, kulola SiP ndi opanga ma phukusi apamwamba kuyang'anira zinthu zosakanikirana, ma die attach, ma flip-chip placement, kuyang'anira ndi kutsata mkati mwa nsanja imodzi yolumikizirana yopangira.

Onani Kuyenerera kwa Njira Kambiranani za Kapangidwe ka CA2

Kufikira 76,000 cphKuyika kwa SMT Kochokera ku Zodyetsa

Kufikira 54,000 cphDie Attach kuchokera ku Wafer

Kufikira 51,000 cphFlip-Chip kuchokera ku Wafer

Kufikira 10 µmKalasi Yolondola pa 3 Sigma

Vuto la Kupanga

Chifukwa Chake SIPLACE CA2 Ilipo

Ma module a System-in-Package ndi zinthu zina zamagetsi zamakono nthawi zambiri zimaphatikiza magulu awiri osiyana kwambiri azinthu pa substrate imodzi: zigawo zachikhalidwe za SMD zomwe zimaperekedwa mu ma reel, ndi ma semiconductor dies osapakidwa omwe amaperekedwa pa ma wafer odulidwa. Kupanga kwachikhalidwe kumalekanitsa zipangizozi pakati pa makina oyika SMT ndi die bonder.

Kulekanitsa kumeneko kungayambitse kusintha kwa zinthu zina, kusungirako kwapakati, kusamutsa zinthu, malo okonzera mapulogalamu ndi malo olumikizirana. Ma dies opanda kanthu angafunike kusamutsidwa mu tepi asanalowe mu njira yodyera, pomwe zinthu zosakanikirana zimasuntha pakati pa zida zopangidwa motsatira mfundo zosiyanasiyana zopangira.

ASM SIPLACE CA2 ndi nsanja yosakanikirana yopangidwira kutseka kusiyana kumeneku.Zimathandizira kuti makina odulira a chidebecho azigwiritsidwa ntchito mwachindunji m'malo opangira zinthu omwe amayendetsedwa ndi SMT, kotero kuti zinthu zodyetsera, zomangira ndi ntchito zodulira zigwirizane motsatira kayendedwe ka zinthu komweko.

Kodi ndi kusintha kotani komwe kumachitika pamene ma dies alowa mu mzere wa SMT?

Mafa odziwika bwino amatha kusankhidwa mwachindunji kuchokera ku chidziwitso cha mapu a wafer.
Ma SMD operekedwa ndi zodyera ndi ma wafer operekedwa ndi ma wafer akhoza kuyikidwa pa substrate yomweyo.
Kukonzekera ndi kuyika kwa ufa kungafanane ndi kuikidwa kwa ufawo kudzera mu buffering.
Diye iliyonse ikhoza kulumikizidwa kuchokera pamalo ake a wafer kupita pamalo ake omaliza a substrate.
Ma interface a SMT ndi ma semiconductor amatha kutenga nawo mbali mu kayendedwe kamodzi kolumikizidwa ku fakitale.

Kusankha Njira

Kodi SIPLACE CA2 Imakhala Ndi Nzeru Liti?

Mapulogalamu amphamvu kwambiri a CA2 satchulidwa ndi dzina limodzi la phukusi. Amafotokozedwa ndi kuphatikiza kwa gwero la zinthu, ndondomeko ya njira, kulondola, kutsata ndi kuchuluka kwa kupanga.

✓

Kukwanira kwamphamvu kwa CA2

Chogulitsa chomwecho chimagwiritsa ntchito ma SMD omwe amaperekedwa ndi chakudya komanso ma bare dies.
Ma died ayenera kusankhidwa mwachindunji kuchokera ku wafer imodzi kapena zingapo zodulidwa.
Kupanga kumaphatikizapo kufa, flip chip kapena njira zonse ziwiri.
Mitundu yambiri ya ma die iyenera kusinthidwa popanda kugwiritsa ntchito manja kwambiri.
Kuyika kumafuna magulu olondola a 20 µm, 15 µm kapena 10 µm.
Kufufuza kwa ufa wa munthu aliyense payekha kumafunika kuyambira pa wafer mpaka pa chinthu chomalizidwa.
Wopanga akufuna kuchepetsa kujambulidwa kwa die ndi zinthu zina zokhudzana nazo.
Mzerewu uyenera kulumikizana ndi makina a fakitale a SMT ndi semiconductor.

Ikufunika Kuwunikanso Njira Yowonjezera

Njirayi imafuna kutentha kwapadera, kuchiritsa kapena mphamvu yayikulu yolumikizirana.
Miyeso ya die kapena makulidwe ake amagwera kunja kwa malo ogwiritsira ntchito omwe adayikidwa.
Chogulitsacho chimafunika ntchito zogawa kapena zomangira zomwe sizimayikidwa pa makina.
Chigawocho chimafuna chonyamulira kapena njira yonyamulira yomwe siili mu dongosolo.
Kuchuluka kwa kupanga ndi kochepa kwambiri kuti kukhale koyenera kugwiritsa ntchito nsanja yolumikizana yothamanga kwambiri.
Kayendedwe ka fakitale komwe kalikonse kamamangidwa mozungulira maselo odziyimira pawokha ogwirizana ndi kufa.
Kuwunika kofunikira kapena kuyeza zinthu kuyenera kuchitika pazida zapadera zapadera.
Makina omwe agwiritsidwa ntchito omwe alipo alibe njira zofunikira za wafer, head kapena mapulogalamu.

Kapangidwe ka Makina

Machitidwe Asanu Omwe Amatanthauzira Kutha kwa Njira za CA2

Dzina la chitsanzo limatchula nsanjayo, koma makina okhazikitsidwa awa amatsimikiza momwe makina amodzi angagwiritsire ntchito ma wafer, zigawo zake ndi zinthu zina.

01 / ZOPANGIRA ZINTHU

Zodyetsa ndi Mathireyi a SMT

Ma feeder ogwirizana amapereka ma passives ndi ma semiconductors opakidwa, pomwe thireyi yosankhidwa ndi zosankha zonyamulira zimathandizira mitundu yowonjezera ya zigawo.

02 / KUGWIRITSA NTCHITO MA WAFER

Dongosolo Losinthira Ma Wafer

Dongosolo la wafer limasunga ndikupereka mitundu yosiyanasiyana ya wafer, zomwe zimathandiza kuti zinthu zikhale ndi mitundu yosiyanasiyana ya ma wafer.

03 / NJIRA YOFANANA

Kutsegula

Kulekanitsa ndi kukonzekera die kumatha kuyenda limodzi ndi malo oyika, kuchepetsa chiwopsezo cha liwiro chomwe nthawi zambiri chimagwirizana ndi direct wafer pickup.

04 / KUKHALA

Kapangidwe ka Mutu wa CP20

Mitu yothamanga kwambiri imagwira zinthu zazing'ono komanso zodziwikiratu pogwiritsa ntchito pickup yosakhudza, malo olamulidwa komanso magulu olondola mpaka 10 µm.

05 / KUYANKHULA NJIRA

Kuyang'anira ndi Kutsata

Kuzindikira zinthu, kuyang'ana momwe zinthu zilili, kuyang'anira kumiza ndi deta yopangira kumathandiza kuti pakhale zokolola zokhazikika komanso zolemba za mulingo wokhazikika.

Kuyenda kwa Misonkhano Yosakanikirana

Momwe Chogulitsa Chosakanikirana cha SMD ndi Bare-Die Chimayendera Kudzera mu CA2

Mndandanda weniweni umasintha malinga ndi chinthu, koma njirayi nthawi zambiri imalumikiza kuzindikira kwa zinthu, kugwiritsa ntchito wafer mwachindunji, kuyika molondola komanso zolemba zopangira.

Lowetsani Deta ya Zamalonda

Mapulogalamu a substrate, deta ya zigawo, mamapu a wafer, magawo a njira ndi zofunikira pakutsata zakonzedwa.

Konzani Zipangizo

Ma reel a SMD, ma tray, ma wafer, ma wafer frame, ma nozzles ndi zinthu zoviika zimayikidwa pakupanga.

Sankhani Mafa Odziwika Bwino

Dongosolo la wafer limazindikira wafer wofunikira ndipo limagwiritsa ntchito deta ya mapu kuti lisankhe ma dies omwe angagwiritsidwe ntchito pa chinthucho.

Buffer ndi Orient Imfa

Ma die amachotsedwa, kufufuzidwa, kusungidwa ndi kuzunguliridwa pamene msonkhano ukufuna kulumikizana molunjika pansi.

Ikani Zigawo Zosakaniza

Zipangizo zodyetsera ndi ma wafer dies zimayikidwa pogwiritsa ntchito njira yodziwika bwino ya SMT, die-attach, flip-chip kapena dipping sequence.

Deta Yokhudza Ndondomeko Yolemba

Malo otengera zinthu, zotsatira za kuwunika, ndi malo omaliza oyika zinthu zitha kulumikizidwa ndi gawo lapansi ndi mbiri ya kupanga.

Deta Yofalitsidwa ya Pulatifomu

Mafotokozedwe aukadaulo a ASM SIPLACE CA2

Ma mtengo ofalitsidwa amafotokoza luso la nsanja ya CA2 lomwe likupezeka. Kugwira ntchito kwenikweni kumadalira mutu womwe waikidwa, phukusi lolondola, ma module a wafer, conveyor, kusakaniza kwa zigawo ndi njira zoyendetsera.

Chinthu chaukadaulo	Kutha Kofalitsidwa	Chifukwa Chake Ndi Chofunika
Liwiro la malo a SMT	Kufikira 76,000 zigawo pa ola limodzi	Imathandizira kuyika kwa zinthu zopatsa mphamvu zodyetsa ndi zinthu zina zopakidwa m'matumba ambiri.
Chomangira chochokera ku wafer	Anthu okwana 54,000 amafa pa ola limodzi	Zimathandiza kuti chidebe chikhale chowonekera mmwamba popanda kugwiritsa ntchito njira yojambulira pakati.
Kuyika kwa flip-chip kuchokera ku wafer	Anthu okwana 51,000 amafa pa ola limodzi	Imathandizira kuyika kwa ma dies mwachangu kwambiri ndipo mbali yolumikizirana ikuyang'ana pansi.
Makalasi olondola	20 µm, 15 µm ndi 10 µm pa 3 sigma	Imalola kufananiza njira zosiyanasiyana za kukula kwa die, ma pitches, ma diameter a mpira ndi kulekerera kwa substrate.
Kuchuluka kwa chakudya chophikidwa mu uvuni	Mpaka ma wafers 50 osiyanasiyana	Amapereka mphamvu ya multi-die pazinthu zomwe zili ndi ntchito zingapo za semiconductor.
Kusinthana kwa ma wafer	Masekondi osakwana 13	Amachepetsa kuchedwa kwa kusintha kwa zinthu zomwe zimasinthasintha pakati pa magwero angapo a wafer.
Kapangidwe ka substrate ya msewu umodzi	Kufikira 620 × 700 mm, kutengera kapangidwe kake	Imathandizira mapanelo, ma PCB ophatikizidwa ndi ma substrates akuluakulu apadera.
Kapangidwe ka substrate ya njira ziwiri	Mpaka 375 × 260 mm mu mawonekedwe okhazikika omwe atchulidwa	Imathandizira mayendedwe ofanana a ma PCB okhazikika ndi ma substrates a SiP.
Miyeso ya makina	Pafupifupi 2.56 × 2.50 × 1.85 m	Amapereka maziko okonzekera pansi, njira yolowera komanso kuwunikanso momwe mzere ulili.
Ma interface olumikizirana	IPC-HERMES-9852, IPC-2591 CFX, IPC-SMEMA-9851 ndi SECS/GEM	Imalumikiza makinawo ndi makina owongolera mzere wa SMT ndi makina a fakitale ya semiconductor.
Malo opangira zinthu	Kugwirizana kwa zipinda zoyera za kalasi 7 ndi chithandizo cha SEMI S2/S8	Imathandizira kutumizidwa m'malo okonzedwa bwino komanso opanga ma semiconductor.

Makina omwe aperekedwa ayenera kuyang'aniridwa ndi dzina lake, mitu yoyikidwa, kalasi yolondola, makina a wafer, dongosolo loyendetsera katundu, malayisensi a mapulogalamu, ndi ma module a process. Ma platform maximum safotokoza zokha chipangizo chilichonse.

Kulondola ndi Kuyendera

Kusintha kwa Kukula kwa Substrate ndi Kalasi Yolondola Yofunikira

Kapangidwe kothandizidwa kwambiri komanso kulondola kwambiri sikumapezeka nthawi zonse pamalo omwewo ogwirira ntchito. Ubale uwu uyenera kuwunikidwanso musanasankhe makina.

Chotengera / Njira Yogwirira Ntchito	Kalasi Yolondola	Mtundu wa Substrate Wofalitsidwa	Mfundo Yowunikira Yachizolowezi
Chonyamulira cha msewu umodzi	20 µm @ 3 sigma	Kufikira 620 × 700 mm	Mapanelo akuluakulu ndi mawonekedwe a bolodi lolumikizidwa.
Chonyamulira cha msewu umodzi	15 µm @ 3 sigma	Kufikira 620 × 700 mm	Kapangidwe kake kakakulu kokhala ndi zofunikira zoyikamo molimbika.
Njira ya quadrant ya msewu umodzi	12 µm @ 3 sigma	Kufikira 620 × 700 mm, kuyesedwa ndi 300 × 300 mm quadrant	Tsimikizani kapangidwe ka chinthucho poyerekeza ndi malo ogwirira ntchito oyenerera.
Chonyamulira cha msewu umodzi	10 µm @ 3 sigma	Mpaka 300 × 300 mm	SiP yolondola kwambiri komanso kugwiritsa ntchito die yotalikirana kwambiri.
Chonyamulira cha njira ziwiri	20 µm @ 3 sigma	Kufikira 375 × 260 mm	Kupanga kwa PCB kapena SiP kofanana.
Njira ziwiri monga njira imodzi	20 µm @ 3 sigma	Kufikira 375 × 430 mm	Mtundu wowonjezeredwa pogwiritsa ntchito nsanja yolumikizirana kawiri.
Chonyamulira cha njira ziwiri	15 µm kapena 10 µm @ 3 sigma	Mpaka 250 × 100 mm	Ma substrates ang'onoang'ono omwe amafuna kalasi yolondola kwambiri.

Kuyerekeza Njira Yopangira

Njira Zitatu Zopangira Chogulitsa Chosakaniza cha SMD ndi Bare-Die

CA2 ndi njira imodzi yopangira zinthu. Njira yabwino kwambiri imadalira kuuma kwa zinthu, kuchuluka kwake, zida zomwe zilipo kale komanso ntchito zofunika pakupanga zinthu.

Njira A

Maselo Osiyana a SMT ndi Die-Bonding

Zigawo zopakidwa ndi ma dies opanda kanthu zimakonzedwa pa nsanja zodziyimira pawokha.

Zothandiza pamene ntchito zapadera zolumikizirana ndi die-bonding zikulamulira
Imalola kukonza zida payokha
Imafuna kusamutsa ndi kutsata njira zosiyanasiyana
Mungafunike malo ochulukirapo pansi ndi kusamalira pakati

Njira B

Tepi Ma Dies kuti Muyike SMT Placement

Ma dies opanda kanthu amasinthidwa kukhala tepi yogwirizana ndi chakudya asanayikidwe.

Imagwiritsa ntchito njira yodziwika bwino yogwiritsira ntchito zinthu zodyera
Imawonjezera ntchito zojambulira, kusunga ndi kuwongolera khalidwe
Amapanga zinthu zonyamulira ndi zofunikira zotayira
Zingachepetse kusinthasintha pamene mitundu yambiri ya kufa ikukhudzidwa

Njira C

Malo Osakanikirana Olunjika a Wafer

CA2 imakonza ma SMD kuchokera ku ma feeder ndipo imafa mwachindunji kuchokera ku ma wafers mu nsanja imodzi yolumikizidwa.

Amachepetsa kusintha kwa die ndi kugwira ntchito kwapakati
Imathandizira kupanga ma wafer ambiri komanso ma multi-die
Amagwirizanitsa zolemba za die ndi malo omaliza oyika
Imafuna kasinthidwe koyenera ka wafer, mutu ndi njira

Kapangidwe ka Mizere Yopangira

CA2 Ingagwire Ntchito Ngati Malo Ophatikizana a Njira ya SiP Line

Pakupanga SiP yochuluka, CA2 ikhoza kuphatikizidwa ndi SIPLACE TX micron kapena zida zina zoyenera. Kuyika kwa feeder yothamanga kwambiri, kukonza ma wafer mwachindunji ndi kuwunika kumatha kulinganizidwa pamakina olumikizidwa m'malo mokakamiza ntchito iliyonse kukhala siteshoni imodzi.

Gawo 01Kusindikiza kapena Kugwiritsa Ntchito Zinthu

Phala lothira, guluu kapena madzi oundana amayikidwa ndikuyang'aniridwa malinga ndi njira yogwirira ntchito.

Gawo 02Kuyika kwa SMD Yothamanga Kwambiri

Zipangizo zogwiritsira ntchito chakudya chochuluka zitha kuyikidwa pa nsanja yolinganizidwa bwino yothamanga kwambiri.

Gawo 03CA2 Wafer ndi Hybrid Placement

Ma dies a direct-wafer, ma flip chips ndi njira zapadera zosakanikirana zatha.

Kugwiritsa Ntchito Koyenera

Zinthu Zomwe Zimapindula ndi Kuyika kwa Wafer Mwachindunji ndi Zosakaniza Zosiyanasiyana

CA2 ndi yofunika kwambiri pomwe mitundu ingapo ya zigawo iyenera kugwirizanitsidwa bwino kwambiri, kutulutsa kwakukulu komanso zolemba zambiri zazinthu.

Ma modules a System-in-Package

Ma processor, memory, RF dies, ma IC opakidwa ndi ma passives osonkhanitsidwa pa substrate yofanana.

Misonkhano ya Power Semiconductor

Mphamvu zimafa ndipo zothandizira zigawo za SMD zimayikidwa pazigawo zapadera zamagalimoto ndi makina amphamvu.

Kupaka Pamlingo Wa Wafer

Kuyika bwino ma die ndi ntchito za chip-on-wafer zomwe zimafuna kuyendetsedwa bwino kwa wafer.

Kupaka Ma Panel-Level

Mapanelo akuluakulu ndi nyumba zomangidwa zomwe zimafuna kunyamulidwa molondola komanso kuyikidwa kwa zigawo zake.

Ma module a Sensor ndi Communication

Zipangizo zophatikizika zophatikiza bare sensing kapena RF dies ndi ma control IC ndi zida zongogwira ntchito.

Zogulitsa za PCB Zophatikizidwa

Ma dies opanda kanthu ophatikizidwa kapena opangidwa ndi zipangizo zamakono zosindikizidwa ndi zofunikira zapadera zogwirira ntchito.

Tanthauzo la Kapangidwe

Madera Anayi Oyenera Kutchula Musanagwirizane ndi Makina a CA2

Kusankha kodalirika kumayamba ndi chinthu chomwe mukufuna kupanga komanso njira yomwe mukufuna kugwiritsa ntchito, osati mtundu wa makina okha.

Zipangizo

Fotokozani kukula kwa die, makulidwe, kukula kwa wafer, mawonekedwe a wafer-map, mtundu wa phukusi la SMD, m'lifupi mwa tepi ndi chiwerengero cha mitundu ya die.

Kulondola ndi Kutulutsa

Tsimikizirani kulekerera malo, kugwedezeka kapena kugwedezeka kwa mpira, kutulutsa kwa ola limodzi, kusakaniza kwa zinthu ndi kuchuluka kwa kusintha komwe kukuyembekezeka.

Kuyendera Pansi pa Madzi

Fotokozani kukula kwa substrate, makulidwe, warpage, kapangidwe ka chonyamulira, kuyenda kwa njira imodzi kapena ziwiri komanso njira yokwezera katundu.

Kuwongolera Njira

Fotokozani zofunikira pakuviika, kuyang'anira, kutsata, kuyeretsa, kulankhulana ndi fakitale komanso zofunikira pa closed-loop.

Kutsimikizira Zida

Zomwe Ziyenera Kuyang'aniridwa pa SIPLACE CA2 Yomwe Ilipo

Makina awiri okhala ndi dzina lomwelo la CA2 model amatha kuthandizira njira zosiyanasiyana. Kapangidwe kathunthu koyikidwa kayenera kuunikidwanso musanapereke mtengo, kusamutsa kapena kukonzekera mzere.

Kudziwika kwa makinaChidziwitso chonse, nambala ya seri, chaka chopangira, dzina la kampani, ndi mbiri ya ntchito.

Mitu yoyikaMitu ya CP20 yoyikidwa, zilembo za mitu, maola ogwirira ntchito, malo olumikizirana ndi nozzle ndi zambiri zowunikira zomwe zilipo.

Kalasi yolondolaKapangidwe ka 20 µm, 15 µm kapena 10 µm ndi malo ogwirira ntchito oyenerera.

Zipangizo za pa chidebe chophikidwaChigawo chosinthira ma wafer, mafelemu othandizidwa ndi ma wafer, ejector, buffer, flip unit ndi kuthekera kwa ma wafer-map.

Dongosolo la zotumizaNjira imodzi, njira ziwiri, kumanzere kulowa/kumanzere kutuluka kapena njira yapadera yonyamulira ndi malo osungiramo zinthu.

Ma module a ndondomekoChida choviikamo mzere, kuzindikira zigawo, kuyang'anira die, kuyang'ana mkati mwa board ndi njira zopezera zotsatira.

Mapulogalamu ndi mawonekedweMtundu wa mapulogalamu, zilolezo, SECS/GEM, CFX, HERMES ndi kuphatikiza deta yopanga.

Kuchuluka kwa zinthu zoperekeraZodyetsera, ma nozzles, zowonjezera za wafer, zikalata, zida zosinthira, zambiri zoyesera ndi kulongedza kunja.

Zipangizo ndi Zothandizira Mbali

Zida Zogwirizana ndi Ntchito ya CA2

Kusankha makina kuyenera kugwirizanitsidwa ndi zodyetsera zofunika, zida za wafer, mitu yoyika, ma nozzles ndi njira yozungulira yopangira zinthu zapamwamba.

Gulu la Zida

Zida za Die Bonder

Unikaninso zida zina zowonjezera za semiconductor die-attach ndi zida zapamwamba zopakira kuti mudziwe zofunikira zosiyanasiyana za ndondomekoyi.

Fufuzani Ma Bonders → Kupereka Zinthu Zofunika

Zodyetsa za ASM SIPLACE

Linganizani m'lifupi mwa tepi, kuchuluka kwa chakudya ndi zofunikira pakupereka zinthu zina kumbali ya SMT ya ndondomekoyi.

Onani Zodyetsa za ASM → Thandizo la Kasinthidwe

Kufananiza Makina ndi Zigawo za CA2

Tumizani zofunikira pa ndondomekoyi, wafer, die, substrate ndi kulondola kwa makina ndi zida zina kuti muwonenso.

Kambiranani Zofunikira →

Mafunso Ofunsidwa Kawirikawiri

Mafunso a SIPLACE CA2 ndi Machitidwe

Mayankho a magulu omwe akuyang'ana makinawo kuti aikemo chotsukira mwachindunji, kupanga SiP ndi kulongedza kwapamwamba.

Kodi ASM SIPLACE CA2 ndi makina a SMT kapena ndi die bonder?

Ndi makina osakanikirana oyika zinthu. Amaphatikiza malo oyika zinthu a SMT opangidwa ndi chakudya ndi direct-from-wafer die attach ndi flip-chip processing, kotero amagwira ntchito m'malo onse awiri opangira zinthu.

Bwanji osagwiritsa ntchito makina achikhalidwe a SMT pakufa opanda kanthu?

Makina a SMT achikhalidwe nthawi zambiri amakonzedwa bwino kuti agwiritsidwe ntchito m'ma feeder kapena ma tray. Kukonza ma wafer mwachindunji kumafuna deta ya ma wafer-map, kulekanitsa ma die, ntchito za ejector ndi flip, die buffering, kuyang'anira kwapadera komanso kutsata kwa die-level.

Kodi CA2 ingagwire ntchito ndi ma SMD ndi kufa opanda kanthu pa substrate yomweyo?

Inde. Kuthekera kosakaniza zinthu kumeneku ndi cholinga chachikulu cha nsanjayi. Kutsatana kwenikweni kumadalira ma feeder omwe aikidwa, makina osungiramo zinthu, mitu yoyika, ma module a process ndi pulogalamu yazinthu.

Kodi Direct Wafer Pickup imachotsa Die Taping?

Zingathe kuchotsa kufunika kosintha ma die oyenera kukhala tepi musanayike. Ngati izi zikuyenera kutengera mtundu wa wafer, momwe die ilili, deta yodziwika bwino komanso kasinthidwe ka wafer yomwe yaikidwa.

Kodi CA2 imasunga bwanji liwiro pamene kutola kukufa kuchokera ku wafer?

Pulatifomuyi imagwiritsa ntchito die buffering ndi kukonzekera kofanana. Dies zimatha kuchotsedwa ndikukonzedwa pamene mutu woyika ukupitiliza kukonza zinthu zina, kuchepetsa kuchedwa komwe kumachitika chifukwa cha direct wafer pickup.

Kodi ntchito yabwino kwambiri yoika anthu pamalo osindikizidwa ndi yotani?

Mitengo ya nsanja yofalitsidwa imafika mpaka 76,000 zigawo pa ola limodzi pa malo oika SMT, 54,000 zimafa pa ola limodzi pa malo oikamo zinthu kuchokera ku wafer ndi 51,000 zimafa pa ola limodzi pa malo oikamo zinthu pogwiritsa ntchito flip-chip. Zotsatira zenizeni zimadalira kapangidwe ka makina ndi chinthu chomwe chapangidwa.

Kodi kukhazikitsa CA2 imodzi kungagwiritse ntchito mitundu yosiyanasiyana ya wafer?

Ndi kasinthidwe koyenera ka wafer exchange, nsanjayi imatha kusunga ma wafer osiyanasiyana okwana 50. Izi zimathandiza zinthu zomwe zimaphatikiza mitundu ingapo ya ma die, kutengera dongosolo la wafer lomwe lakhazikitsidwa komanso kukhazikitsidwa kwa pulogalamu.

Kodi kutsata kwa single-die-level kumatanthauza chiyani?

Zimatanthauza kuti die imodzi ikhoza kulumikizidwa kuchokera pamalo ake otengera pa wafer yoyambira kupita kumalo ake omaliza oyika pa substrate, pamodzi ndi deta yoyenera yopangira ndi kuwunika.

Kodi CA2 ingalowe m'malo mwa bond iliyonse yodzipereka?

Ayi. Mapulogalamu omwe amafunikira mphamvu yapadera yolumikizira, kutentha, kuchiritsa, kugawa kapena mitundu ya die kunja kwa malo okhazikitsidwa angafunikebe zida zapadera zosonkhanitsira ma semiconductor.

Kodi CA2 ingagwiritsidwe ntchito ndi SIPLACE TX micron?

Inde. Makinawa akhoza kukonzedwa mu mzere womwewo wa SiP, ndi malo odyetsera othamanga kwambiri kapena olondola kwambiri omwe ali ofanana ndi ntchito zoyika mwachindunji komanso zoyika zosakanikirana.

Ndi chidziwitso chiti chomwe chikufunika kuti chigwirizane ndi makina a CA2 omwe agwiritsidwa ntchito kale?

Perekani zofunikira za die ndi wafer, kukula kwa substrate, kulondola kofunikira, kuchuluka kwa zigawo, kutulutsa komwe mukufuna, zomwe mukufuna kutumiza, njira zomwe mungatsatire, zofunikira pakutsata, momwe makina amafunira komanso komwe mukufuna kupita.

Yesani SIPLACE CA2 pa Njira Yanu Yopangira Ma Package Yapamwamba

Tumizani mtundu wa wafer, kukula kwa die, kukula kwa substrate, kusakaniza kwa zigawo, cholinga cholondola, zotsatira zomwe zikuyembekezeka ndi njira zomwe zingafunike kuti muwunikenso kasinthidwe.

Pemphani Kuwunikanso kwa Makonzedwe