What type of machine is the ASM SIPLACE CA4?

The ASM SIPLACE CA4 is a high-speed, large-area chip assembly platform with four placement positions and configurable conventional component-supply and SIPLACE Wafer System layouts.

Why was the SIPLACE CA4 developed?

It was developed for products that required high-output SMD placement together with wafer-supplied semiconductor dies within a more closely integrated production environment.

What is the difference between CA4, CA4-2 and CA4-4?

The legacy names are associated with different combinations of SIPLACE Wafer Systems and conventional component-supply positions. CA4-4 is wafer-system dominated, CA4-2 combines wafer and conventional supply positions, and the documented CA4 base layout uses conventional supply positions.

Can every SIPLACE CA4 pick dies directly from a wafer?

No. Direct wafer capability depends on whether SIPLACE Wafer Systems and the required die-handling hardware and software are installed on the individual machine.

Is the SIPLACE CA4 only a flip-chip machine?

No. Depending on configuration, it can support conventional SMT placement, wafer-die handling, die attach, flip-chip or mixed assembly.

What placement speed can a SIPLACE CA4 reach?

A commonly documented high-speed configuration is rated at approximately 126,500 components per hour. Actual output depends on heads, materials, substrate and process conditions.

Can the SIPLACE CA4 process large panels?

Documented configurations support large substrate formats, but the usable size depends on conveyor arrangement, accuracy, support tooling, substrate thickness and machine version.

What is the difference between SIPLACE CA4 and CA2?

The CA4 is an older four-position platform with several wafer and conventional material layouts. The CA2 is a newer integrated hybrid platform with published direct-wafer die-attach, flip-chip, SMT and multi-wafer exchange capabilities.

Can a used SIPLACE CA4 be integrated into a current SIPLACE line?

Integration is possible when conveyor flow, station software, SIPLACE Pro compatibility, factory interfaces, utilities and takt requirements are aligned.

What should be checked before purchasing a used SIPLACE CA4?

Confirm the generation, serial number, placement positions, heads, wafer systems, component tables, feeder layout, cameras, conveyor, software, licenses, condition and included accessories.

Are feeders, wafer systems and nozzles included with a SIPLACE CA4?

The supply scope varies by unit and quotation. Each feeder cart, wafer module, nozzle set, tray system, carrier and spare part should be listed individually.

INKUMBI EQHELEKILEYO YENDAWO ENKULU EHLANGANISIWEYO

I-ASM SIPLACE CA4Indibano yeeChip zeNdawo EnkuluIqonga

I-SIPLACE CA4 yenzelwe imveliso ekufuneka idibanise imveliso ephezulu, iifomathi ezinkulu ze-substrate kunye neendlela ezingaphezu kwesinye zezinto. Uyilo lwayo olunokulungiselelwa lunokubangela iidayi ezibonelelwa nge-wafer, izinto ze-feeder kunye nezinto zetreyi kwinkqubo yokuhlanganisa edibeneyo yeemodyuli ze-semiconductor, ii-elektroniki ezixutyiweyo kunye nokupakisha okuphambili kwindawo enkulu.

Hlaziya uQwalaselo lwe-CA4 Jonga ukulingana kweNkqubo

Ulwakhiwo lwe-CA4

01Indawo yokubeka

02Indawo yokubeka

03Indawo yokubeka

04Indawo yokubeka

Indlela yeZinto AIinkqubo zeSiplace Wafer

Ukuhanjiswa ngqo kwedayi, iimephu ze-wafer kunye nokuphathwa kwedayi

Indlela yeZinto BIitafile zeZondlo kunye neeComponent

Ii-SMD, iitreyi kunye nezinto ezipakishiweyo

Indibaniselwano efakiweyo yeenkqubo ze-wafer, iindawo zokubonelela ngamacandelo, iintloko zokubeka kunye nesoftware ichaza amandla omatshini ngamnye we-CA4.

CA4 · CA4-2 · CA4-4Usapho Loqwalaselo Lwelifa

Izikhundla ezine zokubekwaUyilo lwePlatform eneziphumo eziphezulu

Izinto zeWafer + zeSondloAmandla okuhlanganisa adibeneyo

Iindawo Ezinkulu Ezingaphantsi KwendawoUqwalaselo luxhomekeke

Isizathu Sokuba Eli Qela Laphuhliswe

Xa i-High-Speed SMT Placement kunye ne-Wafer-Die Assembly kufuneka zabelane ngomgca omnye

I-CA4 yeyesizukulwana sangaphambili sezixhobo ze-SIPLACE CA ezenzelwe ukuxuba izinto zemveli zokuxhoma umphezulu kunye needayi ezibonelelwa kwiiwafers. Injongo yayo yayingekuko nje ukwenza i-mounter eqhelekileyo ikhawuleze; yayikukunika imveliso ye-elektroniki ephezulu indlela esebenzayo yokongeza ukuphathwa kwedayi ye-semiconductor ngaphandle kokwahlula yonke imveliso kwimigca ye-SMT engadibaniyo kunye ne-die-bonding.

Yintoni i-ASM SIPLACE CA4?

II-ASM SIPLACE CA4liqonga lokuhlanganisa iitshiphusi elikhawulezayo nelinendawo enkulu elivela kusapho lwe-SIPLACE CA. Lisebenzisa uyilo lokubeka iindawo ezine kwaye linokucwangciswa ngemixube eyahlukeneyo yeendawo zesiqhelo zokubonelela ngezinto kunye neeNkqubo zeWafer ze-SIPLACE.

Olu lwakhiwo lwezinto ezilungisekayo lolona mahluko uphambili phakathi kwe-CA4 kunye ne-SMT mounter eqhelekileyo ye-feeder kuphela. Umatshini omnye unokulungiselelwa izinto ezipakishiweyo, ukuphathwa ngqo kwe-wafer-die okanye indibaniselwano yazo zombini, kuxhomekeke kwinguqulelo ethile ye-CA4 kunye neemodyuli ezifakiweyo.

Umsantsa Wokuvelisa Osonjululwe yi-CA4

Iimodyuli eziphambili zinokuba namakhulu okanye amawaka ezinto eziqhelekileyo kunye needayi ezingenanto, iisensa, izixhobo zeMEMS okanye iindawo ze-flip-chip. Umgca we-feeder kuphela uphatha inxalenye ye-SMD ngokufanelekileyo, ngelixa i-die bonder ezinikeleyo iphatha izinto ze-wafer kodwa isenokungahambelani nemveliso efanayo yokubeka okanye ifomathi ye-substrate.

Iqonga le-CA4 lenzelwe ukunciphisa loo msantsa ngokudibanisa ubuchwepheshe bokubeka i-SIPLACE obuphuma kakhulu kunye nokuphathwa kwe-CA-series wafer. Oku kwenza kube luncedo apho i-throughput, indawo ye-substrate kunye nokunikezelwa kwezinto ezixutyiweyo kufuneka kuqwalaselwe kunye.

Abaqhubi beMveliso

Izizathu Ezintathu Zokuba Abavelisi Basebenzise Iqonga Lohlobo lwe-CA4

Ixabiso le-CA4 livela ekudibaniseni imveliso, indawo yokusebenza kunye nokuphathwa kwezinto ezixutyiweyo endaweni yokuphucula enye yezi zinto kuphela.

01 · IMVELISO

Amanani aphezulu eenxalenye

Iimodyuli ezinkulu kunye nonxibelelwano, iimveliso zeemoto okanye zemizi-mveliso zinokufuna imveliso ephezulu nokuba indibano ineedayi ezibonelelwa nge-wafer okanye izinto ezikhethekileyo.

02 · INDAWO

Iisubstrates ezinkulu kunye neePaneli

Izixhobo ze-elektroniki ezikumgangatho wephaneli, ezifakwe ngaphakathi kunye nezinkulu zifuna okungaphezulu kokuchaneka kwepakethe encinci. Uluhlu lwee-conveyor, icebo lokuxhasa kunye nokubekwa okuzinzileyo kwindawo yokusebenza zibaluleke ngokulinganayo.

03 · IZIXHOBO

Iifomathi zeZibonelelo eziDibeneyo

Imveliso enye ingadinga ii-tape feeders, iitreyi, iitafile zezakhi kunye nobonelelo oluthe ngqo lwe-wafer. Uqwalaselo lwe-CA4 luvumela ezi ndlela zezinto ukuba zidityaniswe malunga nomxube wemveliso ofunekayo.

Isigqibo sokufaneleka kwenkqubo

Xa i-SIPLACE CA4 iluhlobo olufanelekileyo lomatshini

Eli qonga liluncedo kakhulu xa imveliso ifuna indawo enkulu yokubeka okanye indawo enkulu yokusebenza kunye nokuphathwa kwezinto ze-semiconductor ezingezizo ezisemgangathweni.

✓

Izicelo ze-CA4 eziqinileyo

Iimveliso ezidibanisa ii-SMD kunye nee-dies ezibonelelwa nge-wafer
Iipaneli ezinkulu, iibhodi ezifakwe ngaphakathi okanye ii-substrates ezikhethekileyo
Inani eliphezulu lamacandelo afuna izikhundla ezininzi zokubekwa
Iimodyuli ze-SiP kunye ne-hybrid zisebenzisa iifomathi ezahlukeneyo zezinto
Ukucubungula i-wafer ngokuthe ngqo ngemveliso ephumayo
Imigca efuna i-SIPLACE feeder kunye nokuhambelana kwesoftware
Iimveliso zakudala sele zifanelekile kwizixhobo ze-CA4

Iinkqubo Ezifuna Uphononongo Olongezelelweyo

Iimfa ezinkulu kakhulu ngaphaya koluhlu lweentloko ezifakiweyo
Iinkqubo zoxinzelelo lwe-thermocompression okanye zokubopha ngobushushu
Ukubekwa okanye ukuqiniswa ngamandla amakhulu ngaphakathi kwebhondi
Iindlela ezikhethekileyo zokusasaza azifumaneki kumatshini
Iifomathi zeWafer azixhaswa ziimodyuli zeSWS ezifakiweyo
Umsebenzi ochanekileyo kakhulu ngaphaya kweklasi ye-CA4 ecwangcisiweyo
Iimveliso ezifuna amagumbi enkqubo ye-die-bonder azinikeleyo

Uyilo lweNkqubo

Iinkqubo Ezintlanu Ezichaza Amandla Okuvelisa i-CA4

I-CA4 kufuneka ihlolwe njengenkqubo epheleleyo yokuhlanganisa. Iintloko zokubeka zibalulekile, kodwa kufuneka zihambelane nobonelelo lwezinto, umbono, uthutho kunye nesoftware.

Izikhundla zokubekwa

Iindawo ezine zokubeka ezifakelweyo zibonelela ngesakhiwo seqonga lokucubungula imveliso ephezulu. Uhlobo lwentloko kunye nemeko yokusebenza zimisela uluhlu lwangempela lwezixhobo kunye nokuchaneka kwazo.

Iinkqubo zeSiplace Wafer

Iimodyuli ze-SWS zilawula iifreyimu ze-wafer, i-die pickup, idatha ye-wafer kunye nokudluliselwa kwee-dies kwinkqubo yokubeka.

Ubonelelo lweCandelo

Iitafile zezakhi, ii-X feeders, iitreyi kunye nezinye iimodyuli zokubonelela zixhasa ii-SMD ezipakishiweyo kunye nezinto ezincedisayo.

Umbono kunye noLungelelaniso

Iikhamera ze-PCB, iikhamera zecandelo kunye nemisebenzi yokubona intloko ichonga izinto ezifihlakeleyo, iinxalenye kunye neemfa ngaphambi kokuba zibekwe ngendlela elawulwayo.

Ezothutho kunye neSoftware

Uqwalaselo lweConveyor, inkxaso yesubstrate, isoftware yesitishi kunye nedatha yeSIPLACE Pro zimisela ukuhlanganiswa kwemigca kunye nokuhlelwa kwemveliso.

Usapho Loqwalaselo Lwelifa

Ukuqonda uLwakhiwo lwezinto ze-CA4, CA4-2 kunye ne-CA4-4

Igama le-CA4 elidala linxulunyaniswa neendibaniselwano ezahlukeneyo ze-SIPLACE Wafer Systems kunye neendawo zesiqhelo zokubonelela ngamacandelo. Lo mahluko ubalulekile xa kuthengwa umatshini osetyenzisiweyo kuba ezi ndlela zintathu zenzelwe ukuxuba izinto ezahlukeneyo.

Uqwalaselo	Iinkqubo zeSiplace Wafer	Izikhundla zoNikezelo lweeCandelo	Izikhundla zokubekwa	Ingqwalasela yeMveliso eqhelekileyo
I-SIPLACE CA4-4	Izikhundla ezine zenkqubo ye-wafer	Akukho zikhundla zetafile yecandelo eliqhelekileyo kuyilo olubhaliweyo	Isine	Ukucubungula okuphezulu okulawulwa zii-dies ezibonelelwa nge-wafer kunye nezixhobo ze-semiconductor
I-SIPLACE CA4-2	Izikhundla ezimbini zenkqubo ye-wafer	Iindawo ezimbini eziqhelekileyo zokubonelela ngezinto	Isine	Imveliso exutyiweyo elungelelanisiweyo edibanisa izinto ze-wafer ngqo kunye nezinto ezibonelelwa yi-feeder okanye ezibonelelwa yitafile
I-SIPLACE CA4	Akukho zikhundla zenkqubo ye-wafer kwisakhiwo sesiseko esibhaliweyo	Izikhundla ezine zesiqhelo zokubonelela ngezinto	Isine	Ukubeka indawo enkulu ngesantya esiphezulu kusetyenziswa izinto ezipakishiweyo, iitreyi kunye neendlela zezixhobo eziqhelekileyo

Amagama oqwalaselo ewodwa akufuneki asetyenziswe njengobungqina bokugqibela boyilo olufakiweyo. Qinisekisa ipleyiti yegama lomatshini, iirekhodi zesitishi, iimodyuli ezibonakalayo, iintloko zokubekwa, iinkqubo ze-wafer kunye nesoftware ngaphambi kokuba ucaphule.

Ukuhamba komsebenzi weMveliso yeHybrid

Indlela i-CA4 eLungelelanisa ngayo iNdibano eXubekileyo yeNdawo eNkulu

Ulandelelwano oluchanekileyo luxhomekeke kwimveliso, kodwa umgca we-CA4 ocwangcisiweyo ngokubanzi ulungelelanisa ukulungiswa kwe-substrate, iindlela ezininzi zezinto, ukubekwa ngokuchanekileyo kunye nedatha yenkqubo kwizigaba ezintandathu.

Ukuseta imveliso

Iinkqubo, iimaphu ze-wafer, ii-feeders, iitreyi, iimilo zecandelo, ii-nozzles kunye nedatha ye-substrate zilungiselelwe ukuhlanganiswa okufunekayo.

Ukulayisha i-substrate

Iibhodi ezinkulu, iiphaneli okanye iimoto ezithwala iimodyuli zingena kwi-conveyor kwaye ziqiniswa yinkqubo yokuxhasa elungiselelweyo.

Inkcazo-ntetho yezinto eziphathekayo

Iinkqubo zewafer, iitafile zecomponent, iitape feeders okanye iitreyi zibonisa umxube we-die kunye ne-packed component ofunekayo.

Ulungelelwaniso lombono

Izinto ezisetyenziswayo, iidayi kunye nezinto ezisetyenziswayo ziyahlolwa kwaye zilungelelaniswe ngaphambi kokuba zibekwe kwindawo yokusebenza.

Ukubekwa okuDibeneyo

Iindawo ezine zokubeka izinto zisasaza umxube wezinto ukuze kulinganiswe imveliso, ukuchaneka kunye nokuhamba kwezinto.

Idatha kunye noDluliselo

Iziphumo zokubekwa kunye neerekhodi zemveliso zigcinwa ngaphambi kokuba i-substrate itshintshele kwiinkqubo zokuyiphinda ihambe, ukuyicoca, ukuyihlola okanye ukuyipakisha kamva.

Idatha yoMatshini oNgqinisiweyo

Amaxabiso ezixhobo ze-SIPLACE CA4 ezibhalwe rhoqo

I-CA4 inikezelwe ngeendlela ezahlukeneyo zokucwangcisa nezizukulwana. Amaxabiso angezantsi achaza ukuseta i-CA4 ekhawulezayo ebhalwe phantsi kwaye kufuneka ihlolwe ngokuchasene nomatshini ngamnye.

Musa Ukukhetha i-CA4 Esetyenzisiweyo kwiNombolo Eyodwa

Isantya esiqhelekileyo siluncedo ekuthelekiseni kokuqala, kodwa asiqinisekisi amandla e-direct-wafer, umxube wentloko ofakiweyo okanye indawo yokusebenza esebenzisekayo ngokuchaneka okufunekayo.

Uqwalaselo lwentloko luchaphazela isantya kunye noluhlu lwamacandelo
Ubungakanani be-SWS bumisela umthamo we-wafer ngqo
Imo yeConveyor ichaphazela indawo exhaswayo ye-substrate
Isoftware kunye neelayisenisi zichaphazela imisebenzi yenkqubo esebenzisekayo
Imeko yomatshini ichaphazela ukuphindaphindwa kunye nemveliso

Into ebhekisa kuyo	Ixabiso Elibhalwe Ngokwesiqhelo	Oko Kufuneka Kuqinisekiswe
Isantya sokubekwa	Ukuya kuthi ga kwi-126,500 components ngeyure	Indibaniselwano yentloko, umxube wezinto, indlela yenkqubo kunye nokwenza ngcono isoftware
Ukuchaneka kokubekwa	Malunga ne-±15 µm kwi-3 sigma kulungiselelo lwe-C&P20 M2 / CPP M olubhaliweyo	Iilebhile zentloko ezifakiweyo, iklasi yokulinganisa kunye nendawo yokusebenza efanelekileyo
Umthamo wesondlo	Iimodyuli ze-tape-feeder ezifikelela kwi-160 kulungiselelo lwesiqhelo lokubonelela	Uyilo lwetafile yecandelo lokwenyani kunye neekharethi zesondlo ezibandakanyiweyo
Uluhlu lwecandelo	Itshiphu encinci malunga ne-15 × 15 mm kuxhomekeke entlokweni	Ubuncinci, ubuninzi, ukuphakama kunye nezixhobo zokuthathwa kwentloko ethile
Ubungakanani besubstrate	Malunga ne-50 × 50 mm ukuya kwi-650 × 700 mm kwiindlela ezibhaliweyo zokucwangcisa	Uhlobo lweConveyor, imfuneko yokuchaneka, inkxaso kunye nesikhokelo sothutho
Ubukhulu be-substrate	Malunga ne-0.3 ukuya kwi-4.5 mm	Izinto zebhodi, i-warpage, i-carrier kunye neemfuno ze-clamp
Ubukhulu bomatshini	Malunga ne-1,950 × 2,740 × 1,572 mm	Inguqulelo echanekileyo, ukhetho, ukususwa kwenkonzo kunye noyilo lomgca
Ubunzima bomatshini	Malunga ne-3,674 kg	Uqwalaselo lokuthumela, ukulayisha umgangatho kunye neemodyuli ezibandakanyiweyo
Ukunikezwa Amandla	3 × 380 ukuya kwi-415 V, 50/60 Hz kwiifayile ezibhaliweyo	Ipleyiti yegama lomatshini kunye nezixhobo ezisetyenziswa kwindawo oya kuyo-kwifektri
Umoya ocinezelweyo	Malunga ne-0.5 ukuya kwi-1.0 MPa	Uxinzelelo olufunekayo, umgangatho, ukusetyenziswa kunye noqhagamshelo

Ulawulo lweNkqubo yeNdawo eNkulu

Kutheni Indawo Enkulu Yokusebenza Ifuna Okungaphezulu Komthumeli Obanzi

Iiphaneli ezinkulu kunye nee-substrates zizisa iimeko zoomatshini kunye nezokukhanya ezinokuchaphazela umgangatho wokubekwa. Iziphumo ezizinzileyo zixhomekeke kwinkxaso, imephu, iziqinisekiso kunye nolwalamano phakathi kokuchaneka kunye nendawo yokusebenza.

01 · INKXASO

Ulawulo lweWarpage

Ii-substrates ezinkulu okanye ezincinci zinokugoba phantsi kobunzima bazo. Iiphini, iithwali okanye izixhobo zokuxhasa ezizinikeleyo kufuneka zizinzise umphezulu wokubekwa.

02 · UMBONO

Isicwangciso soBuchule

Iingcali zengingqi nezehlabathi jikelele zinceda ekulungiseni ukwanda kwe-substrate, ukujikeleza kunye nokwahluka kobukhulu kwindawo enkulu yokusebenza.

03 · EZOTHUTHO

I-Conveyor kunye ne-Clamping

Ububanzi bebhodi, ubukhulu, ubunzima kunye nokususwa komphetho kugqiba ukuba ngaba kufuneka uthutho oluqhelekileyo okanye uthutho olukhethekileyo.

04 · INKQUBO

Ukusasazwa kweNdawo

Iinkqubo mazizahlule iindawo phakathi kweendawo zokubeka izinto ngelixa zinciphisa uhambo, ziphephe ukungqubana kwaye zikhusele ixesha lokuthatha izinto.

Icebo lokuNikezela ngeZinto

Iindlela Ezintathu Zezinto Ezisetyenziswa Kwimveliso ye-CA4

Uyilo lwe-CA4 olukhethiweyo lufanele lubonise indlela uninzi lwezinto ezingena ngayo kule nkqubo. Imveliso elawulwa yi-wafer ifuna umatshini owahlukileyo kunepaneli enkulu elawulwa yi-feeder.

Indlela 01

Ubonelelo lweWafer ngqo

Iinkqubo ze-SIPLACE Wafer zibonisa iidayi ezingenanto zokuthathwa ngokweemephu ze-wafer kunye noqwalaselo olufakelweyo lokuphatha idayisi.

Idatha eyaziwayo
Ukuhambelana kwesakhelo se-wafer
I-ejector ye-die kunye nokudluliselwa
Ukubekwa ngqo kwedayi

Indlela 02

I-Tape kunye ne-Feeder Supply

Ii-feeders ze-SIPLACE eziqhelekileyo zibonelela ngezinto ezingasebenziyo, ii-IC ezipakishiweyo kunye nezinye izinto ze-tape-and-reel xa zivelisa kakhulu.

Ukuhambelana kwe-X feeder
Ububanzi beeteyiphu ezininzi
Ukuzaliswa kwakhona ngokukhawuleza
Umthamo ophezulu wezinto

Indlela 03

Iitreyi kunye neempahla ezikhethekileyo zokuthwala

Iitreyi zeJEDEC, iitafile zezixhobo kunye nezixhobo zokuphatha ezisetyenziswa ngokukodwa ezingafanelekanga ukupakishwa kweteyiphu.

Izixhobo ezinkulu ezipakishiweyo
Izinto ezinobuzaza
Izinto zomzekelo kunye nezixhobo ezinomthamo ophantsi
Iifomathi ezikhethekileyo ze-substrate okanye ze-carrier

Ukukhethwa kweQonga

I-SIPLACE CA4 okanye i-SIPLACE CA2?

Zombini zingamalungu osapho lwe-CA, kodwa akufuneki ziphathwe njengezinokutshintshwa. I-CA4 liqonga lemveli elinezikhundla ezine eziphezulu elineendlela ezahlukeneyo zoyilo lwezinto, ngelixa i-CA2 iyinkqubo entsha ye-compact hybrid ephuhliswe malunga ne-SMT edibeneyo, i-die-attach kunye ne-flip-chip production.

Iqonga Eliphezulu Lexesha Elidala

I-SIPLACE CA4

Eyona nto ivavanywe kakuhle apho imveliso, umgca okanye inkqubo ekhoyo ifanelekile malunga ne-CA4, okanye apho kufuneka izikhundla ezine zokubeka, ukuphathwa kwendawo enkulu kunye noqwalaselo lwe-SWS oludala.

Uyilo loomatshini abanezikhundla ezine
Ulwakhiwo lwe-CA4, CA4-2 kunye ne-CA4-4
Indawo enkulu kunye nokugxila kwindibano enkulu
Ukubaluleka okukhulu kwimveliso esemgangathweni yelifa
Amandla oomatshini ayahluka kakhulu ngokwendlela efakiweyo

Iqonga elitsha elihlanganisiweyo leHybrid

I-SIPLACE CA2

Ilungele ngcono amaqela avavanya iqonga elitsha le-CA eline-direct-wafer die attach echaziweyo, i-flip-chip, indawo ye-SMT, ukutshintshiselana kwe-multi-wafer kunye nemisebenzi yanamhlanje yokulandelela.

Ingcamango yokubekwa kwe-hybrid edibeneyo
I-die attach ethe ngqo kunye ne-flip chip
Uyilo lwesakhiwo sokutshintshiselana nge-wafer yanamhlanje
Iiklasi ezichaziweyo zokuchaneka kwe-10, 15 kunye ne-20 µm
Yenzelwe imigca yokupakisha edibeneyo ephucukileyo

Hlaziya isisombululo se-SIPLACE CA2

Ukuhlanganiswa koMgca

Ukuhlolwa Okune Ngaphambi Kokongeza i-CA4 Kumgca Okhoyo

I-CA4 esetyenzisiweyo isenokungasebenzi kakuhle ngoomatshini kodwa ingafaneleki kwifektri ukuba uthutho, isoftware, uthutho lwezinto okanye ixesha lokuthathwa azilungelelaniswanga.

Ukuhamba kweSubstrate

Qinisekisa ukuphakama komthumeli, icala, ukuhanjiswa kwebhodi, ukulungiswa kobubanzi kunye nokuhambelana nezixhobo eziphezulu nezisezantsi.

Ibhalansi yoMgca

Bala ixesha lokubekwa ngokwendlela yosapho lwecandelo kunye nendlela yezinto ezibonakalayo endaweni yokuthelekisa i-CPH eqhelekileyo kuphela.

Imeko yeSoftware

Hlola inguqulelo ye-SIPLACE Pro, isoftware yesitishi, iilayisenisi, iilayibrari zecandelo kunye nokuhambelana komdibaniso.

Izinto zoLungiselelo lwezinto

Cwangcisa iifreyimu ze-wafer, iinqwelo zokutya, iitreyi, utshintsho, indawo yokugcina kunye nokugcwalisa kwakhona malunga noqwalaselo lwe-CA4 olukhethiweyo.

Iindawo zoSetyenziso

Iimveliso Ezixhamlayo kwi-CA4 Large-Area Hybrid Assembly

Eli qonga libalulekile apho ubungakanani bemveliso, ubungakanani bezinto kunye nokwahlukahluka kwezinto zenza indlela elula yokuvelisa izinto ezisetyenziswa kwi-feeder kuphela ingasebenzi kakuhle.

Iimodyuli zeNkqubo kwiPhakheji

Iimodyuli ezininzi ezidibanisa ii-passives, ii-IC ezipakishiweyo kunye ne-die enye okanye ezingaphezulu ezibonelelwa nge-wafer.

Izixhobo ze-elektroniki zeHybrid zeNdawo Enkulu

Iiphaneli kunye nee-substrates ezinkulu ezifuna inani eliphezulu lamacandelo, inkxaso yebhodi ezinzileyo kunye nokubekwa ngokuchanekileyo kwindawo yokusebenza.

Izixhobo zoNxibelelwano

Iimodyuli ze-RF, inethiwekhi kunye neziseko zophuhliso ezisebenzisa amaqela amaninzi kunye nezixhobo ezikhethekileyo ze-semiconductor.

I-Automotive Electronics

Iimodyuli zolawulo, ukuva kunye namandla ezifuna ukubekwa okuphindaphindwayo, ukuphathwa kwezinto ezilandelekayo kunye nenkxaso eqinileyo yesiseko.

Iimodyuli zamandla kunye nezenzwa

Iindibano ezidibanisa ii-dies ezibuthathaka, abaqhubi abapakishiweyo, ii-passives kunye nabathwali abakhethekileyo besicelo.

Iimveliso Ezifanelekileyo Zelifa

Ukudluliselwa kwemveliso, ukwandiswa kwamandla kunye neeprojekthi zokutshintshwa koomatshini ezakhiwe ngokusekwe kwiinkqubo ze-CA4 ezikhoyo kunye nokuvunywa kwenkqubo.

Ukuqinisekiswa koomatshini abasetyenzisiweyo

Oko Kufuneka Kuqinisekiswe kwi-SIPLACE CA4 ekhoyo

Oomatshini be-CA4 banokwahluka ngokwendlela yokuvelisa, uyilo lwezinto, iintloko, uhlobo lwekhamera, umthumeli kunye nesoftware. Ukuhambelana ngokuchanekileyo kwezixhobo kufuna ubungqina obubonakalayo kunye nesoftware evela kwiyunithi nganye.

Ubungqina boBume obuCelwayo

Amaxwebhu acacileyo anciphisa umngcipheko wokufumana umatshini onegama elichanekileyo lemodeli kodwa unezixhobo okanye uyilo lwenkqubo olungalunganga.

Ipleyiti yegama lomatshini kunye nenombolo epheleleyo ye-serial
I-CA4, i-CA4 V2 okanye olunye ulwazi lokuvelisa
Iifoto zazo zonke izikhundla ezine zokubekwa
Iilebhile zemodeli yentloko kunye noqwalaselo lwekhamera
Iinkcukacha zobungakanani be-SWS kunye nenkqubo ye-wafer
Itafile yecandelo, inqwelo yokutya kunye noyilo lwetreyi
I-Conveyor, izixhobo zenkxaso kunye noluhlu lweebhodi
Isoftware yesitishi kunye nolwazi lwe-SIPLACE Pro
Uvavanyo olusebenzayo, ukulinganiswa kunye neerekhodi zokugcina

Ukuveliswa koomatshiniQinisekisa ukuba isixhobo se-CA4, i-CA4 V2 okanye olunye uhlobo olubhaliweyo.

Iintloko zokubekwaQinisekisa amagama eentloko ezichanekileyo, ubungakanani beentloko, iiyure zokusebenza, ukulinganiswa kunye noluhlu lwezakhi.

Iinkqubo zeWaferQinisekisa ubungakanani be-SWS, ubungakanani be-wafer, iiyunithi zokudlulisa, iikhamera kunye nezixhobo ze-wafer ezifakiweyo.

Izikhundla zokubonelelaChonga iitafile zezakhi, iimodyuli zesondlo, iiyunithi zetreyi kunye neekhareji ezibandakanyiweyo.

Izixhobo zokubonaJonga uhlobo lwekhamera ye-PCB, iikhamera zecandelo, ukukhanya kunye nokuhambelana kwesoftware.

Inkqubo yezothuthoQinisekisa uluhlu lwe-substrate, indlela eya kuyo, inkxaso, ii-clamps kunye neenkampani ezikhoyo.

IsoftwareHlaziya inguqulelo yesitishi, iilayisenisi, iinkqubo zomgca, iilayibrari zecandelo kunye neendawo zonxibelelwano.

Ububanzi boboneleloBhala uluhlu lwezinto zokondla, ii-nozzles, iindawo ezingasetyenziswayo, iincwadana, izixhobo, ukupakisha ngaphandle kunye nenkxaso yokufaka.

Inkxaso yezixhobo kunye neenxalenye

Inkxaso yeeMatshini ze-SIPLACE CA4 kunye neeModyuli zeMveliso

Ukudibanisa oomatshini kunye namacandelo okutshintshwa kufuneka kusebenzise ilebhile yemodyuli efakiweyo, inombolo yenxalenye yokuqala, ulwazi olulandelelanayo kunye nesicelo endaweni yegama lemodeli ye-CA4 kuphela.

Udidi lweZixhobo

Izixhobo zeDie Bonder

Thelekisa i-CA4 namaqonga azinikeleyo okuhlanganisa i-die-attach kunye ne-semiconductor kwiinkqubo ezikhethekileyo.

Jonga Izixhobo zeDie Bonder → Ubonelelo lwezinto

Iziphakeli ze-ASM SIPLACE

Inkxaso yeeyunithi ze-feeder ezihambelanayo, ububanzi beteyiphu, iindawo ze-feeder kunye nokuseta izixhobo zemveliso.

Jonga ii-ASM feeders → Inkxaso yoQwalaselo

Ukufaniswa koMatshini we-CA4 kunye neeCandelo

Thumela iilebheli zomatshini, iifoto zemodyuli, iinombolo zenxalenye kunye neemfuno zemveliso ukuze zihlolwe.

Xoxa ngeMfuno yakho →

Imibuzo ebuzwa qho

Imibuzo yeNkqubo kunye noQwalaselo lwe-ASM SIPLACE CA4

Iimpendulo zamaqela ahlola indibano enkulu ye-CA4, uyilo lwenkqubo ye-wafer, imveliso yakudala kunye nezixhobo ezisetyenzisiweyo.

Loluphi uhlobo lomatshini i-ASM SIPLACE CA4?

Liqonga lokuhlanganisa iitshiphusi elikhawulezayo nelinendawo enkulu elivela kusapho lweSIPLACE CA. Lisebenzisa izikhundla ezine zokubeka kwaye linokulungiselelwa ngobonelelo lwezixhobo zesiqhelo, iiSIPLACE Wafer Systems okanye indibaniselwano yazo zombini.

Kutheni le nto kwaveliswa i-SIPLACE CA4?

Yenzelwe iimveliso ezazifuna ukubekwa kwe-SMD enemveliso ephezulu kunye nee-semiconductor dies ezibonelelwa nge-wafer. Eli qonga livumele ezi ndlela zezinto ukuba zidityaniswe ngokusondeleyo kwindawo enye yemveliso.

Yintoni umahluko phakathi kwe-CA4, CA4-2 kunye ne-CA4-4?

Amagama asele ekhulile anxulunyaniswa neendibaniselwano ezahlukeneyo zeSIPLACE Wafer Systems kunye neendawo zesiqhelo zokubonelela ngezinto. I-CA4-4 ilawulwa yinkqubo ye-wafer, i-CA4-2 idibanisa iindawo ezimbini ze-wafer kunye neendawo ezimbini zokubonelela ngezinto zesiqhelo, kwaye uyilo lwesiseko se-CA4 olubhaliweyo lusebenzisa iindawo zesiqhelo zokubonelela ngezinto zesiqhelo.

Ngaba yonke i-CA4 pick iyafa ngqo kwi-wafer?

Hayi. Ubuchule be-wafer ngqo buxhomekeke ekubeni ii-SIPLACE Wafer Systems kunye nehardware kunye nesoftware efunekayo yokuphatha idayethi zifakwe ngokwasemzimbeni na kumatshini ngamnye.

Ingaba i-CA4 ngumatshini we-flip-chip kuphela?

Hayi. Ngokuxhomekeke kuqwalaselo, ingasetyenziselwa ukubeka i-SMT eqhelekileyo, ukuphatha i-wafer-die, i-die attach, i-flip-chip okanye i-mixed assembly. Ububanzi benkqubo yokwenyani kufuneka buqinisekiswe kwiimodyuli ezifakiweyo.

Ingakanani isantya sokubekwa kwe-SIPLACE CA4?

Uqwalaselo oluqhelekileyo olunesantya esiphezulu olubhalwe phantsi lulinganiselwa kwi-126,500 components ngeyure. Imveliso yokwenyani ixhomekeke kwiintloko, umxube we-component, ukusebenza kwe-wafer, ubungakanani be-substrate, umgama wokuhamba kunye nokulinganisela komgca.

Ngaba i-CA4 ingakwazi ukucubungula iiphaneli ezinkulu?

Uqwalaselo olubhaliweyo luxhasa iifomathi ezinkulu ze-substrate, kodwa ubungakanani obusebenzisekayo buxhomekeke kulungiselelo lokuhambisa, ukuchaneka kokubekwa, izixhobo zenkxaso, ubukhulu be-substrate kunye nohlobo lomatshini.

Yintoni umahluko phakathi kwe-SIPLACE CA4 kunye ne-CA2?

I-CA4 liqonga elidala elineendawo ezine elinee-wafer ezininzi kunye noyilo lwezinto eziqhelekileyo. I-CA2 liqonga elitsha elihlanganisiweyo elihlanganisiweyo elinamandla okuncamathisela i-wafer ngqo, i-flip-chip, i-SMT kunye nokukwazi ukutshintshiselana nge-wafer ezininzi.

Ngaba i-CA4 esetyenzisiweyo ingadityaniswa kumgca we-SIPLACE wangoku?

Ukudibanisa kunokwenzeka xa ukuhamba kothutho, isoftware yesitishi, ukuhambelana kwe-SIPLACE Pro, iilayibrari zecandelo, i-interfaces yefektri, izixhobo zokusebenza kunye neemfuno zomgca zihambelana.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-CA4 esetyenzisiweyo?

Qinisekisa ukwenziwa, inombolo yeserial, zonke iindawo ezine zokubeka, iilebhile zentloko, iinkqubo zewafer, iitafile zecandelo, uyilo lwefeeder, iikhamera, i-conveyor, isoftware, iilayisenisi, imeko yomatshini kunye nezixhobo ezifakiweyo.

Ngaba izinto zokutyela, iinkqubo ze-wafer kunye nee-nozzles zifakiwe kumatshini?

Ububanzi bobonelelo buyahluka ngokweyunithi kunye nexabiso. Inqwelo nganye yokuphakela, imodyuli ye-wafer, iseti yemilomo, inkqubo yetreyi, umthwali kunye nenxalenye eseleyo kufuneka zidweliswe ngokwahlukeneyo ngaphambi kokuba zithengwe.

Hlaziya i-SIPLACE CA4 kwiNkqubo yakho yokuHlanganisa indawo enkulu

Thumela iindlela zezinto ezifunekayo, ifomathi ye-wafer, uluhlu lwezakhi, ubukhulu be-substrate, imveliso ekujoliswe kuyo, uqwalaselo olukhethwayo lwe-CA4 kunye nendawo ekuyiwa kuyo ukuze kufaniswe izixhobo.

Cela uHlolo loBume