TEL CELLESTATM -i MD ekyuma ekiyonja wafer

TEL CELLESTATM -i MD ye nkola ya Tokyo Electron (TEL) enkulu eya mmita 300 ey’okuyonja wafer emu ku 10nm n’enkola ey’omulembe ennyo. Ekoleddwa mu ngeri ey’enjawulo okukola ku kusoomoozebwa kw’enkola enkulu ng’okusobola kw’ebizimbe ebirina enkola entonotono okwonooneka mu kiseera ky’okwoza n’okukala mu nkola ez’omulembe, era kye kyuma ekikulu ekiwagira amakungula amalungi aga chips ez’omulembe.

Enkola Enkulu: Okumenya Tekinologiya n’Obuwagizi bwa Data

Okusobola okuwa okutegeera okutegeerekeka obulungi, ebintu byayo ebikulu eby’ekikugu bifunze wansi:

Ebikulu Ebiraga Enkola y’emirimu n’ebikwata ku by’ekikugu

Enkola Positioning Targeting 10nm n'okusingawo enkola ey'omulembe nodes, okukuguka mu non-destructive cleaning n'okuggya obutundutundu ku patterned wafer surfaces.

Tekinologiya Omukulu: Okwoza n’okukala Kutuuka ku kukala okutaliimu kugwa kwa mutindo okuyita mu kufuga empewo y’ekisenge n’okulongoosa omulimu gw’entuuyo za IPA (isopropyl alcohol); asobola okukozesa ebisengejja eby’eddagala nga SC-1 ne DHF okukola wet etching; era esobola okugatta emirimu gy’okuyonja mu mubiri nga okusiimuula n’okufuuyira amazzi abiri.

High-efficiency output and modularity: Configurable n’ebisenge ebiyonja ebituuka ku 20, okutuuka ku busobozi bwa wafers okutuuka ku 1000 buli ssaawa (WPH), era nga ewagira okugaziya okukyukakyuka kwa bevel cleaning units.

Okukola ku ssente entono: Enkola ya Chemical Recycle ezimbiddwamu ekendeeza nnyo ku nsaasaanya y’emirimu (CoO) era ekekkereza bulungi enkozesa ya asidi wa sulphuric.

Obwesigwa: Enkola yaayo ey’entambula ebadde eyitamu enzirukanya y’okukwata wafer obukadde 750 nga tewali kukakasa nsobi, okukakasa nti okufulumya mu bungi kutebenkera nnyo.

Enkozesa: Olw’okukulembera tekinologiya waayo n’omulimu ogutebenkedde, CELLESTATM -i MD ekozesebwa nnyo mu kukola ebyuma eby’omulembe ebya semikondokita, ng’ekola kinene mu bintu bino wammanga:

Logic chips: Ewa wafer surfaces ennyonjo okukola logic chips ezikola obulungi nga CPUs, GPUs, ne AI processors.

Memory chips: Ekozesebwa mu kukola memory chips nga DRAM ne 3D NAND Flash, okukakasa obutuufu era obwesigwa bw’obutoffaali bw’okujjukira.

Okupakinga okw’omulembe: Kukozesebwa nnyo mu mitendera gy’okuyonja enkola ez’omulembe ez’okupakinga nga BSI (back-illuminated), 3D stacking, back-powered, ne SoIC (system-on-chip).

Okwekenenya amakolero n’embeera y’akatale

Nga model ey’omulembe mu CELLESTA series, -i MD ekiikirira TEL’s top-tier level mu kwoza single-wafer. Olw’omutindo gwayo ogw’okuyonja ogw’ekika ekya waggulu n’obwesigwa obw’amaanyi obumanyiddwa, omuddirirwa guno ogw’emikutu, awamu ne SCREEN, gunywedde nnyo mu kifo eky’okukulembera mu katale k’ebyuma ebiyonja ebya semiconductor mu nsi yonna, ekigufuula ebyuma ebiteetaagisa ebiwagira okukola ennyo chips ez’omulembe.