TEL CELLESTA™ -i MD wafer cleaner

The TEL CELLESTA™ -i MD is Tokyo Electron's (TEL) flagship 300mm single-wafer cleaning system for 10nm and more advanced process nodes. It is specifically designed to address core process challenges such as the susceptibility of micro-patterned structures to damage during cleaning and drying in advanced processes, and is a key device supporting improved yields for high-end chips.

Core Performance: Technology Breakdown and Data Support

To provide a more intuitive understanding, its key technical features are summarized below:

Key Features Performance Indicators and Technical Details

Process Positioning Targeting 10nm and more advanced process nodes, specializing in non-destructive cleaning and particle removal of patterned wafer surfaces.

Core Technologies: Cleaning and Drying Achieves pattern collapse-free drying through chamber atmosphere control and IPA (isopropyl alcohol) nozzle performance optimization; can utilize chemical solutions such as SC-1 and DHF for wet etching; and can integrate physical cleaning functions such as brushing and dual-fluid spraying.

High-efficiency output and modularity: Configurable with up to 20 cleaning chambers, achieving a capacity of up to 1000 wafers per hour (WPH), and supporting flexible expansion of bevel cleaning units.

Low-cost operation: Built-in Chemical Recycle system significantly reduces operating costs (CoO) and effectively saves sulfuric acid consumption.

Reliability: Its transport system has undergone 750 million wafer handling cycles with zero error verification, ensuring extremely high mass production stability.

Applications: Thanks to its leading technology and stable performance, CELLESTA™ -i MD is widely used in the production of advanced semiconductor devices, playing an indispensable role in the following areas:

Logic chips: Provides clean wafer surfaces for the manufacture of high-performance logic chips such as CPUs, GPUs, and AI processors.

Memory chips: Used in the production of memory chips such as DRAM and 3D NAND Flash, ensuring the accuracy and reliability of memory cells.

Advanced packaging: Widely used in the cleaning steps of advanced packaging processes such as BSI (back-illuminated), 3D stacking, back-powered, and SoIC (system-on-chip).

Industry Evaluation and Market Position

As a high-end model in the CELLESTA series, the -i MD represents TEL's top-tier level in single-wafer cleaning. With its superior cleaning performance and recognized high reliability, this series of platforms, along with SCREEN, firmly holds a leading position in the global semiconductor cleaning equipment market, making it an indispensable piece of equipment supporting the mass production of cutting-edge chips.