Isicoci se-wafer se-TEL CELLESTA™ -i MD

I-TEL CELLESTA™ -i MD yinkqubo yokucoca i-flagship ye-Tokyo Electron (TEL) eyi-300mm ye-single-wafer yokucoca i-10nm kunye ne-process nodes eziphambili. Yenzelwe ngokukodwa ukujongana nemingeni ephambili yenkqubo efana nokuchaphazeleka kwezakhiwo ezineepatheni ezincinci ekonakalisweni ngexesha lokucoca nokomisa kwiinkqubo eziphambili, kwaye sisixhobo esiphambili esixhasa isivuno esiphuculweyo seetships eziphezulu.

Ukusebenza okuPhambili: Ukwahlulwahlulwa kobuChwepheshe kunye neNkxaso yeDatha

Ukuze kufumaneke ukuqonda okucacileyo, iimpawu zayo zobugcisa eziphambili zishwankathelwe ngezantsi:

Iimpawu eziphambili Izalathisi zokusebenza kunye neenkcukacha zobugcisa

Ukubeka Inkqubo Kujoliswe kwi-10nm kunye nee-process nodes eziphambili, ezigxile ekucoceni okungonakalisiyo kunye nokususa amasuntswana kwiindawo ze-wafer ezineepatheni.

Iiteknoloji eziphambili: Ukucoca nokomisa Ifezekisa ukomisa okungenamaphethini ngokulawula umoya wegumbi kunye nokuphucula ukusebenza kwe-nozzle ye-IPA (isopropyl alcohol); ingasebenzisa izisombululo zeekhemikhali ezifana ne-SC-1 kunye ne-DHF ukuze i-wet etching; kwaye ingadibanisa imisebenzi yokucoca ngokomzimba efana nokubrasha kunye nokutshiza nge-dual-fluid.

Imveliso esebenza kakuhle kakhulu kunye nemodyuli: Ingalungiswa ngamagumbi okucoca afikelela kuma-20, ifikelela kumthamo weewafers ezili-1000 ngeyure (WPH), kwaye ixhasa ukwandiswa okuguquguqukayo kweeyunithi zokucoca ze-bevel.

Ukusebenza ngexabiso eliphantsi: Inkqubo yokubuyisela iikhemikhali eyakhelwe ngaphakathi inciphisa kakhulu iindleko zokusebenza (i-CoO) kwaye igcina ngokufanelekileyo ukusetyenziswa kwe-sulfuric acid.

Ukuthembeka: Inkqubo yayo yokuthutha idlule kwimijikelo yokuphatha iiwafer ezizizigidi ezingama-750 ngaphandle kokuqinisekiswa kweempazamo, okuqinisekisa uzinzo oluphezulu kakhulu kwimveliso.

Izicelo: Ngenxa yetekhnoloji yayo ehamba phambili kunye nokusebenza okuzinzileyo, i-CELLESTA™ -i MD isetyenziswa kakhulu kwimveliso yezixhobo ze-semiconductor eziphambili, idlala indima ebalulekileyo kwezi ndawo zilandelayo:

Iitships zeLogic: Ibonelela ngeendawo ezicocekileyo ze-wafer zokwenza iitships zeLogic ezisebenzayo kakhulu ezifana neeCPU, iiGPU, kunye neeprosesa ze-AI.

Iitships zememori: Zisetyenziswa ekuveliseni iitships zememori ezifana ne-DRAM kunye ne-3D NAND Flash, ukuqinisekisa ukuchaneka nokuthembeka kweeseli zememori.

Ukupakisha okuphucukileyo: Kusetyenziswa kakhulu kumanyathelo okucoca iinkqubo zokupakisha eziphucukileyo ezifana ne-BSI (back-illuminated), i-3D stacking, i-back-powered, kunye ne-SoIC (system-on-chip).

Uvavanyo lweShishini kunye nesikhundla seMarike

Njengomzekelo ogqwesileyo kuthotho lweCELLESTA, i--i MD imele inqanaba eliphezulu le-TEL ekucoceni i-single-wafer. Ngenxa yokusebenza kwayo okuphezulu kokucoca kunye nokuthembeka okuphezulu okuqatshelwayo, olu luhlu lwamaqonga, kunye ne-SCREEN, lubambe isikhundla esiphambili kwimarike yehlabathi yezixhobo zokucoca ze-semiconductor, okwenza ukuba ibe sisixhobo esibalulekileyo esixhasa ukuveliswa ngobuninzi kweetships eziphambili.