SAKI SMT 2D AOI mishiinka BF-TristarⅡ

Kuwa soo socdaa waa horudhac dhammaystiran oo faahfaahsan SAKI 2D AOI BF-TristarⅡ

1.1 Mabaadi'da Sawirka indhaha

Farsamada Iftiinka Goobta Iftiiminta:

Dusha sare ee PCB waxaa iftiiminaya xagal badan oo iftiin sare leh oo iftiinka LED ah (isku-darka casaanka / cagaarka / buluugga / caddaanka), iyo kala duwanaanshaha milicsiga ee u dhexeeya wadajirka alxanka iyo walxaha asalka ah ayaa loo isticmaalaa in lagu qabto sawirro isbarbar dhig ah. Kala-goysyada alxanka fudud waxay muujinayaan milicsiga muraayadda (aagga dhalaalaya), halka meelaha cilladaysan (sida dildilaaca iyo daasadda aan ku filnayn) loo soo bandhigo meelo mugdi ah oo ay ugu wacan tahay milicsiga fidsan.

Sawir-qaadista laba-track:

Laba qaybood oo kamarado toosan toosan ah (ilaa 10μm/pixel) ayaa si isku mid ah u baadha dusha sare iyo hoose ee PCB-ga, oo ay weheliso sawir-sameeyaha sawirka-xawaaraha sare leh ee falanqaynta-waqtiga-dhabta ah.

1.2 Caqliga ogaanshaha cillad

Isbarbardhigga jaantuska: Is barbar dhig farqiga u dhexeeya booska iyo qaabka kala duwanaanshaha u dhexeeya maktabadda wadajirka/qaybaha alxanka iyo sawirka dhabta ah.

Falanqaynta Grayscale/geometric: Go'aami cilladaha sida kala-goysyada alxanka qabow iyo isku-xidhka qaybinta dhalaalka wadajirka ah iyo hufnaanta kontoorka.

Kala soocida AI-caawisay: Algorithms barashada qoto dheer waxay soo saartaa sifooyin cilladaha adag (sida BGA alxanka kubbadda) si loo yareeyo xukun-xumada.

2. Faa'iidooyinka asaasiga ah

Cabirka faa'iidada waxqabadka gaarka ah

Saxnaanta ogaanshaha Waxay aqoonsan kartaa qaybaha 01005 (0.4mm × 0.2mm) iyo ciladaha wadajirka ah ee heerka-yar ee alxanka (sida dildilaaca 5μm).

Xawaaraha iyo hufnaanta Naqshadaynta ogaanshaha laba-track waxa ay gaartaa 0.25 ilbiriqsi/dhibcood, taas oo in ka badan 30% ka dhaqso badan hal-track AOI.

La qabsigu Waxay taageertaa xaaladaha kakan sida PCB adag, FPC (loox dabacsan), iyo alxanka macdanta rasaasta oo aad u iftiimaya.

Hagaajinta is-waxbarasho ee caqliga leh ee AI, heerka qaylo-dhaanta beenta ah <0.1%, yaraynta kharashyada dib-u-baadhista gacanta.

Kordhinta waxa lagu xidhi karaa SPI, ICT iyo qalab kale si loo dhiso hab-socod buuxa oo tayo xidhan.

3. Tilmaamaha farsamada

3.1 Naqshadaynta qalabka

Nidaamka nalka ee kala duwan:

Isha iftiinka LED-ka ee 8-jiho ah, waxay taageertaa hagaajinta firfircoon ee hirarka dhererka iyo xagasha, si loo daboolo baahiyaha ogaanshaha iibiyeyaasha kala duwan (sida SAC305 iyo SnPb).

Qaab dhismeed farsamaysan oo adag:

Saldhigga marmar + wadista matoorka toosan si loo hubiyo xasilloonida sawirida (ku celi saxnaanta meelaynta ± 5μm).

3.2 Hawlaha Software

Falanqaynta jilitaanka 3D:

Dib u dhis xogta dhererka wadajirka ah ee alxanka iyadoo lagu salaynayo sawirada 2D, oo si dadban u ogow cilladaha 3D sida bogaga-wareerka iyo koollada alxanka oo aan ku filnayn.

Maareynta cuntada

Waxa uu kaydin karaa in ka badan 1000 barnaamij oo kormeer ah, waxana uu taageeri karaa beddelka hal-guji ee moodooyinka alaabta.

4. Tilmaamaha

Qaybta Faahfaahinta faahfaahsan

Cabbirka PCB ee kala duwan ee kormeerka: 50mm × 50mm ~ 510mm × 460mm (loox aad u weyn oo la beddeli karo)

Xallinta indhaha Heerka 10μm/pixel (ilaa 5μm/pixel ikhtiyaari ah)

Xawaaraha kormeerka 0.25 ~ 0.5 ilbiriqsi/barta kormeerka (waxay kuxirantahay kakanaanta)

Interface isgaarsiinta SECS/GEM, TCP/IP, RS-232, waxay taageertaa is dhexgalka nidaamka MES

Shuruudaha korantada AC 200-240V, 50/60Hz, isticmaalka korontada ≤1.5kW

5. modules functional

5.1 Hawlaha kormeerka asaasiga ah

Kormeerka wadajirka ah ee alxanka:

Kala-goysyada alxanka SMT: Kubad alxanka BGA ayaa maqan, isku xidhka, alxanka qabow, kabid.

Kala-goysyada alxanka-daloolka: galitaanka daasadaha oo liita, godadka.

Kormeerka qaybaha:

Dib u noqoshada polarity, qaybo khaldan, dhagax xabaal, rogaal-celin, dhaawac.

Kormeerka muuqaalka:

Wasakhowga dusha sare ee looxa, xuruufta cakiran, xagashada maaskarada alxanka.

5.2 Hawlaha caawimada

Xidhiidhinta xogta SPI: soo dejinta natiijooyinka baadhista koollada alxanka, xidhiidhiya oo falanqee tayada wax-soo-saarka wadajirka ah ee alxanka.

Calaamadaynta NG: kicin mashiinka calaamadaynta ama mashiinka calaamadaynta si loo calaamadiyo booska cilladaysan.

Raadinta xogta: sawirada baadhista kaydka iyo natiijooyinka, taageer qiimaynta tayada dufcada.

6. Doorka dhabta ah

6.1 Xakamaynta tayada

Heerka is-dhex-galka cilladaysan>99%: beddel kormeerka muuqaalka gacanta ee dhammaadka khadka wax-soo-saarka SMT si loo baabi'iyo kormeerrada seegay.

Hagaajinta habraaca: jawaab celinta cabbirrada cabbirka ee mashiinka meelaynta iyada oo loo marayo tirakoobyada qaybinta cilladda (sida ka-baxsan xoogga leh).

6.2 Xakamaynta kharashka

Yaree kharashyada dib-u-shaqaynta: ogaanshaha hore ee cilladaha waxay yareyn kartaa khasaaraha qashinka ee hababka xiga.

Hagaajinta heerka ka gudubka: yaree wakhtiga hoos u dhaca aan loo baahnayn ee ay keento xukun-xumada iyada oo loo marayo kormeer sax ah oo sarreeya.

6.3 Codsiyada Warshadaha

Electronics Consumer: ogaanshaha kala goysyada alxanka yar ee Motherboard-yada gacanta.

Qalabka elektaroonigga ah: hubinta isku halaynta ee looxyada ECU ee heerkulka sare iyo jawiga gariirka sare.

Qalabka caafimaadka: wuxuu buuxiyaa shuruudaha hubinta tayada adag ee ISO 13485

7. Kooban

SAKI BF-TristarⅡ waxay qaadataa "sax sare + hufnaan sare + sirdoon" sida xudunta u ah, iyo iyada oo loo marayo isku dhafka hal-abuurka leh ee nidaamka indhaha ee kala duwan, AI algorithm, iyo naqshadaha dual-track, waxay noqotay xal qiimo-ku-ool ah oo ku saabsan 2D AOI, gaar ahaan ku habboon wax-soo-saarka elektiroonigga ah ee saxda ah ee raacaya cilladaha eber.