Ekyuma kya SAKI SMT 2D AOI BF-Tristar2

Wammanga ye nnyanjula enzijuvu era enzijuvu ku SAKI 2D AOI BF-Tristar2

1.1 Enkola y’okukuba ebifaananyi mu maaso

Tekinologiya w’okutaasa ennimiro eyakaayakana:

Ensi ya PCB eyaka n’ensibuko y’ekitangaala kya LED eky’enkoona nnyingi (multi-angle high-brightness LED combination), era enjawulo y’okutunula wakati w’ekiyungo kya solder n’ekintu eky’emabega ekozesebwa okukwata ebifaananyi eby’enjawulo ennyo. Ebiyungo bya solder ebiseeneekerevu biraga okutunula kw’endabirwamu (ekitundu ekitangaavu), ate ebifo ebiriko obuzibu (nga enjatika n’ebbaati etamala) biragibwa ng’ebitundu ebiddugavu olw’okutunula okusaasaana.

Okukuba ebifaananyi ebikwatagana n’emitendera ebiri:

Seti bbiri eza kkamera za linear array ez’obulungi obw’amaanyi (okutuuka ku 10μm/pixel) zisika ebitundu ebya waggulu n’ebya wansi ebya PCB mu kiseera kye kimu, nga bigattiddwa wamu n’ekyuma ekikola ebifaananyi eky’amaanyi okusobola okwekenneenya mu kiseera ekituufu.

1.2 Ensonga z’okuzuula obulema

Okukwatagana kw’ekipande: Geraageranya enjawulo mu kifo n’enkula wakati w’etterekero ly’ekiyungo kya solder/component erya mutindo n’ekifaananyi kyennyini.

Okwekenenya kwa grayscale/geometric: Okuzuula obulema nga ebiyungo bya solder ebinyogovu n’okuzimba omukutu nga oyita mu kugabanya okwaka kw’ebiyungo bya solder n’obulungi bwa contour.

AI-assisted classification: Deep learning algorithms ziggyamu ebifaananyi ku bulema obuzibu (nga BGA solder ball collapse) okukendeeza ku kusalawo okukyamu.

2. Ebirungi ebikulu

Ebipimo by’enkizo Omulimu ogw’enjawulo

Obutuufu bw’okuzuula Asobola okuzuula ebitundu 01005 (0.4mm×0.2mm) n’obulema mu kiyungo kya solder ku ddaala lya micron (nga enjatika za 5μm).

Sipiidi n’obulungi Dizayini y’okuzuula ey’emitendera ebiri etuuka ku sikonda 0.25/point, nga eno esinga AOI ey’olutindo olumu ebitundu 30%.

Adaptability Ewagira embeera enzibu nga rigid PCB, FPC (flexible board), ne highly reflective lead-free solder.

Intelligent AI algorithm self-learning optimization, omuwendo gwa alamu ey’obulimba <0.1%, okukendeeza ku nsaasaanya y’okuddamu okwekenneenya mu ngalo.

Okugaziwa Kuyinza okuyungibwa ne SPI, ICT n’ebyuma ebirala okuzimba loopu enzigale ey’omutindo gw’enkola enzijuvu.

3. Ebintu eby’ekikugu

3.1 Okukola dizayini ya Hardware

Enkola y’okutaasa amataala ag’enjawulo (multi-spectral lighting system):

8-directional programmable LED light source, okuwagira dynamic adjustment of wavelength ne angle, okutuukiriza ebyetaago by'okuzuula solders ez'enjawulo (nga SAC305 ne SnPb).

Enzimba y’ebyuma ey’obugumu obw’amaanyi:

Marble base + linear motor drive okukakasa nti sikaani enywevu (okuddamu okuteeka mu kifo ekituufu ±5μm).

3.2 Emirimu gya Sofutiweya

Okwekenenya okukoppa mu ngeri ya 3D:

Ddamu okuzimba amawulire agakwata ku buwanvu bw’ekiyungo kya solder nga osinziira ku bifaananyi bya 2D, era mu ngeri etali butereevu ozuule obulema bwa 3D nga warpage ne solder paste etamala.

Enzirukanya y’enkola y’emmere:

Asobola okutereka pulogulaamu z’okukebera 1000+, n’okuwagira okukyusakyusa mu kunyiga omulundi gumu okw’ebika by’ebintu.

4. Ebikwata ku nsonga eno

Category Ebikwata ku nsonga eno mu bujjuvu

Okukebera range PCB sayizi: 50mm × 50mm ~ 510mm × 460mm (customizable extra-olubaawo olunene)

Okusalawo kw’amaaso Omutindo 10μm/pixel (okutuuka ku 5μm/pixel okwesalirawo)

Sipiidi y'okukebera 0.25 ~ 0.5 sekondi / ekifo eky'okukebera (okusinziira ku buzibu)

Enkolagana y’empuliziganya SECS/GEM, TCP/IP, RS-232, ewagira okugatta enkola ya MES

Amaanyi ageetaagisa AC 200-240V, 50/60Hz, amaanyi agakozesebwa ≤1.5kW

5. Module ezikola

5.1 Emirimu emikulu egy’okukebera

Okukebera ebiyungo bya solder:

SMT solder joints: Omupiira gwa solder ogwa BGA gubula, okuzimba omukutu, okusoda mu nnyonta, offset.

Ebiyungo bya solder ebiyita mu binnya: okuyingira obubi mu bbaati, ebituli.

Okukebera ebitundu:

Okukyusa polarity, ebitundu ebikyamu, ejjinja ly’entaana, okuyiringisibwa, okwonooneka.

Okukebera endabika:

Obucaafu obuva ku bboodi, ennukuta ezitali nnungi, enkwagulo ku masiki ya solder.

5.2 Emirimu egy’obuyambi

SPI data linkage: okuyingiza ebivudde mu kukebera solder paste, okukwatagana n’okwekenneenya omutindo gw’okubumba ekiyungo kya solder.

NG marking: ssika ekyuma ekissaako obubonero oba ekyuma ekiwandiika akabonero okuteeka akabonero ku kifo ekikyamu.

Okulondoola data: ebifaananyi by’okukebera sitoowa n’ebivuddemu, okuwagira okwekenneenya kw’omutindo gw’ekibinja.

6. Omulimu gwennyini

6.1 Okulondoola omutindo

Defect interception rate>99%: zzaawo okukebera mu ngalo okulaba ku nkomerero ya layini y’okufulumya SMT okumalawo okwekebejja okusubiddwa.

Enkola okulongoosa: okuddamu ku bipimo by’okupima eby’ekyuma ekiteeka okuyita mu bibalo by’okugabanya obulema (nga concentrated offset).

6.2 Okufuga ebisale

Okukendeeza ku nsaasaanya y’okuddamu okukola: okuzuula amangu ebikyamu kiyinza okukendeeza ku kufiirwa kw’ebisasiro mu nkola eziddako.

Okulongoosa omuwendo gw’okuyita: okukendeeza ku budde bw’okuyimirira obuteetaagisa obuva ku kusalawo obubi ng’oyita mu kwekebejja mu ngeri entuufu.

6.3 Enkozesa y’amakolero

Ebyuma ebikozesebwa: okuzuula ebiyungo bya micro solder ku motherboards z’amasimu.

Ebyuma ebikozesebwa mu mmotoka: okukakasa obwesigwa bwa bboodi za ECU mu mbeera ez’ebbugumu eringi n’okukankana okungi.

Ebikozesebwa mu by’obujjanjabi: bituukiriza ebisaanyizo ebikakali eby’okukebera omutindo ebya ISO 13485.

7. Mu bufunze

SAKI BF-Tristar2 etwala "obutuufu obw'amaanyi + obulungi obw'amaanyi + amagezi" ng'omusingi gwayo, era okuyita mu kugatta okuyiiya okw'enkola y'amaaso ey'ebifaananyi ebingi, AI algorithm, n'enzimba y'emitendera ebiri, efuuse eky'okugonjoola ekitali kya ssente nnyingi mu kisaawe kya 2D AOI, naddala ekisaanira okukola ebyuma ebituufu ebigoberera obulema bwa zero.