SAKI SMT 2D AOI umatshini BF-TristarⅡ

Oku kulandelayo yintshayelelo ebanzi neneenkcukacha kwi-SAKI 2D AOI BF-TristarⅡ

1.1 Umgaqo-siseko womfanekiso obonakalayo

Itekhnoloji yokuKhanyisa kwiNdawo eKhanyayo:

Umphezulu we-PCB ukhanyiswa yi-multi-angle high-lightlight light LED source (obomvu / eluhlaza / eluhlaza okwesibhakabhaka / emhlophe inhlanganisela), kunye nokwahlukana okubonakalayo phakathi kwe-solder joint kunye ne-background material isetyenziselwa ukubamba imifanekiso ephezulu. Amalungu e-solder agudileyo abonisa imbonakalo yesipili (indawo eqaqambileyo), ngelixa iindawo ezineziphene (ezifana neentanda kunye netoti engonelanga) ziboniswa njengeendawo ezimnyama ngenxa yokukhanya okusasazekayo.

Iingoma ezimbini zemifanekiso engqameneyo:

Iiseti ezimbini zeekhamera ezikwi-high-resolution linear linear (ukuya kuthi ga kwi-10μm/pixel) ziskena iindawo eziphezulu nezisezantsi zePCB ngolungelelwano, zidityaniswe neprosesa yesithombe esinesantya esiphezulu sohlalutyo lwexesha lokwenyani.

1.2 Ingqiqo yokuFumana isiphene

Template matching: Thelekisa indawo kunye nemilo umahluko phakathi solder eqhelekileyo joint / ithala leencwadi kunye nomfanekiso kanye.

Uhlalutyo lwe-grayscale/ijometri: Khangela iziphene ezifana neendawo ezibandayo ze-solder kunye ne-brodging ngokusasazwa kokukhanya okudibeneyo kwe-solder kunye nokuthembeka kwekhonto.

Ukuhlelwa okuncediswa yi-AI: Ii-algorithms zokufunda nzulu zikhupha iimpawu zeengxaki ezinzima (ezifana ne-BGA solder ball collapse) ukunciphisa ukugwetywa.

2. Iinzuzo eziphambili

Imilinganiselo ye-advanteji Ukusebenza ngokuthe ngqo

Ukuchaneka ukuchaneka Kunokuchonga amacandelo e-01005 (0.4mm × 0.2mm) kunye ne-micron-level solder joint defects (ezifana ne-5μm cracks).

Isantya kunye nokusebenza kakuhle Idizayini yokufumanisa i-double-track ifezekisa i-0.25 imizuzwana / inqaku, elingaphezulu kwe-30% ngokukhawuleza kune-AOI enye.

Ukuguquguquka Ukuxhasa iimeko ezinzima ezifana ne-PCB eqinile, i-FPC (ibhodi eguquguqukayo), kunye ne-solder ebonisa kakhulu i-lead-free.

Intelligent AI algorithm self-learning optimization, izinga le-alarm lobuxoki <0.1%, ukunciphisa iindleko zokuphinda zihlolwe ngesandla.

Ukwandiswa kunokudibaniswa ne-SPI, i-ICT kunye nezinye izixhobo zokwakha umgangatho ogcweleyo ovaliweyo.

3. Iimpawu zobugcisa

3.1 Uyilo lwezixhobo zokusebenza

Inkqubo yezibane ezininzi:

I-8-directional programmable umthombo wokukhanya we-LED, ukuxhasa uhlengahlengiso oluguquguqukayo lwe-wavelength kunye ne-angle, ukuhlangabezana neemfuno zokubona abathengisi abahlukeneyo (njenge-SAC305 kunye ne-SnPb).

Ubume boomatshini bokuqina okuphezulu:

Isiseko semarble + linear motor drive ukuqinisekisa uzinzo lokuskena (phinda ukuchaneka kokubeka ±5μm).

3.2 Imisebenzi yeSoftware

Uhlalutyo lokulinganisa lwe-3D:

Yakha kwakhona ulwazi oluhlangeneyo lobude obusekwe kwimifanekiso ye-2D, kwaye ufumanise ngokungangqalanga iziphene ze-3D ezifana nephepha lokulwa kunye nokungonelanga kwe-solder paste.

Ulawulo lweresiphi:

Ingagcina iinkqubo zokuhlola eziyi-1000+, kwaye ixhase ukucofa okukodwa kokutshintsha kweemodeli zemveliso.

4. Iinkcukacha

Udidi Iinkcukacha ezineenkcukacha

Uluhlu lokuhlola ubukhulu bePCB: 50mm×50mm ~ 510mm×460mm (ibhodi eyongezelelekileyo enokwenziwa ngokwezifiso)

Isisombululo soMgangatho we-Optical 10μm/pixel (ukuya kuthi ga kwi-5μm/pixel ngokuzikhethela)

Isantya sokuhlola i-0.25 ~ 0.5 imizuzwana / indawo yokuhlola (kuxhomekeke kubunzima)

I-interface yonxibelelwano ye-SECS / i-GEM, i-TCP / IP, i-RS-232, ixhasa ukuhlanganiswa kwenkqubo ye-MES

Iimfuno zamandla AC 200-240V, 50/60Hz, ukusetyenziswa kwamandla ≤1.5kW

5. Iimodyuli ezisebenzayo

5.1 Imisebenzi yokuhlola engundoqo

Uhlolo oludibeneyo lweSolder:

Amalungu e-SMT solder: Ibhola ye-solder ye-BGA ayikho, ibhuloho, i-solder ebandayo, i-offset.

Amalungu e-solder ahamba ngomngxuma: ukungenwa kakuhle kwetoti, imingxuma.

Ukuhlolwa kwecandelo:

Ukuguqulwa kwe-polarity, iindawo ezingalunganga, ilitye lengcwaba, i-rollover, umonakalo.

Ukuhlolwa kwenkangeleko:

Ungcoliseko lomphezulu webhodi, iimpawu eziluzizi, imikrwelo kwimaski yesolder.

5.2 Imisebenzi encedisayo

Uqhagamshelwano lwedatha ye-SPI: ngenisa iziphumo zokuhlolwa kwe-solder paste, lungelelanisa kwaye uhlalutye umgangatho wokubumba we-solder.

Ukumakishwa kwe-NG: qalisa umatshini wokumakisha okanye umatshini wokubhala ukuphawula indawo yesiphene.

Ukulandelelwa kwedatha: imifanekiso yokuhlola ivenkile kunye neziphumo, inkxaso ye-batch quality analysis statistical.

6. Eyona ndima

6.1 Ulawulo lomgangatho

Izinga lokuthintela isiphene> 99%: buyisela uhlolo olubonakalayo olubonakalayo ekupheleni komgca wemveliso ye-SMT ukuphelisa uhlolo oluphosiweyo.

Ukulungiswa kwenkqubo: impendulo kwiiparamitha zokulinganisa umatshini wokubeka ngokusebenzisa izibalo zokusabalalisa iziphene (ezifana ne-concentrated offset).

6.2 Ulawulo lweendleko

Ukunciphisa iindleko zokusebenza kwakhona: ukufunyanwa kwangaphambili kweziphene kunokunciphisa ilahleko ye-scrap kwiinkqubo ezilandelayo.

Phucula izinga lokupasa: nciphisa ixesha lokuphumla elingeyomfuneko elibangelwa kukungagwetyelwa kakuhle ngohlolo oluchanekileyo.

6.3 Izicelo zoShishino

Izixhobo zombane zabathengi: ukuchongwa kwee-micro solder joints kwiimotherboards zefowuni ephathwayo.

I-Automotive electronics: ukuqinisekiswa kokuthembeka kweebhodi ze-ECU kwiqondo lokushisa eliphezulu kunye neendawo eziphezulu zokungcangcazela.

Izixhobo zonyango: ziyahlangabezana neemfuno ezingqongqo zokuhlolwa komgangatho we-ISO 13485.

7. Isishwankathelo

I-SAKI BF-TristarⅡ ithatha "ukuchaneka okuphezulu + ukusebenza okuphezulu + ubukrelekrele" njengeyona nto iphambili, kwaye ngokusebenzisa indibaniselwano entsha yenkqubo ye-multi-spectral optical, i-algorithm ye-AI, kunye ne-double-track architecture, iye yaba sisisombululo esineendleko eziphezulu kwintsimi ye-2D AOI, ilungele ngokukodwa ukuveliswa kwe-electronics echanekileyo elandela i-zero.