SAKI SMT 2D AOI makina BF-TristarⅡ

Zotsatirazi ndizofotokozera za SAKI 2D AOI BF-TristarⅡ

1.1 Mfundo Yojambula Yowonekera

Bright Field Illumination Technology:

Mawonekedwe a PCB amawunikiridwa ndi kuwala kowala kwambiri kwa LED (kusakanikirana kofiira / kobiriwira / buluu / koyera), ndipo kusiyana kwawonetseratu pakati pa chophatikizira cha solder ndi zinthu zakumbuyo kumagwiritsidwa ntchito kujambula zithunzi zosiyana kwambiri. Malo otsetsereka otsetsereka amawonetsa kuwonekera kwa galasi (malo owala), pomwe malo opanda cholakwika (monga ming'alu ndi malata osakwanira) amawonetsedwa ngati madera amdima chifukwa cha kuwunikira kosiyana.

Kujambula kwapawiri-track synchronous:

Makamera awiri amtundu wapamwamba kwambiri (mpaka 10μm/pixel) amajambula pamwamba ndi pansi pa PCB synchronously, kuphatikizapo purosesa ya zithunzi zothamanga kwambiri kuti mufufuze zenizeni zenizeni.

1.2 Kuzindikira Zolakwika

Kufananitsa ndi ma template: Fananizani malo ndi kusiyana kwa mawonekedwe pakati pa laibulale yokhazikika ya solder/component ndi chithunzi chenichenicho.

Kusanthula kwa Grayscale/geometric: Dziwani zolakwika monga zolumikizira zoziziritsa kukhosi ndikumangirira ndi kugawa kowala kolumikizana ndi solder ndi kukhulupirika kwa mizere.

Gulu lothandizidwa ndi AI: Ma algorithms ozama ophunzirira amachotsa zinthu zovuta zovuta (monga BGA solder mpira kugwa) kuti muchepetse kuweruza molakwika.

2. Ubwino waukulu

Ubwino miyeso Kuchita mwachindunji

Kuzindikira kulondola Kukhoza kuzindikira zigawo za 01005 (0.4mm × 0.2mm) ndi zolakwika za micron-level solder (monga ming'alu ya 5μm).

Kuthamanga ndi kuchita bwino Mapangidwe a mayendedwe apawiri amakwaniritsa masekondi / mfundo 0.25, yomwe ili mofulumira kuposa 30% kuposa AOI ya nyimbo imodzi.

Kusinthasintha Kumathandizira zochitika zovuta monga PCB yolimba, FPC (bodi yosinthika), komanso solder wopanda lead.

Intelligent AI aligorivimu yodziphunzitsira yokha, kuchuluka kwa ma alarm abodza <0.1%, kuchepetsa ndalama zowunikiranso pamanja.

Kukulitsa Kutha kulumikizidwa ndi SPI, ICT ndi zida zina kuti mupange njira yonse yotsekedwa loop.

3. luso mbali

3.1 Mapangidwe a Hardware

Njira yowunikira ma multispectral:

Gwero la kuwala kwa 8-directional programmable LED, kuthandizira kusintha kwamphamvu kwa kutalika kwa mawonekedwe ndi ngodya, kukwaniritsa zosowa za ogulitsa osiyanasiyana (monga SAC305 ndi SnPb).

Makina olimba kwambiri:

Marble base + linear motor drive kuti muwonetsetse kukhazikika (kubwereza kulondola kwa malo ± 5μm).

3.2 Ntchito zamapulogalamu

Kusanthula kayeseleledwe ka 3D:

Panganinso zidziwitso za kutalika kolumikizana kwa solder kutengera zithunzi za 2D, ndikuwona zolakwika za 3D monga tsamba lankhondo ndi phala losakwanira la solder.

Kasamalidwe ka maphikidwe:

Itha kusunga mapulogalamu oyendera 1000+, ndikuthandizira kusinthana kumodzi kwamitundu yazogulitsa.

4. Zofotokozera

Gulu Mwatsatanetsatane

Kuyendera osiyanasiyana PCB kukula: 50mm×50mm ~ 510mm×460mm (customizable owonjezera lalikulu bolodi)

Kuwala kusanja Standard 10μm/pixel (mpaka 5μm/pixel kusankha)

Kuyendera liwiro 0.25 ~ 0.5 masekondi / malo oyendera (malingana ndi zovuta)

Kuyankhulana kwa SECS/GEM, TCP/IP, RS-232, kuthandizira kuphatikizika kwa dongosolo la MES

Mphamvu zofunikira AC 200-240V, 50/60Hz, kugwiritsa ntchito mphamvu ≤1.5kW

5. Ma modules ogwira ntchito

5.1 Ntchito zowunika zoyambira

Kuyang'ana kwa Solder:

SMT solder olowa: BGA solder mpira kusowa, mlatho, ozizira soldering, offset.

Kudzera m'mabowo solder: osalowa malata, mabowo.

Kuwunika kwamagulu:

Kusintha kwa polarity, magawo olakwika, tombstone, rollover, kuwonongeka.

Kuyang'ana maonekedwe:

Kuipitsa pamwamba pa bolodi, zilembo zosawoneka bwino, zokopa pa chigoba cha solder.

5.2 Ntchito zothandizira

Kulumikizana kwa data ya SPI: zotsatira zoyang'anira phala la solder, gwirizanitsani ndikusanthula mtundu wowongoka wa solder.

Chizindikiro cha NG: yambitsani makina ojambulira kapena makina olembera kuti alembe pomwe pali cholakwika.

Kutsatiridwa kwa data: zithunzi zoyendera sitolo ndi zotsatira, kuthandizira kusanthula kwa chiwerengero cha batch.

6. Udindo weniweni

6.1 Kuwongolera khalidwe

Chiwopsezo cholepheretsa> 99%: sinthani kuyang'ana kwapamanja kumapeto kwa mzere wopanga wa SMT kuti muchotse zoyeserera zomwe zaphonya.

Kukhathamiritsa kwanjira: mayankho ku magawo amasinthidwe a makina oyika kudzera mu ziwerengero zogawa zachilema (monga concentrated offset).

6.2 Kuwongolera mtengo

Chepetsani ndalama zogwirira ntchito: kuzindikira koyambirira kwa zolakwika kumatha kuchepetsa kuwonongeka kwa zinyalala pazotsatira.

Limbikitsani kuchuluka kwa anthu opambana: kuchepetsa kutsika kosafunikira komwe kumachitika chifukwa choganiza molakwika pakuwunika mwatsatanetsatane.

6.3 Ntchito Zamakampani

Consumer electronics: kuzindikira kwa ma micro solder joints pa mafoni a m'manja.

Zamagetsi zamagalimoto: chitsimikizo chodalirika cha matabwa a ECU kutentha kwambiri komanso malo ogwedezeka kwambiri.

Zida zamankhwala: zimakwaniritsa zofunikira zowunikira za ISO 13485.

7. Mwachidule

SAKI BF-TristarⅡ imatenga "kulondola kwambiri + kuchita bwino kwambiri + luntha" monga maziko ake, ndipo kudzera mu kuphatikiza kwatsopano kwa ma multispectral optical system, AI algorithm, ndi zomangamanga zapawiri, yakhala njira yotsika mtengo pantchito ya 2D AOI, yoyenera makamaka popanga zida zamagetsi zomwe zimatsata zero.