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xhOkufulumya kwa AD830 okuliwo
Weekenneenye ekyuma ekikyusiddwa oba eky’okwongerako nga tokitwala nti buli nsengeka ya AD830 y’emu.
AD830 Die Attach Omukutu
ASM AD830 Omukwasi wa BonderEnkola n’Okuteekawo Ekitabo
Tegeera engeri ekyuma kya ASM AD830 Plus die bonding gye kikwataganamu n’enkola ya wafer-to-lead-frame silver-epoxy. Weekenneenye okukwatagana kwa package, modules eziteekeddwa, tooling, production transfer n’ebyetaago by’okukkiriza sample nga tonnaba kuleeta AD830 platform mu semiconductor assembly.
Essira ly’enkola
Otomatiki wafer-ku-lead-fuleemu ffeeza-epoxy die attach.
Okusengeka Okusooka
Ebyuma by’osobola okulonda birina okukwatagana n’ekipapula ekituufu n’okutambula kw’ebintu.
Okukyusa okufulumya ebintu
Weekenneenye ebikozesebwa, enkola y’okufumba, magazini, wafers ne samples z’okukkiriza.
AD830 PLUS OMUTWE GW'OMUTWE
EKYUMA EKIKOLA KU ASM DIE BONDING
Okuddamu Obutereevu
ASM AD830 Die Bonder kye ki?
OmuASM AD830 omukuumiye nkola ya otomatiki ey’okukuŋŋaanya semikondokita eyakolebwa okukyusa die ssekinnoomu okuva mu wafer n’okuziteeka ku bifo eby’okukwatagana ebya lead-frame ebitegekeddwa. Omutindo guno gutera okumanyibwa mu biwandiiko by’ebyuma nga ASM AD830 Plus, AD830PLUS oba ASM AD 830 PLUS.
Obulagirizi bwayo obw’okufulumya bugatta enkwata ya lead-frame, okukozesa silver-epoxy, okuteeka wafer mu kifo, okutegeera die, ejector-assisted die separation, vacuum pickup, programed placement n’okukebera optical. Naye erinnya lya model teriraga input loader, wafer system, epoxy process, cameras, output livator oba ebikozesebwa ebiteekeddwa ku kyuma ekigere.
Omuko guno gussa essira ku kusaanira enkola, okukyusa okufulumya n’okuteekateeka ensengeka. Ku mbeera y’ekyuma eriwo kati, sitooka, okwekebejja n’okugabibwa mu by’obusuubuzi, weetegereze eby’enjawuloomuko gw'ebyuma ebikozesebwa ASM AD830 Plus.
Enyanjula ya Package Empya
Saza oba die, wafer, lead frame, enkola ya epoxy n’emisingi gy’okukebera bikwatagana ne AD830 platform.
Ebiwandiiko by’enkola
Zimba fayiro entegeerekeka ey’okutambuza ebipapula ng’ekwata ku bikozesebwa, ensengeka z’ebintu, ebijuliziddwa mu kwolesebwa n’ebyokulabirako by’okukkiriza.
Okukebera Okusaba
ASM AD830 ye Die Bonding Platform Entuufu?
AD830 Plus esinga kukola nga enkola ya package enzijuvu ekwatagana ne wafer, lead-frame, epoxy, bond-head ne inspection architecture yaayo. Kozesa ebifo bino wammanga eby’okukebera nga tonnasaba kyuma oba okuteekateeka okukyusa okufulumya.
✓
Endagiriro y'okukozesa AD830 ey'amaanyi
Pulatifoomu eyinza okuba obulagirizi obutuufu ng’obukwakkulizo obusinga obungi buno wammanga bukola:
- Enkola eno ekyusa singlated dies okuva mu wafer okudda mu lead frames.
- Silver epoxy asiigibwa mu nkola ekwatagana ey’okugaba oba okussaako sitampu.
- Ekintu kino kyetaaga okusitula die mu ngeri ey’otoma, okukiteeka n’okukeberebwa.
- Enkola ya lead-frame esobola okuwagirwa omukwasi w’omulimu ne magazini.
- Collets ezeetaagisa, ebikozesebwa mu ejector, anvils ne clamps bisobola okutegekebwa.
- Ekkolero lino lyakola dda enkola ya famire ya AD830 oba enkola ekwatagana.
- Ekipapula kisobola okukakasibwa okuyita mu kukola sampuli ezikiikirira.
!
Okusaba Okwetaaga Okwongera Okwekenenya
Omukutu ogw’enjawulo oba enkola ekyusiddwa eyinza okwetaagisa mu mbeera zino wammanga:
- Enkola eno yeetaaga eutectic, soft-solder oba thermocompression bonding.
- Ekintu kino kikozesa trays, Gel-Pak, waffle packs oba die inputs ezitali za bulijjo.
- Enkola ya substrate tesobola kutambula mu luguudo lwa lead-frame oluteekeddwawo.
- Obutuufu obwetaagisa obw’okuteeka busukka obusobozi bw’ekyuma obukakasibwa.
- Die eba nnyogovu mu ngeri etaali ya bulijjo, nnyangu, ewunyiriza oba nzibu okufulumya okuva ku ttaapu.
- Ekintu kino kyetaaga okuteekebwako flip-chip alignment ey’omulembe oba okufugibwa okufugibwa.
- Okukebera okwetaagisa tekuyinza kutuukirizibwa na optics ne software eziteekeddwamu.
Enzimba y’enkola
ASM AD830 Maapu y’enkola y’okusiba okufa
Ekiva mu kukola kisinziira ku nkolagana wakati w’okukwata ebintu, okuteekateeka epoxy, okufulumya die, okulonda vacuum, okulaganya okulaba n’okuteeka mu pulogulaamu. Buli mutendera gulina okwekenneenya ng’ekitundu ku nkola emu enzijuvu.
Okuyingiza mu Lead-Frame
Lifuti ya magazini oba loader ya stack etegekeddwa egaba fuleemu y’omusulo etalongooseddwa ku luguudo lw’omukwasi w’emirimu.
Okukozesa Epoxy
Empiso egaba oba ekintu ekikuba sitampu kisiiga epoxy ya ffeeza mu bifo ebiteekeddwateekeddwa okusiba.
Okunoonya Wafer
Emmeeza ya wafer n’enkola y’okutegeera bizuula die erongooseddwa ne bibala okutereeza okwetaagisa.
Okufa Okwawukana
Ejector ne collet bikolagana okufulumya die okuva mu wafer tape ne bateekawo stable vacuum pickup.
Okuteeka Okufa
Omutwe gwa bond gukyusa die ne gugiteeka nga gukozesa ekifo ekitegekeddwa, obuwanvu, okutunula n’amaanyi.
Okukebera n’okufulumya
Ebiva mu nkola byekenneenyezebwa okusinziira ku nkola y’enkola nga fuleemu y’omusulo ewedde tennagenda mu magazini efuluma.
Enzirukanya enkalu ennungi tekakasa kusaanira kwa kukola. Stable die release, vacuum pickup, epoxy deposition, okuteeka n’okukebera birina okukakasibwa nga tukozesa wafers ezikiikirira, lead frames, ebikozesebwa n’ebintu ebikola.
Enyanjula mu Paka
Okukyusa Production okudda ku ASM AD830
Okukyusa okufulumya tekulina kutandika nga okoppa fayiro ya package n'ebintu ebidduka amangu ddala. Ensengeka y’ekyuma eyasooka, ebikozesebwa mu kukanika, ebikozesebwa mu nkola, ebijuliziddwa ku kkamera n’omutindo gw’okukkiriza birina okusooka okuwandiikibwa.
01
Wandiika Omusingi gw’Enkola Eriwo
Ebipimo by’ebiwandiiko ebifa, wafer tape, okukuba ekifaananyi kya lead-frame, epoxy ya ffeeza, ensengeka y’enzirukanya, emisingi gy’okuteeka n’ekkomo ly’enkola erimanyiddwa.
02
Geraageranya Ensengeka z’Ekyuma
Geraageranya ebyuma ebivaamu n’ebigenda okusinziira ku input loader, work holder, wafer table, epoxy stations, cameras, bond head, software ne output system.
03
Tegeka Ebikozesebwa Ebikwata ku Bikozesebwa
Kakasa geometry ya collet, ejector pin, ejector cap, magnetic anvil, window clamp, magazines n’ebikozesebwa mu kalifuuwa ku package egenderere.
04
Ddamu okuzimba Ebiwandiiko Ebikwata ku Makanika
Somesa obugazi bw’olutindo, ebifo bya magazini, coordinates za wafer, ebifo bya epoxy, obuwanvu bwa pickup, obuwanvu bwa bond n’okufuluma kw’ebikozesebwa.
05
Ddamu okutonda Okwolesebwa n'Enkola y'Enkola
Kakasa nti essira n’okutaasa nga tonnasomesa wafer PR, lead-frame references, epoxy alignment, die recognition n’okukebera post-bond.
06
Okugezesebwa kwa sampuli okufugibwa okujjuvu
Tandika n’obungi bwa sampuli obutono, kebera enkola enzijuvu era osumulule okufulumya oluvannyuma lw’ebisaanyizo by’okukkiriza ebikkaanyiziddwaako okutuukirira.
Ekyuma Ekikuba Engalo
Ebitundu mukaaga eby'okusengeka AD830 okukakasa
Ekyuma kya AD830 Plus kisaana okutwalibwa ng’enkola y’okufulumya entegeke enzijuvu. Ebitundu bino omukaaga bye bisalawo oba ebyuma bisobola okuwanirira ekipapula ekigendereddwa.
Okuyingiza mu Lead-Frame
Laba engeri fuleemu z’omusulo ezitalongooseddwa gye ziyingiramu mu kyuma n’okumanya oba omutikka akwatagana ne magazini y’okufulumya oba ebintu ebitumbiddwa.
- Lifuti y’okuyingiza magazini
- Enteekateeka y’okutikka ebitambi
- Sayizi ya magazini n’eddoboozi ly’ekifo
- Obuwagizi bwa lead-frame ne sensa
Enkwata ya Wafer
Kakasa obunene bwa wafer, ebipimo bya fuleemu, entambula y’emmeeza, okutereeza theta, okugaziya n’okutikka wafer mu ngeri ey’otoma.
- Wafer ring oba frame okukwatagana
- Wafer table n'okugaziya
- Magazini ya wafer ne gripper
- Ebyetaago bya Wafer-map
Enkola ya Epoxy
Salawo oba ekyuma kikozesa okugaba, okussaako sitampu oba enteekateeka endala etegekeddwa ey’okukozesa ffeeza-epoxy.
- Empiso n’empiso y’okugaba
- Ebikozesebwa mu kussaako sitampu oba okunnyika
- Epoxy tray n’okufuga level
- Puleesa, mmotoka ne sensa
Omutwe gwa Bond ne Pickup
Kebera entambula, vacuum, bond arm, force control n’embeera y’ebyuma mu nkola enzijuvu eya die-pick n’okuteeka.
- XYZ bond-omutwe okutambula
- Okuyita mu collet ne vacuum
- Ppini ya ejector n’enkoofiira ya ejector
- Okuddamu okulonda n’amaanyi g’okusiba (bond-force response).
Okwolesebwa n’Okukebera
Kakasa kamera ki, lenzi, yuniti z’amataala n’emirimu gy’okutegeera ebiteekeddwa mu mubiri era ebikola.
- Wafer ne die okutegeera
- Okulaganya okujuliza kwa lead-frame
- Enkola y’amaaso ey’ekifo kya epoxy
- Ceeke nga tebannaba kugaba bond n’oluvannyuma lwa bond
Omukwasi w’Omulimu n’Ebifulumizibwa
Kakasa nti track, anvil, clamp, transfer components ne output lifuti biwagira enkola yennyini eya lead-frame.
- Obugazi bw’olutindo n’enkola y’entambula
- Magnetic anvil ne ekyuma ekikwata eddirisa
- Lifuti ya magazini efuluma
- Okukyusa ebintu ebiwedde
Okukakasa Ekyokulabirako
AD830 Enkola y’okukkiriza okufulumya
Emisingi gy’okukkiriza girina okukkaanyibwako nga okukebera sampuli tekunnatandika. Okugezesebwa kulina okwekenneenya enneeyisa y’okufulumya eddiŋŋanwa okusinga okuteeka omulundi gumu omulungi.
| Ekitundu eky’okwekenneenya | By'olina Okukebera | Lwaki Kikulu | Obujulizi Obusemba |
|---|---|---|---|
| Okutambuza EbintuEntambula y’okuyingiza, okulondoola n’okufulumya | Okutikka magazini, okutambula kw’omusika, okuwandiika index, okuwagira n’okuteeka ebifulumizibwa | Okuyingirira kw’ebyuma oba okutambuza okutali kwa nnywevu kuyinza okuyimiriza okufulumya ne bwe kiba nti okuyungibwa kutuufu. | Okugezesa okukyusa obutasalako nga tukozesa fuleemu z’omusulo entuufu ne magazini |
| Die OkuyimbulwaWafer tape ne ejector enneeyisa | Okwawukana kwa die, obuwanvu bwa ejector, entambula ya die n’obubonero bw’okukutuka oba okwatika | Obutabeera mu ntebenkevu mu kusumulula buleeta dies ezibula, dies ezonoonese n’enjawulo mu kuteekebwa. | Okugezesa okulonda mu bifo bya wafer ebikiikirira |
| Okusitula empewo (Vacuum Pickup) ngaOkuddamu kwa collet n’okutambula kw’empewo | Okukwatagana kwa pickup, okunyweza vacuum, missing-die response ne automatic re-pick | Enzirukanya enkalu tesobola kuzaala nneeyisa ya vacuum na tape-release ya dies entuufu. | Ebivudde mu kulonda ebyawandiikibwa nga bakozesa ebifa ebyenkanankana n’okufulumya |
| Okutereka EpoxyOkugaba oba okussaako sitampu | Ekifo ky’okutereka, obutakyukakyuka bwa voliyumu, enkula, okuzimba omukutu n’okuddiŋŋana kw’enkola | Epoxy etali nnywevu ekosa omutindo gwa bond-line, obucaafu n’okwesigamizibwa wansi. | Okukebera microscope ku bitereke ebiddiŋŋana nga tebannaba kuteeka die |
| Okuteeka OkufaEkifo n’okulungamya | Offset, rotation, die seating, bond force n’okuddiŋŋana okubuna fuleemu y’omusulo | Omutindo gw’okuteeka gukosa butereevu okukuŋŋaanyizibwa kw’ekipapula n’okusiba waya wansi. | Sampuli ezipimiddwa okuva mu bifo ebingi n’enzirukanya eziddiŋŋana |
| Okukebera OkwolesebwaOkutebenkera kwa PR | Okussa essira ku kifaananyi, okutaasa, okutegeera ebijuliziddwa, okunoonya okuddiŋŋana n’okuddamu okugaana | Ekifaananyi ekirabika kyokka tekikakasa kutegeera okutebenkevu oba omulimu gw’okukebera. | Okunoonya PR enfunda eziwera n’okufuga sampuli z’obulema |
Ddamu Okugezesebwa
Weekenneenye enzirukanya eziwera n’ebifo by’ebintu okusinga okukkiriza omutendera gumu oguwangudde.
Wandiika Enkola y’Enkola
Kuuma ensengeka z’ekyuma, ennamba z’ebikozesebwa, ekibinja ky’ebintu n’ebijuliziddwa ku kwekebejja.
Kebera Sampuli Entuufu
Kozesa okukebera okw’amaaso oba okw’enkola okutuukira ddala ku kipapula n’ebintu ebigattibwako.
Nnyonnyola Emisingi gy’Okufulumya
Mukkiriziganye ani akkiriza sampuli n’ebipimo ki ebyetaagisa nga tebannaba kugifulumya.
Enkola y’okuzuula obulwadde
Obubonero bw’enkola ya AD830 eya bulijjo okunoonyereza
Alaamu y’ekyuma etera okuzuula omutendera enkola we yakoma, naye si kituufu nti kye kyavaako. Embeera z’ebyuma, ebikozesebwa, ebikozesebwa, empewo, okulaba n’enkola y’emmere zirina okukeberebwa wamu.
Alaamu ezitera okubula-okufa
Okunoonyerezaobucaafu bwa collet, okukulukuta kwa vacuum, emikutu egizibiddwa, obugulumivu bwa pickup, embeera ya ejector, okugaziwa kwa wafer, okunywerera ku tapen’ensengeka z’okuzuula empewo nga tonnaba kukyusa sensa.
Pickup ya Die etali nnywevu
Okukeberaejector-pin geometry, obuwanvu bw’okufa, embeera ya tape, level ya vacuum, ebipimo bya collet, amaanyi g’okulondan’okukwatagana wakati w’ekifulumya n’omukono gwa bond.
Ebitereke bya Epoxy ebitali bikwatagana
Okwekkaanyaepoxy viscosity, obudde bw’okukola, puleesa, empiso oba ekintu ekikuba sitampu, obuwanvu bw’okutereka, omutindo gwa tray, okulwawon’obucaafu okwetoloola siteegi y’okulongoosa.
Okulemererwa Okutegeera Omusono
Okukeberaokussa essira ku kamera, obucaafu bwa lenzi, okutaasa, okwawukana kw’ebifaananyi, okulonda ebijuliziddwa, okutambula kw’ebintuera oba fayiro ya package entuufu etikkiddwa.
Jams z’okutambuza Lead-Frame
Okukakasaobugazi bw’olutindo, ekifo kya magazini, obuwanvu bwa fuleemu, anvil ewanirira, okufuluma kwa clamp, okukwatagana kw’omusindikane epoxy oba ebisasiro ebikung’aanyiziddwa mu kkubo ly’entambula.
Okuteeka Offset oba Okukyusakyusa
Okunoonyerezaebijuliziddwa okulaba, okutereeza wafer-theta, embeera y’ekintu, entambula y’okufa munda mu collet, obuwanvu bwa bond, obuwagizi bwa lead-framen’okupima mu ngeri ey’ebyuma.
Okukyusa Ekyuma
Okukyusa ASM AD830 Plus Ebaddewo
Bw’oba okyusa AD830 Plus eriwo, okukwatagana n’abaagikola n’omulembe gwokka tekimala. Ekyuma ekikyusa kisaana okugeraageranyizibwa ku kyuma ekyasooka ku ddaala ly’okusengeka, okukozesa ebikozesebwa, pulogulaamu, okukwata ebintu n’okukozesa.
Okugeraageranya okutegekeddwa kukendeeza ku bulabe bw’okufuna ekyuma ekikola amaanyi amatuufu naye nga tekisobola kutikka fuleemu ya lead eriwo, okukozesa empeta ya wafer eriwo kati, okuddamu okukola enkola ya epoxy oba okukkiriza ebikozesebwa ebiriwo mu kkolero.
- Omutindo gw’ekyuma, ennamba ya serial n’omwaka
- Ebyetaago by’amasannyalaze n’ebikozesebwa
- Ebipimo bya input loader ne magazine
- Work-holder n'ensengeka y'olutindo
- Emmeeza ya wafer, fuleemu n’enkola y’okutikka
- Ebyuma ebigaba epoxy oba okukuba sitampu
- Ensengeka ya bond-head ne force
- Kkamera, lenzi n’ebikozesebwa mu kutaasa
- Software version ne backups eziriwo
- Fayiro za package ne data y’okupima
- Collets, ejectors, anvils ne clamps
- Output lifuti ne magazini eziwedde
Oyagala Ekyuma kya ASM AD830 Plus Ekiriko?
Weekenneenye omuko gw’ebyuma ebiweereddwayo okulaba oba ebyuma ebikozesebwa, okukakasa modulo eziteekeddwa, okugezesa emirimu, okukakasa ebikozesebwa, okupakinga ebweru w’eggwanga n’okuwagira okutuusa.
Ebibuuzo Ebitera Okubuuzibwa
ASM AD830 Ekibuuzo ekibuuzibwa mu Bonder
Ebibuuzo ebya bulijjo ebikwata ku kutuuma amannya ga AD830, enkola, okukwatagana kw’ensengeka, okukyusa okufulumya n’okugezesa sampuli.
ASM AD830 y'emu ne ASM AD830 Plus?
AD830 etera okukozesebwa ng’okunoonya okufupi oba okujuliza ebyuma ku ASM AD830 Plus. Ebiwandiiko by’ebyuma n’ebiwandiiko nabyo biyinza okukozesa AD830PLUS oba ASM AD 830 PLUS. Obubaka obutuufu obw’ekyokulabirako bulijjo bulina okukakasibwa okuva ku lupapula lw’erinnya ly’ekyuma.
Enkola ki eya ASM AD830 die bonder ekoleddwa?
Obulagirizi obusookerwako obw’okufulumya ye automatic wafer-to-lead-frame die attach nga okozesa silver epoxy. Enkola eno eyinza okuli okutikka lead-frame, okugaba oba okusiba epoxy, okuteeka wafer mu kifo, okukwata die, okuteeka, okukebera n’okukwata ebifulumizibwa.
Buli AD830 Plus esobola okuddukanya ekintu kye kimu?
Nedda Ebyuma ebirina erinnya lye limu bisobola okuba ne wafer loaders ez’enjawulo, lead-frame inputs, epoxy modules, optics, software, tools ne output configurations. Ekipapula ky’okufulumya n’ensengeka y’ekyuma entuufu birina okugeraageranyizibwa.
Fayiro ya package ya AD830 esobola okukoppololwa butereevu ku kyuma ekirala?
Fayiro ya package eyinza okuwa enkola ey’omugaso, naye ebifo eby’ebyuma, kkamera, ebikozesebwa, ebifo by’omutikka, ensengeka z’olutindo, obuwanvu bw’okusitula, obuwanvu bwa bond n’ebijuliziddwa eby’okukebera mu budde obutuufu byetaaga okukakasibwa oba okusomesebwa ku kyuma ekigenda.
Bikozesebwa ki ebitera okwekenneenya okukyusa okufulumya kwa AD830?
Ebikozesebwa biyinza okuli die collet, ejector pin, ejector cap, magnetic anvil, window clamp, wafer frame, magazini n’ebikozesebwa mu kugaba epoxy oba okussaako sitampu. Okukwatagana kisinziira ku dizayini yennyini eya die ne lead-frame.
Lwaki okugezesebwa okw’ekyokulabirako okw’ebintu ebituufu kikulu?
Enzirukanya enkalu tezaala kunywerera kwa wafer-tape, okufulumya die, okukwata vacuum, enneeyisa ya ffeeza-epoxy oba enkyukakyuka ya lead-frame. Ebintu ebikiikirira byetaagibwa okwekenneenya ensengeka y’okufulumya enzijuvu.
Mawulire ki ageetaagisa okukwatagana n’ekyuma kya AD830?
Okuwa ebipimo bya die n’obugumu, obunene bwa wafer ne fuleemu, wafer tape, okukuba lead-frame, okukuba magazini, enkola ya epoxy, amawulire agakwata ku bikozesebwa, obutuufu obwetaagisa, emitendera gy’okukebera, ekigendererwa ky’okufulumya n’ekifo w’ogenda.
Nsobola wa okukebera ASM AD830 Plus ekozesebwa?
Ebikozesebwa mu kiseera kino, obuwanvu bw’okukebera n’ensengeka erimu bisobola okwekenneenya ku...yakozesa ASM AD830 Plus omuko gwa die bonder.
Weekenneenye Ebyetaago Byo Eby'okufulumya ASM AD830
Weereza die yo, wafer, lead-frame, silver-epoxy process n'amawulire agakwata ku kyuma ekiriwo okusobola okwekenneenya ensengeka ya AD830 n'okukwataganya ebyuma.
