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Iqonga le-Die Attachment le-AD830

I-ASM AD830 I-BonderIsikhokelo seNkqubo kunye noSeto

Qonda indlela umatshini we-ASM AD830 Plus wokubopha iidayi ohambelana ngayo nenkqubo yesilivere-epoxy yesafire-to-lead. Hlola ukuhambelana kwephakheji, iimodyuli ezifakiweyo, izixhobo, ukudluliselwa kwemveliso kunye neemfuno zokwamkelwa kwesampuli ngaphambi kokuba ungenise iqonga le-AD830 kwindibano ye-semiconductor.

Ukugxila kwiNkqubo Isixhobo sokuncamathelisa isilivere-epoxy esizenzekelayo esifana nesafroni ukuya kwisakhelo esikhokelayo.
Uqwalaselo Kuqala Iinketho zoomatshini kufuneka zihambelane nephakheji yokwenyani kunye nokuhamba kwezinto.
Ukudluliselwa kweMveliso Hlaziya izixhobo, iiresiphi, iimagazini, iiwafers kunye neesampuli zokwamkelwa.
ASM AD830 Plus automatic die bonder machine
Iqonga le-AD830 PLUS
Umatshini wokubopha i-ASM Die
Impendulo ethe ngqo

Yintoni i-ASM AD830 Die Bonder?

II-ASM AD830 ibhondiliqonga lokuhlanganisa i-semiconductor elizenzekelayo elenzelwe ukudlulisa iidayi zomntu ngamnye kwi-wafer kwaye zibekwe kwiindawo zokubopha ezilungiselelweyo zefreyimu ye-lead. Le modeli idla ngokuchongwa kwiirekhodi zomatshini njenge-ASM AD830 Plus, AD830PLUS okanye i-ASM AD 830 PLUS.

Isikhokelo sayo semveliso sidibanisa ukuphathwa kwefreyimu yelead, ukusetyenziswa kwesilivere-epoxy, ukubeka i-wafer positioning, ukuqatshelwa kwedayi, ukwahlulwa kwedayi encediswa yi-ejector, i-vacuum pickup, indawo ecwangcisiweyo kunye nokuhlolwa kwe-optical. Nangona kunjalo, igama lemodeli alibonisi ukuba yeyiphi i-input loader, inkqubo ye-wafer, inkqubo ye-epoxy, iikhamera, i-output elevator okanye izixhobo ezifakwe kumatshini othile.

Eli phepha ligxile ekulungeleni inkqubo, ukudluliselwa kwemveliso kunye nokucwangciswa koqwalaselo. Ukuze ufumane imeko yangoku yomatshini, isitokhwe, uhlolo kunye nobonelelo lwezorhwebo, jonga okwahlukileyoiphepha lezixhobo ze-ASM AD830 Plus ezisetyenzisiweyo.

Imveliso ekhoyo ye-AD830

Vavanya umatshini otshintshiweyo okanye owongezelelweyo ngaphandle kokuthatha isigqibo sokuba yonke i-AD830 configuration iyafana.

Intshayelelo yePhakheji entsha

Qinisekisa ukuba idayi, i-wafer, ifreyimu ye-lead, indlela ye-epoxy kunye neendlela zokuhlola ziyahambelana na neqonga le-AD830.

Uxwebhu lweNkqubo

Yakha izixhobo ezicacileyo zokugubungela iifayile ezipakishiweyo, useto lwezinto eziphathekayo, izalathiso zombono kunye neesampuli zokwamkela.

Ukuhlolwa kwesicelo

Ngaba i-ASM AD830 yeyona Platform ifanelekileyo yokudibanisa iidayi?

I-AD830 Plus iluncedo kakhulu xa ukuhamba kwephakheji epheleleyo kuhambelana ne-wafer yayo, ifreyimu yelead, i-epoxy, intloko yebhondi kunye noyilo lokuhlola. Sebenzisa la manqaku okuhlola alandelayo ngaphambi kokuba ucele umatshini okanye ulungiselele ukudluliselwa kwemveliso.

Isikhokelo sesicelo se-AD830 esomeleleyo

Iqonga linokuba yindlela efanelekileyo xa uninzi lweemeko ezilandelayo zisebenza:

  • Inkqubo yokudluliselwa kweedayi ezifakwe kwi-wafer ukuya kwizakhelo zelothe.
  • I-epoxy yesilivere isetyenziswa ngenkqubo yokukhupha okanye yokunyathela ehambelanayo.
  • Le mveliso ifuna ukulandwa, ukubekwa kunye nokuhlolwa ngokuzenzekelayo.
  • Ifomathi yesakhelo se-lead ingaxhaswa ngumnini womsebenzi kunye noomagazini.
  • Iikholethi ezifunekayo, izixhobo zokukhupha inkunkuma, ii-anvils kunye nee-clamps zinokulungiswa.
  • Umzi-mveliso sele usebenzisa iqonga losapho le-AD830 okanye inkqubo ehambelanayo.
  • Iphakheji ingaqinisekiswa ngokuveliswa kweesampuli ezimeleyo.
!

Izicelo Ezifuna Uphononongo Olungakumbi

Kunokufuneka iqonga elahlukileyo okanye inkqubo eguquliweyo kwezi meko zilandelayo:

  • Le nkqubo ifuna i-eutectic, i-soft-solder okanye i-thermocompression bonding.
  • Le mveliso isebenzisa iitreyi, iGel-Pak, iipakethi zewaffle okanye ii-die inputs ezingaqhelekanga.
  • Ifomathi ye-substrate ayinakuhamba ngethrekhi yesakhelo se-lead efakiweyo.
  • Ukuchaneka kokubekwa okufunekayo kudlula amandla omatshini aqinisekisiweyo.
  • Idayi incinci ngokungaqhelekanga, ibuthathaka, igobile okanye kunzima ukuyikhulula kwiteyiphu.
  • Le mveliso ifuna ukulungiswa kwe-flip-chip okuphucukileyo okanye ukufudumeza okulawulwayo.
  • Uhlolo olufunekayo alunakuphunyezwa nge-optics kunye nesoftware efakiweyo.
Uyilo lweNkqubo

Imephu yeNkqubo yokubopha i-ASM AD830

Isiphumo semveliso sixhomekeke kunxibelelwano phakathi kokuphathwa kwezinto, ukulungiswa kwe-epoxy, ukukhululwa kwedayi, ukuthuthwa kwevacuum, ukulungelelaniswa kombono kunye nokubekwa okucwangcisiweyo. Isigaba ngasinye kufuneka sivavanywe njengenxalenye yenkqubo enye epheleleyo.

INYATHELO 01

Igalelo lesakhelo seNkokeli

Ilifti yemagazini okanye i-stack loader elungiselelweyo inika isakhelo se-lead esingacutshungulwanga kwithrekhi yomnini-msebenzi.

INYATHELO 02

Ukusetyenziswa kwe-Epoxy

Inaliti yokukhupha okanye isixhobo sokunyathela sifaka i-epoxy yesilivere kwiindawo zokubopha ezicwangcisiweyo.

INYATHELO 03

Ukukhangela iWafer

Itafile ye-wafer kunye nenkqubo yokuqaphela ifumana idayisi ekhethiweyo kwaye ibale ukulungiswa okufunekayo.

INYATHELO 04

Ukwahlukana Ngokufa

I-ejector kunye ne-collet zisebenza kunye ukukhulula idayisi kwi-wafer tape kunye nokuseta i-vacuum pickup ezinzileyo.

INYATHELO 05

Ukubekwa kweDie

Intloko yebhondi idlulisela idayisi ize iyibeke kusetyenziswa indawo ecwangcisiweyo, ukuphakama, ukujongwa kunye namandla.

INYATHELO 06

Ukuhlolwa kunye neziphumo

Isiphumo senkqubo sihlolwa ngokweresiphi ngaphambi kokuba isakhelo se-lead esigqityiweyo sithuthelwe kwimagazini yemveliso.

Umjikelo owomileyo ophumelelayo awuqinisekisi ukufaneleka kwemveliso. Ukukhutshwa kwedayi ezinzileyo, ukuthuthwa kwevacuum, ukufakwa kwe-epoxy, ukubekwa kunye nokuhlolwa kufuneka kuqinisekiswe kusetyenziswa ii-wafers ezimeleyo, iifreyimu ze-lead, izixhobo kunye nezinto zokucubungula.
Internal modules of ASM AD830 Plus die bonding machine
Izixhobo zangaphakathi, ii-loaders, ii-optics, izitishi ze-epoxy kunye nezixhobo kufuneka ziqinisekiswe kumatshini wokwenyani endaweni yokuqikelelwa kwigama lemodeli ye-AD830.
Intshayelelo yePhakheji

Ukudlulisela Imveliso kwi-ASM AD830

Ukudluliselwa kwemveliso akufuneki kuqale ngokukopa ifayile yephakheji kwaye kusebenze izinto ngoko nangoko. Uqwalaselo lomatshini wokuqala, izixhobo zoomatshini, izinto ezisetyenziswayo kwinkqubo, iireferensi zekhamera kunye nemigangatho yokwamkelwa kufuneka kuqala ibhalwe phantsi.

01

Bhala phantsi isiseko senkqubo ekhoyo

Ubungakanani bedayi yoxwebhu, iteyiphu ye-wafer, umzobo wefreyimu yelead, i-epoxy yesilivere, ulandelelwano lomjikelo, iikhrayitheriya zokubekwa kunye nemida yenkqubo eyaziwayo.

02

Thelekisa uQokelelo loMatshini

Thelekisa oomatshini bomthombo kunye nendawo oya kuyo ngomatshini wokufaka, isibambi somsebenzi, itafile ye-wafer, izitishi ze-epoxy, iikhamera, intloko yebhondi, isoftware kunye nenkqubo yokuphuma.

03

Lungisa Izixhobo Ezithile Zemveliso

Qinisekisa i-collet geometry, i-ejector pin, i-ejector cap, i-magnetic anvil, i-window clamp, iimagazini kunye nezixhobo zokulinganisa kwiphakheji ekujoliswe kuyo.

04

Yakha kwakhona iiReferensi zoomatshini

Fundisa ububanzi bendlela, iindawo zemagazini, ii-wafer coordinates, iindawo ze-epoxy, ukuphakama kwe-pickup, ukuphakama kwe-bond kunye nokususwa kwezixhobo.

05

Yenza kwakhona iiResiphi zoMbono kunye neNkqubo

Qinisekisa ukugxila kunye nokukhanya ngaphambi kokufundisa i-wafer PR, iireferensi zefreyimu yelead, ukulungelelaniswa kwe-epoxy, ukuqatshelwa kwedayi kunye nokuhlolwa kwe-post-bond.

06

Iimvavanyo zeSampuli eziLawuliweyo eziGqibeleleyo

Qala ngobuninzi besampulu obulinganiselweyo, hlola inkqubo epheleleyo kunye nemveliso yokukhupha kuphela emva kokuba kuhlangatyezwane neendlela zokwamkelwa ezivunyiweyo.

Umatshini wokushicilela iminwe

Iindawo ezintandathu zoQwalaselo lwe-AD830 ekufuneka ziqinisekiswe

Umatshini we-AD830 Plus ufanele uphathwe njengenkqubo yemveliso epheleleyo ecwangcisiweyo. Ezi ndawo zintandathu zimisela ukuba izixhobo zinokuxhasa na iphakheji ekujoliswe kuyo.

UKULUNGISWA 01

Igalelo lesakhelo seNkokeli

Chonga indlela iifreyimu zelothe ezingasetyenzwanga ezingena ngayo kumatshini kunye nokuba ingaba isilayishi siyahambelana na nemagazini yemveliso okanye izinto ezihlanganisiweyo.

  • Ilifti yokufaka imagazini
  • Ulungiselelo lokulayisha i-stack
  • Ubungakanani bemagazini kunye nebala lokudlala
  • Inkxaso kunye nezinzwa zesakhelo se-lead
UKULUNGISWA 02

Ukuphathwa kweWafer

Qinisekisa ubungakanani be-wafer, ubungakanani befreyimu, intshukumo yetafile, ukulungiswa kwe-theta, ukwandiswa kunye nokulayisha i-wafer ngokuzenzekelayo okukhethwayo.

  • Ukuhambelana kweringi yewafer okanye isakhelo
  • Itafile yewafer kunye nokwandiswa
  • Imagazini yeWafer kunye negripper
  • Iimfuneko zemephu ye-wafer
UKULUNGISWA 03

Inkqubo ye-Epoxy

Qinisekisa ukuba umatshini usebenzisa i-dispensing, stamping okanye olunye ulungiselelo lwesicelo se-silver-epoxy olucwangcisiweyo.

  • Isirinji kunye nenaliti yokukhupha
  • Izixhobo zokunyathela okanye zokudipha
  • Itreyi ye-Epoxy kunye nolawulo lwenqanaba
  • Uxinzelelo, iimoto kunye nezinzwa
UKULUNGISWA 04

Intloko yeBond kunye nePickup

Jonga intshukumo, i-vacuum, ingalo yebhondi, ulawulo lwamandla kunye nemeko yoomatshini yenkqubo epheleleyo ye-die-pick kunye ne-placement.

  • Intshukumo ye-XYZ bond-head
  • I-collet kunye ne-vacuum passage
  • Iphini yokuphuma kunye nesivalo se-ejector
  • Impendulo yokuthatha kunye ne-bond-force
UKULUNGISWA 05

Umbono kunye noHlolo

Qinisekisa ukuba zeziphi iikhamera, iilensi, iiyunithi zokukhanyisa kunye nemisebenzi yokuqaphela efakwe ngokwasemzimbeni kwaye isebenza.

  • Ukuqatshelwa kwe-wafer kunye ne-die
  • Ulungelelwaniso lwesalathiso sesakhelo se-lead
  • I-Epoxy-position optics
  • Ukuhlolwa kwe-pre-bond kunye ne-post-bond
UKULUNGISWA 06

Isibambi somsebenzi kunye nesiphumo

Qinisekisa ukuba ithrekhi, i-anvil, i-clamp, izinto zokudlulisa kunye ne-output elevator zixhasa ifomathi yokwenyani yesakhelo se-lead.

  • Ububanzi bethrekhi kunye nendlela yokuthutha
  • I-anvil yemagnethi kunye ne-closet yefestile
  • Ilifti yemagazini ephumayo
  • Ukudluliselwa kwezinto ezigqityiweyo
Ukuqinisekiswa kweSampuli

Isakhelo soKwamkelwa kweMveliso ye-AD830

Iikhrayitheriya zokwamkelwa kufuneka kuvunyelwane ngazo ngaphambi kokuba uvavanyo lwesampulu luqale. Uvavanyo kufuneka luvavanye indlela yokuvelisa ephinda-phindayo endaweni yokubeka enye ephumeleleyo.

Indawo yoVavanyo Oko Ufanele Ukukujonga Isizathu Sokuba Kubalulekile Ubungqina obucetyiswayo
Udluliselo lwezintoIntshukumo yokufaka, umkhondo kunye nemveliso Ukulayisha iimagazini, ukuhamba kwe-pusher, ukudwelisa, inkxaso kunye nokubeka imveliso kwindawo yazo Ukuphazamiseka koomatshini okanye ukudluliselwa okungazinzanga kunokuthintela imveliso nokuba ukubopha kulungile. Uvavanyo lokudlulisela oluqhubekayo kusetyenziswa iifreyimu zokwenyani kunye neemagazini
Ukukhululwa NgokufaIteyiphu ye-wafer kunye nokuziphatha kwe-ejector Ukwahlulwa kwedayi, ukuphakama kwe-ejector, intshukumo yedayi kunye neempawu zokuqhekeka okanye ukuqhekeka Ukungazinzi kokukhululwa kubangela ukufa okungekhoyo, ukufa okonakeleyo kunye nokwahluka kwendawo. Uvavanyo lokuthatha indawo kwiindawo ezimele i-wafer
Ukulandwa kweVacuumImpendulo yeCollet kunye nokuhamba komoya Ukungaguquguquki kokulandwa, ukuzinza kwe-vacuum, impendulo yokungafi kunye nokuphinda ukhethe ngokuzenzekelayo Umjikelo owomileyo awunakuphinda uvelise indlela esebenza ngayo i-vacuum kunye ne-tape-release yokuziphatha kwee-die zokwenyani. Iziphumo zokuthathwa ezirekhodiweyo kusetyenziswa iidayi ezilingana nemveliso
Idiphozithi ye-EpoxyUkukhupha okanye ukufaka isitampu Indawo yokufaka idiphozithi, ukuhambelana komthamo, imilo, ukubopha kunye nokuphindaphinda kwenkqubo I-epoxy engaguqukiyo ichaphazela umgangatho we-bond-line, ungcoliseko kunye nokuthembeka okusezantsi. Ukuhlolwa kweediphozithi eziphindaphindwayo kwimakroskopu ngaphambi kokufakwa kwidizeyiphu
Ukubekwa kweDieIndawo kunye nolwalathiso Ukulinganisa, ukujikeleza, isihlalo esitshileyo, amandla okubopha kunye nokuphindaphinda kwisakhelo se-lead Umgangatho wokubekwa uchaphazela ngokuthe ngqo ukuhlanganiswa kwephakheji kunye nokubopha ucingo olusezantsi. Iisampulu ezilinganisiweyo ezivela kwiindawo ezininzi kunye nemijikelo ephindaphindwayo
Ukuhlolwa koMbonoUzinzo lwe-PR Ukugxila kumfanekiso, ukukhanya, ukuqatshelwa kwesalathiso, ukuphindaphindwa kokukhangela kunye nempendulo yokwaliwa Umfanekiso obonakalayo wodwa awuqinisekisi ukuqatshelwa okuzinzileyo okanye ukusebenza kokuhlolwa. Uphendlo oluphindaphindwayo lwe-PR kunye neesampuli zeziphene ezilawulwayo

Phinda Uvavanyo

Vavanya imijikelo emininzi kunye neendawo zezinto ezibonakalayo endaweni yokuvuma ulandelelwano olunye oluphumeleleyo.

Rekhoda iresiphi

Gcina useto lomatshini, iinombolo zezixhobo, ibhetshi yezinto kunye neereferensi zokuhlola.

Hlola iisampuli zokwenyani

Sebenzisa uhlolo lwe-optical okanye lwenkqubo olufanelekileyo kwiphakheji kunye nezinto zokuncamathisela.

Chaza iikhrayitheriya zokukhululwa

Vumelanani ukuba ngubani ovumayo isampuli kunye nokuba zeziphi izilinganiso ezifunekayo ngaphambi kokuba kwenziwe imveliso.

Ukuxilongwa kwenkqubo

Iimpawu zeNkqubo ze-AD830 eziqhelekileyo ekufuneka ziphandwe

I-alamu yomatshini idla ngokuchonga inqanaba apho inkqubo iyeke khona, kodwa ayisoloko ingunobangela oyintloko. Iimeko zoomatshini, izinto, izixhobo, i-vacuum, umbono kunye neeresiphi kufuneka zijongwe kunye.

Ii-alamu Ezisoloko Zilahlekile

Phandaungcoliseko lwe-collet, ukuvuza kwe-vacuum, iipaseji ezivaliweyo, ukuphakama kwe-pickup, imeko ye-ejector, ukwandiswa kwe-wafer, ukunamathela kwi-tapekunye nezicwangciso zokufumanisa ukuhamba komoya ngaphambi kokutshintsha isenzi.

Ukucholwa kweeDie okungazinzanga

Itshekhiijiyometri ye-ejector-pin, ubukhulu be-die, imeko yeteyiphu, inqanaba le-vacuum, ubukhulu be-collet, amandla okuthathakunye nokulungelelaniswa phakathi kwe-ejector kunye nengalo yebhondi.

Iidiphozithi ze-Epoxy ezingaguquguqukiyo

Uhloloi-epoxy viscosity, ixesha lokusebenza, uxinzelelo, isixhobo senaliti okanye sokunyathela, ukuphakama kwediphozithi, inqanaba letreyi, ukulibazisekakunye nongcoliseko olujikeleze isikhululo senkqubo.

Ukusilela kokuQondwa kwePateni

Itshekhiukugxila kwikhamera, ungcoliseko lwelensi, ukukhanya, umahluko womfanekiso, ukhetho lwesalathiso, intshukumo yemvelisonokuba ifayile yephakheji echanekileyo ilayishiwe na.

IiJam zokudlulisa iiLead-Frame

Qinisekisaububanzi bendlela, indawo yemagazini, ukuba tyaba kwefreyimu, i-anvil yokuxhasa, ukususwa kwe-clamp, ukulungelelaniswa kwe-pusherkunye ne-epoxy okanye inkunkuma eqokelelweyo kwindlela yokuthutha.

Ukubekwa kwe-Offset okanye i-Rotation

Phandaiireferensi zombono, ukulungiswa kwe-wafer-theta, imeko yesixhobo, intshukumo yedayi ngaphakathi kwekhola, ukuphakama kwebhondi, inkxaso yesakhelo seleadkunye nokulinganiswa koomatshini.

Ukutshintshwa koomatshini

Ukutshintsha i-ASM AD830 Plus ekhoyo

Xa kutshintshwa i-AD830 Plus ekhoyo, ukuthelekisa kuphela umenzi kunye nomzekelo akwanelanga. Umatshini wokutshintsha kufuneka uthelekiswe nomatshini wokuqala kwinqanaba loqwalaselo, izixhobo, isoftware, ukuphathwa kwezinto kunye nenqanaba lokusetyenziswa.

Uthelekiso olucwangcisiweyo lunciphisa umngcipheko wokufumana umatshini osebenza ngokuchanekileyo kodwa ongenakulayisha isakhelo se-lead esikhoyo, osebenzisa i-wafer ring yangoku, ophinda enze inkqubo ye-epoxy okanye owamkela izixhobo ezikhoyo zomzi-mveliso.

  • Imodeli yomatshini, inombolo yothotho kunye nonyaka
  • Iimfuno zobonelelo ngombane kunye neenkonzo zikagesi
  • Ubungakanani bokufaka kunye nobukhulu bemagazini
  • Uqwalaselo lomsebenzi kunye nomgca
  • Itafile yewafer, isakhelo kunye nenkqubo yokulayisha
  • Izixhobo zokukhupha okanye zokunyathela i-epoxy
  • Uqwalaselo lwe-Bond-head kunye ne-force
  • Iikhamera, iilensi kunye nezixhobo zokukhanyisa
  • Inguqulelo yesoftware kunye neekopi ezikhoyo
  • Iifayile zephakheji kunye nedatha yokulinganisa
  • IiCollets, ii-ejectors, ii-anvils kunye nee-clamps
  • Ilifti ephumayo kunye neemagazini ezigqityiweyo
Imibuzo ebuzwa qho

Imibuzo ebuzwa rhoqo ngeBonder yi-ASM AD830

Imibuzo eqhelekileyo malunga nokuqanjwa kwamagama kwe-AD830, usetyenziso, ukufanisa uqwalaselo, ukudluliselwa kwemveliso kunye novavanyo lweesampuli.

Ingaba i-ASM AD830 iyafana ne-ASM AD830 Plus?
I-AD830 isetyenziswa rhoqo njengophendlo olufutshane okanye isalathiso sezixhobo ze-ASM AD830 Plus. Amaxwebhu kunye neerekhodi zoomatshini zinokusebenzisa i-AD830PLUS okanye i-ASM AD 830 PLUS. Uyilo oluchanekileyo lwemodeli kufuneka luqinisekiswe rhoqo kwi-nameplate yomatshini.
Yeyiphi inkqubo eyenzelwe yona i-ASM AD830 die bonder?
Indlela ephambili yokuvelisa yi-wafer-to-lead-frame die attach ezenzekelayo kusetyenziswa i-silver epoxy. Le nkqubo ingabandakanya ukulayishwa kwe-lead-frame, ukusasazwa kwe-epoxy okanye ukunyatheliswa, ukubeka i-wafer kwindawo yayo, ukuthuthwa kwe-die, ukubeka, ukuhlola kunye nokuphathwa kwemveliso.
Ngaba yonke i-AD830 Plus ingasebenzisa imveliso efanayo?
Hayi. Oomatshini abanegama elifanayo lomzekelo banokuba nee-wafer loaders ezahlukeneyo, i-lead-frame inputs, ii-epoxy modules, i-optics, isoftware, izixhobo kunye noqwalaselo lwemveliso. Iphakheji yemveliso kunye noqwalaselo lokwenyani lomatshini kufuneka kuthelekiswa.
Ngaba ifayile yephakheji ye-AD830 ingakopishwa ngqo komnye umatshini?
Ifayile yephakheji inokubonelela ngereferensi yenkqubo eluncedo, kodwa iindawo zoomatshini, iikhamera, izixhobo, iindawo zokulayisha, useto lwendlela, ubude bokuthathwa, ukuphakama kwebhondi kunye neereferensi zokuhlolwa zihlala zifuna ukuqinisekiswa okanye ukufundiswa kumatshini oya kuwo.
Zeziphi izixhobo ezihlala zijongwa ukuze kudluliselwe imveliso ye-AD830?
Izixhobo zingabandakanya i-die collet, i-ejector pin, i-ejector cap, i-magnetic anvil, i-window clamp, i-wafer frame, iimagazini kunye nezixhobo ze-epoxy dispensing okanye stamping. Ukuhambelana kuxhomekeke kuyilo lwe-die kunye ne-lead-frame.
Kutheni uvavanyo lwesampuli yezinto ezibonakalayo lubalulekile?
Umjikelo owomileyo awuvelisi ukunamathela kwe-wafer-tape, ukukhululwa kwedayi, ukuthathwa kwe-vacuum, ukuziphatha kwe-silver-epoxy okanye utshintsho lwefreyimu ye-lead. Izinto ezimeleyo ziyafuneka ukuze kuvavanywe ulandelelwano olupheleleyo lwemveliso.
Loluphi ulwazi olufunekayo ukuze kuhambelane nomatshini we-AD830?
Nika ubungakanani kunye nobukhulu bedayi, ubungakanani bewafer kunye nesakhelo, iteyiphu yewafer, umzobo wefreyimu yelead, umzobo wemagazini, inkqubo ye-epoxy, ulwazi lwezixhobo, ukuchaneka okufunekayo, iikhrayitheriya zokuhlola, injongo yemveliso kunye nendawo ekuyiwa kuyo.
Ndingajonga phi ukuba i-ASM AD830 Plus ifumaneka na?
Ukufumaneka kwezixhobo ngoku, ububanzi bokuhlolwa kunye noqwalaselo oluqukiweyo lunokuhlolwa kwiiphepha le-bonder elisetyenzisiweyo le-ASM AD830 Plus.

Hlaziya iimfuno zakho zeMveliso ye-ASM AD830

Thumela idatha yakho yedayi, i-wafer, i-lead-frame, inkqubo yesilivere-epoxy kunye nolwazi olukhoyo lomatshini ukuze uphonononge uqwalaselo lwe-AD830 kunye nokuhambelana kwezixhobo.

Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha

Qhagamshelana nengcali yokuthengisa

Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.

Isicelo sokuthengisa

Silandele

Hlala uqhagamshelene nathi ukuze ufumane izinto ezintsha zamva nje, izibonelelo ezikhethekileyo, kunye nokuqonda okuya kuphakamisa ishishini lakho ukuya kwinqanaba elilandelayo.

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