SAKI smt Ekyuma kya 3D AOI 3Di MS2

Wammanga ye nnyanjula enzijuvu ku SAKI 3D AOI 3Di MS2, ekwata ku kifo kyayo, tekinologiya omukulu, ebikozesebwa mu mirimu, okukozesa mu makolero n’enkizo mu kuvuganya. Ebirimu bitegekeddwa okusinziira ku mutindo gw’amakolero ogw’awamu n’engeri ezimanyiddwa ez’ebyuma ebifaanagana. Okumanya ebipimo ebitongole, nsaba otunule mu mawulire amatongole:

1. Okukubaganya ebirowoozo ku byuma

Omuze guno: SAKI 3Di MS2

Ekika: Ebyuma ebikebera amaaso mu ngeri ya 3D (AOI)

Ekigendererwa ekikulu: Ekozesebwa mu kwekenneenya omutindo ogw’ebitundu bisatu mu ngeri entuufu oluvannyuma lw’okukuŋŋaanya PCB mu layini z’okufulumya SMT (surface mount technology) okukakasa nti ebiyungo bya solder, okussa ebitundu, n’ebirala bituukana n’omutindo gw’enkola.

Ekkubo ery’ekikugu: Gatta ebifaananyi bya 3D ebirina enkoona nnyingi n’enkola za AI okugonjoola obuzibu bwa 2D AOI ey’ennono mu kuzuula obuwanvu n’ebitundu ebizibu.

2. Tekinologiya omukulu n’okusengeka ebikozesebwa

(1) Enkola y’okukuba ebifaananyi mu ngeri ya 3D

Omusingi gw’eby’ekikugu:

Laser triangulation oba structured light projection, okuyita mu multi-axis scanning okufuna data ey’ebitundu bisatu nga obuwanvu bw’ekiyungo kya solder, volume, shape, n’ebirala.

Okusalawo kuyinza okutuuka ku ddaala lya micron (nga 1μm Z-axis repeatability), okuwagira okuzuula ebitundu ebitonotono (nga 01005 package).

Enkola y’ensibuko y’ekitangaala:

Ensibuko y’ekitangaala ekigatta eby’enjawulo (multi-spectral combined light source) (nga RGB+infrared) eyongera ku njawulo y’obulema (nga bridging, cold solder joints) nga etaasa mu nkoona ez’enjawulo.

(2) Okufuga entambula mu ngeri entuufu ennyo

High-speed linear motor: Tuuka ku kuteeka mu kifo eky’amangu n’okusika, okutuukagana ne layini z’okufulumya ezikuba ennyo (nga UPH ≥ 300 boards/hour).

Dual track option: Ensengeka ezimu ziwagira dual-track synchronous detection okulongoosa throughput.

(3) Omukutu gwa pulogulaamu ogw’amagezi

Okugabanya obulema mu AI:

Okusinziira ku tterekero ly’enkola y’okuyiga okuzitowa, lizuula mu ngeri ey’otoma ebiyungo bya solder ebibi (solder etamala, voids, offsets, n’ebirala) n’obulema mu bitundu (amayinja g’entaana, ebitundu ebikyamu, n’ebirala), ekikendeeza ku muwendo gwa alamu ey’obulimba.

Enzirukanya ya Formula:

Awagira okukola pulogulaamu ezitali ku mutimbagano n’okukoppa, ekyusa mangu ebika by’ebintu, era ekendeeza ku budde bw’okukyusa layini.

3. Emirimu emikulu n’obusobozi bw’okuzuula

(1) Okuzuula ekiyungo kya solder

3D parameter quantification: Pima obuwanvu bw’ekiyungo kya solder, obuzito, enkoona y’okukwatagana, n’ebirala, era olamula bulungi ebikyamu nga ebiyungo bya solder ebinyogovu, bridging, n’emipira gya solder.

BGA/CSP inspection: Sikaani ebiyungo bya solder ebikwese okuyita ku bbali w’ekitundu okugonjoola ekizibu ky’ekifo ekizibe ekya 2D AOI.

(2) Okukebera okuteekebwa kw’ebitundu

Okubeerawo/polarity: Laba ebitundu ebibula, ebikyusiddwa, n’ebikyamu.

Obutuufu bw’ekifo: Zuula offset ne tilt (nga QFN side solder feet).

(3) Okukwatagana

Board ekika adaptation: flexible board (FPC), rigid board, ekikomo ekinene board, n'ebirala.

Component range: 0201 micro components okutuuka ku biyungo ebinene n’ebibikka ebiziyiza.

4. Ensonga z’okukozesa amakolero

Ennimiro ey’obwesigwa obw’amaanyi:

Ebyuma ebikozesebwa mu mmotoka: ECU, modulo ya sensa (etuukana n’omutindo gwa IPC-A-610 Class 3).

Ebikozesebwa mu by’obujjanjabi: Ekyuma ekiteekebwa mu mubiri PCB, kyetaagisa zero defects.

Okupakinga mu density enkulu:

Smartphone motherboard (POP packaging), modulo y’empuliziganya eya 5G.

Okugatta layini z’okufulumya mu ngeri ey’obwengula:

Link ne SPI (solder paste detection), reflow oven ne data y’ebyuma ebirala okutuuka ku kulondoola omutindo gw’enkola mu bujjuvu.

5. Okwekenenya Enkizo mu kuvuganya

(1) Bw’ogeraageranya ne 2D AOI ey’ennono

Okusalawo okukyamu okutono: Data y’obuwanvu bwa 3D yeewala okutaataaganyizibwa kwa langi n’okutunula.

Okubikka okugazi: Asobola okuzuula ebiyungo bya solder ebikwese (nga ebitundu bya terminal ebya wansi).

(2) Bw’ogeraageranya ne 3D AOI efaanagana

Enzikiriziganya wakati w’embiro n’obutuufu: Tekinologiya wa SAKI ow’okusika mu ngeri ey’enjawulo (parallel scanning technology) atunuulira sipiidi y’okuzuula n’okusalawo mu bujjuvu.

Open data interface: Ewagira okukwatagana n’enkola za MES/SPC okuyamba okuzimba amakolero amagezi.

(3) Okukendeeza ku nsaasaanya

Okukendeeza ku ssente ezisaasaanyizibwa mu kuddamu okwekenneenya: Obutuufu obw’amaanyi bukendeeza ku ssaawa z’okuddamu okwekenneenya mu ngalo.

Okuddaabiriza okuziyiza: Zuula enkyukakyuka mu nkola (nga okukuba ebitabo mu ngeri etaali ya bulijjo mu solder paste) nga bukyali okuyita mu kwekenneenya emitendera.

6. Emirimu egyongezeddwayo egy’okwesalirawo

Okukebera enjuyi bbiri: Okukebera kwa PCB okw’enjuyi bbiri okujjuvu mu kusiba kumu.

AI self-optimization: Yiga obutasalako enkola empya ez’obulema n’okulongoosa mu ngeri ey’amaanyi omutindo gw’okukebera.

Okuzuula obulwadde okuva ewala: Okulondoola n’okuddaabiriza ebyuma mu kiseera ekituufu nga tuyita mu yintaneeti y’ebintu (IoT).

7. Ebigonjoola ensonga y’obulumi bw’omukozesa ebya bulijjo

Ekizibu: Obulabe bw’okujjukira olw’okusubwa okwekebejja ebiyungo bya solder bya PCB eby’emmotoka.

→ 3Di MS2 solution: Okuyita mu kwekenneenya obuzito bw’ekiyungo kya solder mu 3D, ebitundu 100% eby’ebiyungo bya solder ebirina obuwanvu obutamala bikwatibwa.

Ekizibu: Enkyukakyuka mu layini y’okufulumya enfunda eziwera ziviirako okulongoosa AOI okutwala obudde.

→ Ekigonjoolwa: Offline formula library + AI adaptation, okukendeeza ku budde bw’okukyusa okutuuka mu ddakiika 10.