SAKI smt 3D AOI machine 3Di MS2

Oku kulandelayo yintshayelelo ebanzi ye-SAKI 3D AOI 3Di MS2, equka indawo yayo, ubuchwephesha obungundoqo, iimpawu zokusebenza, usetyenziso lweshishini kunye neenzuzo zokhuphiswano. Umxholo ulungelelaniswe ngokusekelwe kwimigangatho jikelele yoshishino kunye neempawu eziqhelekileyo zezixhobo ezifanayo. Ngeeparamitha ezithile, nceda ubhekisele kulwazi olusemthethweni:

1. Isishwankathelo seZixhobo

Umzekelo: SAKI 3Di MS2

Uhlobo: Isixhobo sokuhlola esizenzekelayo se-3D (AOI)

Injongo engundoqo: Isetyenziselwa ukuchaneka okuphezulu komgangatho wokuhlolwa kwemigangatho emithathu emva kwendibano ye-PCB kwi-SMT (i-teknoloji ye-surface mount) imigca yokuvelisa ukuqinisekisa ukuba i-solder joints, i-component mounting, njl. ihlangabezana nemigangatho yenkqubo.

Indlela yobugcisa: Hlanganisa i-multi-angle ye-3D imaging kunye ne-AI algorithms ukusombulula imida ye-AOI yendabuko ye-2D ekubonweni kobude kunye namacandelo anzima.

2. Itekhnoloji engundoqo kunye noqwalaselo lwe-hardware

(1) Inkqubo yomfanekiso we-3D

Umgaqo wobugcisa:

I-Laser triangulation okanye iprojekti yokukhanya ecwangcisiweyo, ngokusebenzisa ukuskena kwe-multi-axis ukufumana idatha ye-dimensional efana nobude be-solder joint, umthamo, imilo, njl.

Isisombululo sinokufikelela kwinqanaba le-micron (njenge-1μm Z-axis repeatability), ixhasa ukufunyanwa kwezinto ezincinci (ezifana nephakheji ye-01005).

Inkqubo yomthombo wokukhanya:

Umthombo wokukhanya odityanisiweyo wemulti-spectral (ofana ne-RGB+infrared) uphucula umahluko osisiphene (njengokubopha ibhulorho, i-cold solder joints) ngokukhanyisa kwii-engile ezahlukeneyo.

(2) Ulawulo lwentshukumo oluchanekileyo

I-Speed-speed linear motor: Ukufezekisa ukuma ngokukhawuleza kunye nokuskena, ukulungelelanisa kwimigca yokuvelisa i-high-beat (njenge-UPH ≥ 300 iibhodi / iyure).

Ukhetho lwengoma ephindwe kabini: Olunye ubumbeko luxhasa ubhaqo lwengoma ezimbini ngaxeshanye ukuze kuphuculwe umthamo.

(3) Iqonga lesoftware elikrelekrele

Ukuhlelwa kwesiphene se-AI:

Ngokusekwe kwilayibrari ye-algorithm yokufunda enzulu, ichonga ngokuzenzekelayo i-solder engalunganga (i-solder enganelanga, i-voids, i-offsets, njl.) kunye neziphene zecandelo (amatye amangcwaba, iindawo ezingalunganga, njl.), ukunciphisa izinga le-alamu yobuxoki.

Ulawulo lwefomula:

Ixhasa inkqubo engaxhunyiwe kwi-intanethi kunye nokulinganisa, itshintshe ngokukhawuleza imodeli yemveliso, kwaye inciphisa ixesha lokutshintsha umgca.

3. Imisebenzi engundoqo kunye nezakhono zokubona

(1) Ukufunyanwa kwe-solder joint

Ubungakanani bepharamitha ye-3D: Linganisa ubude bomdibaniso we-solder, ivolumu, i-engile yoqhagamshelwano, njl.

Ukuhlolwa kwe-BGA/CSP: Skena ikhonkco le-solder elifihliweyo ngomphetho wecandelo ukusombulula ingxaki yendawo eyimfama ye-2D AOI.

(2) Ukuhlolwa kokubekwa kwecandelo

Ubukho/ipolarity: Chonga izinto ezingekhoyo, ezibuyiselwe umva, nezingalunganga.

Ukuchaneka kwendawo: Khangela i-offset kunye ne-tilt (ezifana neenyawo ze-solder ze-QFN ezisecaleni).

(3) Ukuhambelana

Ukulungelelaniswa kohlobo lwebhodi: ibhodi eguquguqukayo (FPC), ibhodi eqinile, ibhodi yobhedu engqingqwa, njl.

Uluhlu lwamacandelo: 0201 amacandelo amancinci kwiikhonkco ezinkulu kunye nezikhuselo zokukhusela.

4. Iimeko zesicelo seshishini

Indawo yokuthembeka okuphezulu:

I-elektroniki ye-Automotive: I-ECU, imodyuli ye-sensor (ihambelana ne-IPC-A-610 i-Class 3 standard).

Izixhobo zonyango: Isixhobo esifakelweyo sePCB, esifuna iziphene zero.

Ukupakishwa koxinano oluphezulu:

I-motherboard ye-Smartphone (ukupakishwa kwePOP), imodyuli yonxibelelwano ye-5G.

Ukudityaniswa komgca wemveliso ngokuzenzekelayo:

Ikhonkco kunye ne-SPI (ukufumanisa i-solder paste), i-oven ye-reflow kunye nezinye iinkcukacha zezixhobo zokufezekisa ulawulo olupheleleyo lwenkqubo.

5. Uhlalutyo lwe-Advantage yoKhuphiswano

(1) Xa kuthelekiswa ne-2D AOI yemveli

Izigwebo eziphosakeleyo ezimbalwa: Idatha yobude be-3D inqanda umbala kunye nokuphazamiseka kokubonakalisa.

Ukugubungela ngokubanzi: Iyakwazi ukubona iindawo ezifihliweyo ze-solder (ezifana namacandelo e-terminal esezantsi).

(2) Xa kuthelekiswa ne-3D AOI efanayo

Ibhalansi phakathi kwesantya kunye nokuchaneka: Itekhnoloji yokuskena ehambelanayo ye-SAKI ithathela ingqalelo zombini isantya kunye nesisombululo senkcukacha.

I-interface yedatha evulekileyo: Ixhasa ukuhlanganiswa kunye neenkqubo ze-MES / SPC zokunceda ukwakha iifektri ezihlakaniphile.

(3) Ukusebenza kweendleko

Ukunciphisa iindleko zokuhlola kwakhona: Ukuchaneka okuphezulu kunciphisa iiyure zokuphinda zihlolwe ngesandla.

Ulondolozo lothintelo: Khangela uguquguquko lwenkqubo (efana noshicilelo lwe-solder paste engaqhelekanga) kwangaphambili ngohlalutyo lwentsingiselo.

6. Ukuzikhethela imisebenzi eyandisiweyo

Ukuhlolwa kwamacala amabini: Gqibezela uhlolo lwePCB olunamacala amabini kwindawo enye.

Ukuziphucula kwe-AI: Qhubeka ufunda iipateni ezintsha zesiphene kunye nokuhlaziya imigangatho yokuhlola.

Ukuxilongwa okude: Ukujongwa kwezixhobo zexesha langempela kunye nokugcinwa kwe-Intanethi yeZinto (IoT).

7. Izisombululo zeentlungu eziqhelekileyo zomsebenzisi

Ingxaki: Umngcipheko wokukhumbula ngenxa yokuphoswa kokuhlolwa kweemoto zePCB ezidityanisiweyo.

→ isisombululo se-3Di MS2: Ngokuhlalutya umthamo odibeneyo we-solder we-3D, i-100% yamalungu e-solder anobude obungonelanga ayabanjwa.

Ingxaki: Utshintsho lwemveliso rhoqo lukhokelela ekuchitheni ixesha kwi-AOI.

→ Isisombululo: Ithala leencwadi lefomula engasebenziyo + uhlengahlengiso lwe-AI, lifinyeza ixesha lokutshintsha libe kwimizuzu eli-10.