SAKI smt 3D AOI makina 3Di MS2

Zotsatirazi ndi mawu oyamba a SAKI 3D AOI 3Di MS2, kukhudza momwe ilili, ukadaulo wapakatikati, mawonekedwe ake, magwiridwe antchito amakampani ndi maubwino ampikisano. Zomwe zili m'gululi zimakhazikitsidwa motengera momwe makampani amagwirira ntchito komanso mawonekedwe a zida zofananira. Pazigawo zina, chonde onani zambiri zovomerezeka:

1. Zida Mwachidule

Chitsanzo: SAKI 3Di MS2

Mtundu: 3D automatic Optical inspection zida (AOI)

Cholinga chachikulu: Chogwiritsidwa ntchito poyang'ana khalidwe lapamwamba kwambiri la magawo atatu pambuyo pa msonkhano wa PCB mu SMT (ukadaulo wapamwamba kwambiri) mizere yopangira kuti zitsimikizidwe kuti zida zogulitsira, kukwera kwa chigawo, ndi zina zotero.

Njira yaukadaulo: Phatikizani kuyerekeza kwa ma angle angapo a 3D ndi ma aligorivimu a AI kuti muthetse malire a 2D AOI yachikhalidwe pakuzindikira kutalika ndi zigawo zovuta.

2. Zamakono zamakono ndi kasinthidwe ka hardware

(1) Makina ojambula a 3D

mfundo zaukadaulo:

Laser triangulation kapena projekiti yowunikira yowunikira, kudzera pakusaka kwamitundu yambiri kuti mupeze deta yamitundu itatu monga kutalika kwa olowa, voliyumu, mawonekedwe, ndi zina zambiri.

Kusamvanako kumatha kufika mulingo wa micron (monga 1μm Z-axis repeatability), kuthandizira kuzindikira tinthu tating'onoting'ono (monga phukusi la 01005).

Makina opangira magetsi:

Gwero la kuwala kophatikizika kophatikizana kosiyanasiyana (monga RGB + infrared) kumathandizira kusiyanitsa kwachilema (monga kutsekera, malo olumikizirana ozizira) powunikira mosiyanasiyana.

(2) Kuwongolera kolondola kwambiri

Liniya yothamanga kwambiri: Pezani malo othamanga ndi kusanthula, sinthani mizere yopangira zolimba kwambiri (monga UPH ≥ 300 board / ola).

Njira ya mayendedwe apawiri: Zosintha zina zimathandizira kuzindikira kwanjira ziwiri kuti ziwongoleredwe.

(3) Pulatifomu yanzeru

Gulu la vuto la AI:

Kutengera laibulale yakuya ya algorithm yophunzirira, imadziwikiratu ma solder osakwanira (solder osakwanira, voids, offsets, ndi zina zambiri) ndi zolakwika zamagulu (miyala yam'manda, magawo olakwika, ndi zina), kuchepetsa ma alarm abodza.

Kasamalidwe ka fomula:

Imathandizira kupanga mapulogalamu akunja ndi kayeseleledwe, imasintha mwachangu mitundu yazogulitsa, ndikuchepetsa nthawi yosintha mizere.

3. Ntchito zazikulu ndi luso lozindikira

(1) Kuzindikira kolumikizana kwa solder

3D parameter quantification: kuyeza kutalika kwa solder, voliyumu, ngodya yolumikizirana, ndi zina zambiri, ndikuweruza molondola zolakwika monga zolumikizira zoziziritsa kukhosi, bridging, ndi mipira yogulitsira.

Kuyang'ana kwa BGA/CSP: Jambulani zolumikizira zobisika m'mphepete mwa gawo kuti muthetse vuto la 2D AOI.

(2) Kuwunika kwa kuyika kwa gawo

Kukhalapo / polarity: Dziwani zigawo zomwe zikusowa, zosinthidwa, ndi zolakwika.

Kulondola kwa malo: Dziwani zosinthika ndi kupendekeka (monga mapazi a solder a QFN).

(3) Kugwirizana

Kusintha kwamtundu wa board: bolodi losinthika (FPC), bolodi lolimba, bolodi lamkuwa lakuda, etc.

Chigawo chamagulu: 0201 magawo ang'onoang'ono mpaka zolumikizira zazikulu ndi zotchingira zotchinga.

4. Zochitika zogwiritsira ntchito mafakitale

Malo odalirika kwambiri:

Zamagetsi zamagalimoto: ECU, sensor module (yogwirizana ndi IPC-A-610 Class 3 standard).

Zida zachipatala: PCB yoyika makina, yomwe imafunikira ziro zolakwika.

Kupaka kwapamwamba kwambiri:

Smartphone motherboard (POP phukusi), 5G kulankhulana module.

Kuphatikiza kwa mzere wopanga makina:

Lumikizani ndi SPI (kuzindikira phala la solder), uvuni wa reflow ndi data ina ya zida kuti mukwaniritse kuwongolera kwathunthu kwamayendedwe.

5. Kusanthula Ubwino Wopikisana

(1) Poyerekeza ndi 2D AOI yachikhalidwe

Zosankha zolakwika zochepa: Deta ya kutalika kwa 3D imapewa kusokoneza kwa mtundu ndi mawonekedwe.

Kufalikira kwakukulu: Itha kuzindikira zolumikizira zobisika (monga zigawo zapansi).

(2) Poyerekeza ndi 3D AOI yofananira

Kulondola pakati pa liwiro ndi kulondola: Ukadaulo wowunikira mofananira wa SAKI umaganizira za liwiro la kuzindikira komanso kulondola kwatsatanetsatane.

Tsegulani mawonekedwe a data: Imathandizira kuphatikiza ndi machitidwe a MES/SPC kuti athandizire kumanga mafakitale anzeru.

(3) Kusunga ndalama

Chepetsani ndalama zoyenderanso: Kulondola kwambiri kumachepetsa maola owunikiranso pamanja.

Kusamalira kodzitetezera: Dziwani kusinthasintha kwazinthu (monga kusindikiza kwapaste kolakwika) pasadakhale kudzera mukusanthula zomwe zikuchitika.

6. Zosankha zowonjezera ntchito

Kuyang'ana mbali ziwiri: Malizitsani kuyang'ana kwa PCB kumbali ziwiri ndikumangirira kumodzi.

Kudzikonzekeretsa patokha kwa AI: Pitirizani kuphunzira njira zatsopano zopumira ndikusintha machitidwe owunikira.

Kuzindikira kwakutali: Kuwunika ndi kukonza zida zenizeni munthawi yeniyeni kudzera pa intaneti ya Zinthu (IoT).

7. Njira zothetsera ululu wa ogwiritsa ntchito

Vuto: Chiwopsezo chokumbukira chifukwa chakuphonya koyang'anira ma solder a PCB agalimoto.

→ Yankho la 3Di MS2: Kupyolera mu kusanthula kwa voliyumu ya solder ya 3D, 100% ya ma solder okhala ndi kutalika kosakwanira amalandidwa.

Vuto: Kusintha kwa mzere wopangira pafupipafupi kumapangitsa kuti AOI iwononge nthawi.

→ Yankho: Laibulale ya formula yapaintaneti + kusintha kwa AI, kufupikitsa nthawi yosintha kukhala mkati mwa mphindi 10.