asm siemens smt khetha kwaye ubeke umatshini tx1

I-ASM TX1 ngumatshini wokubekwa kwemodyuli ephezulu echanekileyo eqaliswe yi-ASM Pacific Technology Co., Ltd., eyenzelwe ukuxubana okuphezulu, iimfuno ezichanekileyo zokubekwa kwindawo yokuvelisa i-elektroniki yanamhlanje, kwaye ifanelekile kuluhlu olupheleleyo lokubekwa ukusuka kumacandelo e-0201 ukuya kumacandelo amakhulu anokwakheka okukhethekileyo.

1.2 IiNgcaciso zobuGcisa

Izalathisi zobuGcisa beCandelo leParameter

Ukuchaneka kokubekwa ±25μm @3σ (chip) / ±35μm @3σ (QFP)

Esona santya siphezulu sokubeka i-25,000 CPH (phantsi kweemeko ezifanelekileyo)

Uluhlu loLungiselelo lweCandelo 0201~150×150mm (L×W)

Ubuninzi beCandelo Ubude be-25mm

Umthamo we-Fieder Ukuya kuthi ga kwi-120 8mm kwiZikhululo zeFeder

Ubungakanani bebhodi 50×50mm ~ 510×460mm (L×W)

Ubungakanani bomatshini 1,450×1,350×1,450mm (L×W×H)

Ubunzima malunga ne-1,800kg

Iimfuno zamandla 400VAC 3-isigaba 50/60Hz 15kVA

Iimfuno zoMoya oQinisekileyo 5.5 ~ 6.5bar, Ucocekile kunye noMoya owomileyo

II. Umgaqo wokuSebenza kunye neNkqubo yoYilo lweNkqubo

2.1 Umgaqo ongundoqo wokusebenza

Ulawulo lwentshukumo:

Umgca wemoto uqhuba i-XY axis

Ukuchaneka okuphezulu kokulinganisa isikali esivaliweyo solawulo lwelophu (isisombululo 0.1μm)

Inkqubo yombono:

Ikhamera ephezulu: 30MP ishutha yehlabathi jikelele CMOS

Ikhamera esezantsi: I-15MP + yokulinganisa ubude be-laser

Itekhnoloji ye-on-the-fly centering

Inkqubo yokubeka:

Isicatshulwa

Ukubekwa kwe-PCB → ukuchongwa kwelungu → ukujolisa kwindawo yokubhabha → ubhaqo lobude → ukubekwa okuchanekileyo → uqinisekiso lobulunga

2.2 Uyilo lwenkqubo

Inkqubo yoomatshini:

Isiseko sentsimbi yokuphosa (i-coefficient yokwandiswa kwe-thermal <0.8μm/m℃)

I-Carbon fiber beam (ukunciphisa ubunzima be-30%)

Inkqubo yombane:

Unikezelo lwe-I/O ulawulo

Ixesha lokwenyani le-Ethernet yoshishino (EtherCAT)

Inkqubo yesoftware:

I-SIPLACE OS isekwe kuyo Windows 10 IoT

Ixhasa iprotocol yonxibelelwano ye-OPC UA

III. Izinto eziluncedo ezingundoqo kunye nokuqaliswa kweteknoloji

3.1 Inzuzo yokhuphiswano lwemalike

Ibhalansi phakathi kokuchaneka kunye nesantya:

Itekhnoloji yokubeka eyodwa ye-"SoftTouch" inciphisa i-bounce yecandelo

Ulawulo lwe-Z-axis olunamandla lufezekisa ukuchaneka kobude obuyi-±5μm

Umthamo wemveliso oguquguqukayo:

Utshintsho lomgca okhawulezayo (<15 imizuzu yokutshintsha umatshini ogcweleyo)

I-tray yezinto ezixubeneyo kunye ne-reel tape esetyenziswa ngaxeshanye

Inkqubo ekrelekrele yokulinganisa:

Ulungelelwaniso lwe-laser oluzenzekelayo lwendawo yombhobho

I-algorithm yembuyekezo yobushushu (±0.5μm/℃)

3.2 Amanqaku obuchule obutsha

Inkqubo yokutyisa ekrelekrele:

Feida esweni isimo sempilo

Ugcino lwesondlo oluqikelelweyo

Ulawulo lwentshukumo olukwinqanaba eliphezulu:

Isicwangciso segophe sentshukumo yomyalelo wesithathu

I-algorithm yokunciphisa i-Vibration

Inkqubo yokuqinisekisa umgangatho:

Uhlalutyo lwamanani e-SPC kwi-Intanethi

3D ujongano lokuncamathelisa solder

IV. Iimpawu ezisebenzayo kunye nexabiso lesicelo

4.1 Imisebenzi engundoqo

Ukubekwa kokuchaneka okuphezulu:

Inkxaso yokubekwa kwecandelo le-01005

I-0.3mm ye-pitch elungileyo ye-QFP yokukwazi ukucubungula

Ukwandisa ngobukrelekrele:

Ulungelelwaniso lolandelelwano lobeko oluzenzekelayo

Inkqubo yokuhanjiswa kweNozzle ngokuzenzekelayo

Ukujongwa kwenkqubo:

Ukujongwa kwamandla okubekwa kwexesha lokwenyani

Uqinisekiso lwecandelo oluzenzekelayo

4.2 Ixabiso lomgca wemveliso

Ukuphuculwa kobuchule: i-20% ngokukhawuleza kunesizukulwana sangaphambili semodeli

Ukuphuculwa komgangatho: inqanaba lokuqala lokupasa>99.5%

Ukunciphisa iindleko: ixesha lokutshintsha umgca lincitshiswe nge-40%

Ukuphucula ukuguquguquka: Inkxaso ye-NPI yokungenisa ngokukhawuleza

V. Iimpazamo eziqhelekileyo kunye nezisombululo zokuqhuba

5.1 Ukuhlelwa kwekhowudi yempazamo kunye nokuqhubekeka

Uluhlu lwekhowudi Udidi lwempazamo Amanyathelo okulungisa okuqhelekileyo

1xxx Imposiso yesixokelelwano soomatshini Jonga indlela yokunyakaza/i-lubrication/i-mechanical limit

2xxx Imposiso yenkqubo yombono Coca ilensi/linganisa umthombo wokukhanya/jonga uqhagamshelo lwekhamera

3xxx Impazamo yenkqubo yokutya Qinisekisa ubume bomxhasi/jonga ibhanti lezinto eziphathekayo/ulungelelwaniso lwenzwa

4xxx Impazamo yesistim yeVacuum Khangela umbhobho wokufunxa/coca umbhobho/jonga ivalve ye-solenoid

5xxx Impazamo yenkqubo yokulawula Qala kwakhona umlawuli/jonga ubume beFPGA/uhlaziyo lwe-firmware

5.2 Iimeko zeempazamo eziqhelekileyo

E1205: X-axis indawo yokutenxa:

Unobangela onokwenzeka: ungcoliseko lwesikali sokugawula/ukungaphumeleli kwemoto yomgama

Ukuphatha: Coca isikali sokulinganisa → linganisa imvelaphi →vavanya umsinga wemoto

I-E2310: Ikhamera esezantsi ayijoliswanga:

Unobangela onokwenzeka: Z-axis height sensor drift

Ukuphatha: Yenza ulungelelwaniso logqaliselo oluzenzekelayo → Jonga isivamvo selaser

E3108: Uphazamiseko lonxibelelwano lomnikezeli:

Unobangela onokwenzeka: Ukusilela kwisikhululo sesikhululo sebhasi ye-CAN

Ukuphatha: Jonga isixhasi seterminal (120Ω) → Vavanya imo yebhasi

VI. Inkqubo yogcino

6.1 Isicwangciso solondolozo esithintelwayo

Umjikelo woLondolozo lwezinto Indlela esemgangathweni

Ukucoca umphezulu womatshini wemihla ngemihla ilaphu elingenathuli + nokucoca i-IPA

Weekly Motion guide rail inspection Ukuhlolwa kwentshukumo ngesandla ngesandla

Ukuthanjiswa okuBanzi ngeNyanga Sebenzisa igrisi ekhethekileyo (Kluber ISOFLEX)

Ukuqinisekiswa kokuChaneka kweKota Sebenzisa ibhodi yokulinganisa esemgangathweni

Ukuhlolwa kwenkqubo yoMbane yesiqingatha sonyaka Uvavanyo lwe-Insulation / uvavanyo lokumelana nomhlaba

Qho ngonyaka ulondolozo oluBanzi lwenkonzo yobuchwephesha boMvelisi

6.2 Ukugcinwa kwamacandelo aphambili

Umzila kaloliwe wesikhokelo:

Ukucoca: Sebenzisa ilaphu elingena-lint + i-arhente ekhethekileyo yokucoca

Ukuthambisa: Igrisi esekwe kwiLithium, gcwalisa rhoqo kwiinyanga ezi-3

Inkqubo yokufunxa:

Isihluzi: Faka endaweni nganye iiyure ezingama-500

Umbhobho: Ukubona ukuvuza nyanga zonke

Inkqubo yokubona:

Ukucoca ilensi: Sebenzisa usiba lwelensi qho ngeveki

Ulungelelwaniso lomthombo wokukhanya: Ukubonwa kokukhanya kwenyanga

VII. Iimpazamo eziqhelekileyo kunye neengcamango zokulondoloza

7.1 Inkqubo yokuxilongwa kweempazamo

umbhalo

Impazamo yesenzeko → uqinisekiso lwemposiso ye-HMI → Uvavanyo lokwahlulwa kwenkqubo engaphantsi → Umlinganiselo womqondiso → Ukutshintshwa kwelungu → uqinisekiso lomsebenzi

7.2 Indlela yokulungisa ingxaki

Ukubekwa kokulinganisa:

Inkqubo yokuhlola: ulungelelwaniso lwekhamera → ukunxitywa kwe nozzle → ukucinezela kwePCB

Isicwangciso sogcino: hlengahlengisa → indawo yomlomo → lungisa into ekhoyo

Izinga lokuphoswa okuphezulu:

Inkqubo yokuhlola: ukufumanisa ivacuum → ubude becandelo → indawo yokutyisa

Isicwangciso sogcino: coca umlomo wombhobho → lungisa ubude bokuchola → linganisa isixhasi

Ingxolo engaqhelekanga yomatshini:

Inkqubo yokuhlola: Isikhokelo somgca → ukuxinana kwebhanti → ukuthwala isithuthi

Isicwangciso sogcino: isikhokelo esicocekileyo → lungisa uxinzelelo → buyisela indawo

VIII. Iingcebiso zokugcina kunye nokuphucula

8.1 Isicwangciso sokulondolozwa kancinci kancinci

Inqanaba leFault type Ixesha lokuphendula Izakhono ezifunekayo

L1 Iingxaki zokusebenza Inqanaba loMsebenzi elikhawulezayo

I-L2 Ukungaphumeleli kwe-hardware elula Ngeeyure ezi-4 iGcisa elincinane

I-L3 Ukusilela kwenkqubo entsonkothileyo Kwiiyure ezingama-24 injineli ephezulu

Ukusilela kwecandelo le-L4 Kwisithuba seeyure ezingama-48 uMenzi wenkxaso yobuchwephesha

8.2 Iingcebiso zokuphucula ukusetyenziswa

Uphuculo lweHardware:

Intloko yokubeka echanekileyo ephezulu (±15μm)

Nyukela kwikhamera ye-10MP ephezulu

Uphuculo lwesoftware:

Faka iSuite yoLawulo lweNkqubo ePhakamileyo

Nika amandla i-algorithm yokubeka i-AI

Udibaniso lwenkqubo:

Unxulumano nenkqubo ye-MES/ERP

Ukuqonda umsebenzi wokuxilongwa kude

IX. Ukuziphendukela kweteknoloji kunye nokuma kwemarike

9.1 Indlela yokuphinda imveliso

2018: Ukukhutshwa kwe-TX1 inguqulelo esisiseko

2020: Phucula inkqubo yokulawula intshukumo

2022: Inkqubo edibeneyo yokutya ekrelekrele

Ngo-2024 (ucwangciso): Inguqulelo ye-AI eyongeziweyo ebonakalayo

9.2 Ukuthelekiswa kwemveliso ekhuphisanayo

Iiparamitha ASM TX1 Imveliso ekhuphisanayo A Imveliso yoKhuphiswano B

Ukuchaneka kokubekwa ±25μm ±30μm ±35μm

Isantya esiphezulu 25k CPH 23k CPH 20k CPH

Ixesha lokutshintsha umgca <15 imizuzu 25 imizuzu 30 imizuzu

Ukusetyenziswa kakuhle kwamandla 0.9kW/kCPH 1.2kW/kCPH 1.5kW/kCPH

Inqanaba lobuntlola Advanced Intermediate Basic

X. Isishwankathelo kunye nezona nkqubo zingcono

10.1 Iingcebiso zokusetyenziswa

Ulawulo lokusingqongileyo:

Ubushushu: 23±2℃

Ukufuma: 50±10% RH

Ukungcangcazela: <0.5G (5-200Hz)

Iinkcukacha zokusebenza:

Preheat imizuzu eyi-15 yonke imihla

Gcina iiparamitha zoomatshini rhoqo

Sebenzisa izinto ezisetyenziswayo zoqobo

Uqeqesho lwabasebenzi:

Uqeqesho lwabaqhubi oluqinisekisiweyo (iintsuku ezi-3)

Ikhosi yogcino olukwinqanaba eliphezulu (iintsuku ezi-5)

10.2 Izicelo ezilindelekileyo

I-ASM TX1 ifanelekile ngokukodwa:

Ukwenziwa kweemoto zombane

Ii-elektroniki zabathengi abakumgangatho ophezulu

Izixhobo zonyango kwindibano ye-elektroniki

Umbane we-aerospace

Izixhobo zonxibelelwano ze-5G

Ngolawulo lolondolozo lwezenzululwazi kunye nokuveliswa kwezinto ezintsha kwezobuchwepheshe, i-TX1 inokuqinisekisa:

Ireyithi yokusetyenziswa kwezixhobo>90%

Ixesha eliphakathi phakathi kokusilela>iiyure ezingama-5,000

Ukuthotywa kweendleko zokusebenza ngokupheleleyo ngama-25%

Kucetyiswa ukuba abasebenzisi baseke inkqubo yolondolozo epheleleyo yokuthintela kwaye bagcine intsebenziswano esondeleyo kunye nenkxaso yobugcisa be-ASM ukunika umdlalo opheleleyo ekusebenzeni kwezixhobo kwaye bafumane eyona nzuzo ingcono kutyalo-mali.