DEK umshicileli 02i

IDEK umshicileli weHorizon 02i ngumshicileli wokuncamathisela wesoda ozenzekelayo osebenza ngokugqwesileyo. Nantsi intshayelelo yayo ebanzi:

Iinkcukacha

Ukuchaneka: 1.66Cpk @ 2.5±μm.

Ubungakanani beSubstrate: 40x50 ~ 508x510mm.

Ubunzima beSubstrate: 0.2 ~ 6mm.

Isantya sokushicilela: 2mm ~ 150mm/sec.

Indawo yoshicilelo: X 457mm /Y406mm.

Ubungakanani bestencil: 736×736mm.

Umjikelo woshicilelo: 12sec~14sec.

Umkhombandlela wesubstrate: ekhohlo→ekunene/ekunene→ekhohlo.

Inkqubo yombono: Cognex.

Ulawulo: Inkqubo yekhamera yombono, i-double scraper assembly, i-manual drive setting, i-front and back track adjustment.

Ukunikezelwa kwamandla: 3P/220/5KVA.

Umthombo woxinzelelo lomoya: 5L / min.

Ubungakanani bomatshini: 186017801500mm.

Ubunzima: 950kg.

Umgaqo

I-DEK Printer 02i isebenzisa inkqubo yekhamera ebonakalayo yokubeka i-substrate kunye ne-stencil ngokusebenzisa indlela yokulawula umbane. Indlela yayo yokulawula intshukumo ilawula ngokuchanekileyo ukuhamba kwe-scraper, kubandakanywa neeparitha ezifana nesantya, uxinzelelo kunye ne-stroke. Ngethuba lenkqubo yokushicilela, i-scraper icinezela i-solder paste ukusuka ekuvuleni kwe-stencil ukuya kwindawo ye-pad kwi-substrate ukufezekisa ukuprintwa ngokuchanekileyo kwe-solder paste.

Iingenelo

Ukuchaneka okuphezulu: Indlela yokulawula umbane iqinisekisa isantya esiphezulu kunye nokuchaneka, kwaye inokufezekisa i-Cpk 1.6 kwi-± 25μm epheleleyo yomsebenzi wenkqubo.

Uzinzo olomeleleyo: Yamkela itekhnoloji ye-rack ye-DEK ephuculweyo eqhelekileyo kwiqonga le-Horizon, kunye nokuzinza okungokwemvelo kunye nokuthembeka koomatshini abaphezulu.

Ukusebenza ngokulula: I-interface ye-Instinctiv™ yomsebenzisi inemizobo ecacileyo kunye noyilo olwenziwe ngumntu, kulula ukuyisebenzisa, kwaye inomsebenzi otyebileyo wokubuyisela iziphene ebhodini ukuphucula ixesha.

Ukuguquguquka okuphezulu: Inokuxhasa izixhobo ezahlukeneyo ezinamandla kunye nekhwalithi ephezulu yemveliso ukuhlangabezana neemfuno ezahlukeneyo zemveliso.

Ukuguqulwa ngokukhawuleza: Ineempawu zokuseta ngokukhawuleza kunye nokuguqulwa ngokukhawuleza, okufanelekileyo kwiprototype kunye nokuveliswa kwemveliso yokuqala, kwaye inokuhlangabezana neemfuno zokuvelisa ngobuninzi.

Umsebenzi

Isetyenziselwa ikakhulu ukuprintwa kwe-solder paste yeebhodi zesekethe kwishishini lokwenziwa kwe-elektroniki. Iprinta ngokuchanekileyo i-solder pads kwibhodi yesekethe, inika isiseko esihle sokubekwa kwecandelo elilandelayo kunye neenkqubo ze-welding, kwaye iqinisekisa ukuba izixhobo ze-elektroniki zinokudibaniswa ngokuthembekileyo kwibhodi yesekethe, ngaloo ndlela iphucula umgangatho kunye nokuthembeka kweemveliso ze-elektroniki.

Umsebenzi

Ukumisa ngokuzenzekelayo: Ngoncedo lwenkqubo ebonakalayo, iindawo zokumakisha kwi-substrate kunye ne-mesh yensimbi zichongwa ngokuzenzekelayo ukufezekisa ukulungelelaniswa okuchanekileyo kunye nokubeka.

Ukulawulwa kwe-scraper: Isofthiwe inokulawula indlela yoxinzelelo lwe-scraper ukufezekisa ulawulo oluchanekileyo loxinzelelo lwe-scraper, isantya kunye ne-stroke ukuhlangabezana neemfuno ezahlukeneyo zokushicilela.

Ukusetwa kweParameter: Iiparamitha ezahlukeneyo zokuprinta ezifana nesantya sokushicilela, uxinzelelo, isantya sokwahlula i-substrate kunye nomgama unokusetwa ngokulula ngojongano lomsebenzisi.

Ukuxilongwa kwempazamo kunye nokuchacha: Inemisebenzi ethile yokuxilongwa kwempazamo, inokubona kwangexesha kwaye ikhawulezise ulwazi lwempazamo, kwaye umsebenzi wokubuyisela isiphene kwibhodi unceda ukusombulula ingxaki ngokukhawuleza kwaye uqalise kwakhona imveliso.

Iimpawu

Imveliso esebenzayo: Isantya sokushicilela ngokukhawuleza kunye nomjikelo omfutshane wokushicilela unokuphucula ukusebenza kakuhle kwemveliso.

Ukuhambelana kakuhle: Iyakwazi ukulungelelanisa kwiindidi ze-substrates kunye neentsimbi zentsimbi ezinobungakanani obuhlukeneyo, kunye nokuhambelana kakuhle kunye nokuguquguquka.

Umgangatho othembekileyo: Ngolawulo oluchanekileyo kunye nokusebenza okuzinzileyo, umgangatho wokuprintwa kwe-solder paste uqinisekisiwe kwaye iziphene zokushicilela ziyancitshiswa.

Imiyalezo yemposiso eqhelekileyo

I-MOTOR COMMS FAILURE: Isenokuba kukungaphumeleli konxibelelwano lwemoto, njengokungaphumeleli kwebhuleki ye-axis ye-Z kunye nebhanti, ukungaphumeleli kwekhadi le-subsystem, umbane ongonelanga wekhadi lokuqhuba, njl.

Imposiso ye-Hardware ye-Vision 1: Isenokuba yimpazamo kwinkqubo.

Imposiso yokufumana umbono: Ibhanti yekhamera inokophuka kwaye ibangele le mpazamo.

I-PRINT CARRIGE ERROR: Ngokuqhelekileyo kukho ingxaki ngeCARRIGE MOTOR kunye neebhuleki.

Ikhadi 0, i-axis 123 impazamo ye-fatnl: Kungenzeka ukuba iiparamitha zoomatshini azinzile.

Iindlela zogcino

Ukucocwa rhoqo: Hlola rhoqo kwaye uhlambulule iindawo eziphambili zomshicileli, ezifana neetemplates zokuprinta, i-scrapers, i-rubber rollers, amabhande okuhambisa kunye nezinye iindawo ezinothuli, kwaye usebenzise ii-agent ezikhethekileyo zokucoca kunye nezixhobo zokususa ukungcola okunenkani.

Ukuhlolwa kwecandelo: Hlola ukunxiba kwe-scraper, ukunyanzeliswa kwebhanti yokuhambisa, ukudityaniswa kwebhodi yesiphaluka, nokuba umbhobho womoya odibeneyo ukhululekile, nokuba inzwa isebenza ngokufanelekileyo, njl.

Ukulinganisa iParameter: Rhoqo ulungelelanisa abenzi boluvo kunye neekhamera zomshicileli ukuqinisekisa ukuba bachonga ngokuchanekileyo amanqaku kwitemplate yokuprinta; sebenzisa izixhobo zokulinganisa ezichanekileyo ezifana neenkqubo zokulungelelanisa i-laser ukuqinisekisa ukuthe tye kweqonga lokushicilela kunye nokuma kwesakhelo.

Ukutshintshwa kweendawo zokunxiba: Ngokusetyenziswa kwezixhobo, buyisela iindawo ezigugileyo ngexesha elifana namabhanti, ii-clutches zebrake, iivalve ze-solenoid, njl.

Ulwazi oluqhelekileyo lwempazamo kunye neengcamango zokulondoloza

I-alamu yebhodi yokupakisha: Kungenzeka ukuba i-sensor ye-output yebhodi yaphukile. Ingcamango yokulondoloza kukubuyisela inzwa entsha kwaye uyifake kwakhona.

Isitshixo sestencil asiqinile: Ngokuqhelekileyo ivalve ye-solenoid yophukile kwaye ifuna ukutshintshwa.

Uncamathiselo lokushicilela luvaliwe: Kungenzeka ukuba iiparamitha azichanekanga. Ungazama ukunyenyisa iiparamitha ezifana noBubude boMbono kunye nobukhulu bePCB ukuze iKhamera ibambe ngokucacileyo inqaku leMarko.

Intloko yoshicilelo iyaphakama kwaye ayinakuthotywa: Khangela ukuba isinxibelelanisi sebhokisi yamandla sikhululekile. Ukuba ikhululekile, qinisa kwakhona isinxibelelanisi sebhokisi yamandla emva komatshini.

Inqaku le-MARKO alinakubanjwa: Isizathu sinokuthi i-baffle plate ayinakuguquguquka phezulu naphantsi, isixhumi sombhobho womoya siphukile, ubukhulu beMarko bungalunganga, iMark kwi-STENCIL kunye ne-PCB ayiqhelekanga, i-Reference Mark ayilunganga, njl.