SCREEN ekyuma ekiyonja wafer SU-3200

SCREEN SU-3200 nkola ya mmita 300 ey’okuyonja wafer emu mu by’okukola semikondokita. Olw’obusobozi bwayo obw’oku ntikko n’okukulembera mu tekinologiya w’obuyonjo, yakola nga SCREEN’s mainstay model okumala ebbanga, ng’ewagira okukola logic ne memory chips okuva ku 32nm okutuuka ku 7nm n’okusingawo nodes ez’omulembe, n’ekola kinene mu katale k’ebyuma ebiyonja.

Core Positioning and Technology Overview: Core positioning ya SU-3200 kwe kwongera nnyo ku throughput y’okuyonja single-wafer ate nga ekuuma obuyonjo obw’amaanyi ennyo, okutuukiriza ebyetaago by’obulungi ennyo eby’enkola ez’omulembe.

High-throughput Design: Okuyita mu nsengeka ey’obuyiiya ey’emitendera ena egy’okusimba, enkola emu esobola okutegekebwa n’ebisenge by’enkola eby’enjawulo ebituuka ku 12, okutuuka ku busobozi bw’okulongoosa okutuuka ku wafers 800 buli ssaawa (WPH), nga kino kyali kikulembedde mu nsi yonna mu nkola z’okuyonja wafer emu mu kiseera ekyo.

Ultra-Clean Process Environment: Okutuukiriza ebisaanyizo ebikakali ebya 22nm ne nodes ez’omulembe, SU-3200 eriko tekinologiya wa SCREEN ow’obwannannyini eya APAC (Advanced Process Atmosphere Control). Nga elongoosa embeera y’ekisenge mu bipimo ebingi, ekakasa obuyonjo obw’enkomeredde obw’enkola y’okuyonja.

Ebikulu ebikwata ku by’ekikugu: Okutuukiriza ebigendererwa bibiri eby’okuyita mu mmotoka n’obuyonjo, SU-3200 ekozesa dizayini ez’obuyiiya eziwerako, eziragiddwa mu kipande wansi:

Ekipimo kya Tekinologiya | Erinnya lya Tekinologiya | Omulimu Omukulu n’Enkola y’okussa mu nkola

Okulongoosa obusobozi bw'okumenyawo | Ekisenge ky'endagaano | Ekendeeza ku bunene bw’ekisenge ky’enkola ekimu okutuuka ku kitundu ky’ekyo ekyakisooka, ne kisobozesa okuteeka ebisenge ebisingawo mu kifo kye kimu, bwe kityo ne kyongera ku bungi bw’okuyita mu buli kitundu kya yuniti.

Enkola y'okutambuza abantu ku sipiidi enkulu | Elongoosa enzikiriziganya y’okutambuza n’embiro za wafers wakati w’ebisenge, obuwagizi obukulu okutuuka ku throughput enkulu eya wafers 800/essaawa (WPH).

Okukakasa Obuyonjo | Tekinologiya wa APAC | Tekinologiya w’ekisenge ekiyonjo ennyo kigambo kya wamu ekitegeeza tekinologiya ow’enjawulo. Tekinologiya zaayo enkulu ezitonotono mulimu:

AMC Micro-chamber: Okukendeeza ku bunene bw’ekisenge munda okutuuka ku kimu kya kusatu ku kyasooka, okusobozesa okukyusa ggaasi mu bwangu n’okulongoosa obulungi obuyonjo bw’obutonde.

ABG Airflow Balancing Baffle: Ekozesebwa okugerageranya empewo ennyonjo efuuwa wansi ekyuma ekisengejja obutundutundu eky’okungulu (FFU), okuziyiza ebiwujjo oba ebifo ebifu munda mu kisenge n’okukakasa nti obutundutundu buggyibwa bulungi.

ASP Advanced Splash Protection: Okuyita mu dizayini entuufu, okukendeeza ku kumansa eddagala mu kiseera ky’okufuuyira eddagala, okukakasa embeera ennyonjo ey’okulongoosa wafer.

APN Air Protection Nozzle: Okukozesa "air curtain" mu kiseera ky'omutendera gw'okukala okukuuma wafer surface n'okuziyiza amabala g'amazzi agava ku bisigalira by'okufuumuuka kw'amazzi.

Okugabibwa kw’eddagala okukyukakyuka: Ensonda z’eddagala zisobola okutegekebwa mu ngeri ekyukakyuka. Enkola zombi eza Dynamic Direct Injection (DDI) n’ez’ekika kya kabineti ziriwo, ekisobozesa bakasitoma okulonda mu ngeri ekyukakyuka okusinziira ku byetaago by’enkola ebitongole.

Obwangu bw’okuddaabiriza: Enzimba eggyamu: Ekisenge ky’enkola kisobola okuggyibwamu nga ddulaaya okusobola okwanguyirwa okuyonja, okukyusa ebitundu, n’emirimu emirala egy’okuddaabiriza, mu ngeri ennungi okukendeeza ku budde bw’ebyuma okuyimirira. Ebitundu by’okukozesa: Okuva ku R&D ey’omulembe okutuuka ku Mature Manufacturing

SU-3200 erina emirimu mingi, ng’ekwata ku mitendera emikulu mingi egy’okukola semikondokita.

Advanced Logic and Memory Chips: SU-3200 ekozesebwa mu R&D n’okukola chips, omuli 7nm n’ebitundu ebisingawo eby’omulembe, mu nkola zombi ez’omu maaso (FEOL) n’ez’emabega (BEOL).

Ebintu ebikulu n’enkola za Semiconductor: Mu nkola nnyingi z’ewagira mulimu okuyonja ebintu bya semiconductor eby’omulembe ogw’okusatu nga SiC (Silicon Carbide) ne GaN (Gallium Nitride).

Okunoonyereza okw’omulembe n’okukolagana n’obutonde bw’ensi: Enkola ey’amaanyi eya SU-3200 egifuula okulonda kw’ebitongole ebikulembedde mu kunoonyereza n’okukulaakulanya mu nsi yonna. Okugeza, IBM etadde mu nkola SU-3200 mu kifo kyayo eky’okunoonyereza ku semikondokita e Albany, New York. Ekirala, SCREEN ekwataganye ne Applied Materials, n’eteeka SU-3200 mu META Center yaayo okukola enkola za chip ez’omulembe.

Embeera y'akatale n'Ebyafaayo Ebiweereddwayo

SU-3200 tekoma ku kukola buwanguzi wabula era nsonga nkulu mu kuteekawo ekifo kya SCREEN mu bukulembeze mu katale.

Okufuga akatale: Oluvannyuma lw’obuwanguzi bwa SU-3200, SCREEN yayongera okunyweza ekifo kyayo eky’okukulembera mu mulimu gw’ebyuma ebiyonja. Okusinziira ku biwandiiko ebitongole ebya SCREEN, okutuuka mu July 2025, omugugu gwayo ogw’ebyuma ebiyonja semiconductor ogwakuŋŋaanyiziddwa gwasukka yuniti 15,000, nga gulina omugabo gw’akatale nnamba emu mu nsi yonna mu bitundu ebiwerako omuli okuyonja wafer emu, okuyonja mu bitundutundu, n’okuyonja mu sipiini.

Empagi y’enyingiza: Okumala ebbanga ddene, SU-3200 yali kintu kya SCREEN eky’emmunyeenye, era ssente ze yafuna mu bizinensi y’ebyuma ebiyonja zaali zeesigamye nnyo ku mmotoka eno.