Isicoci sewafer sesikrini i-SU-3200

I-SCREEN SU-3200 yinkqubo yokucoca i-single-wafer eyi-300mm ephawulekayo kwishishini lokuvelisa i-semiconductor. Ngobuchule bayo obuphezulu kunye nobuchwepheshe bokucoca obuphambili, isebenze njengemodeli ephambili ye-SCREEN ixesha elide, ixhasa ukuveliswa kwee-logic kunye nee-memory chips ukusuka kwi-32nm ukuya kwi-7nm kunye nee-nodes eziphambili ngakumbi, idlala indima ebalulekileyo kwimarike yezixhobo zokucoca.

Isishwankathelo seCore Positioning kunye neTekhnoloji: Ukubekwa kweCore SU-3200 kukwandisa kakhulu amandla okucoca nge-single-wafer ngelixa kugcinwa ucoceko oluphezulu kakhulu, ukuhlangabezana neemfuno zokusebenza kakuhle kakhulu kweenkqubo eziphambili.

Uyilo Oluphezulu: Ngoyilo olutsha olunemigangatho emine edibeneyo, inkqubo enye inokulungiswa ngamagumbi okusebenza azimeleyo ukuya kuthi ga kwi-12, ukufikelela kumthamo wokucubungula ukuya kuthi ga kwi-800 wafers ngeyure (WPH), eyayikhokela kwihlabathi liphela phakathi kweenkqubo zokucoca i-single-wafer ngelo xesha.

Indawo yeNkqubo eCocekileyo kakhulu: Ukuze ihlangabezane neemfuno ezingqongqo ze-22nm kunye nee-node eziphucukileyo, i-SU-3200 ixhotyiswe ngetekhnoloji ye-SCREEN ye-APAC (Advanced Process Atmosphere Control). Ngokwenza ngcono indawo yegumbi kwiinkalo ezahlukeneyo, iqinisekisa ukucoceka kokugqibela kwenkqubo yokucoca.

Iinkcukacha zobuGcisa eziPhambili: Ukufezekisa iinjongo ezimbini zokuvelisa kunye nokucoceka, i-SU-3200 isebenzisa uthotho lweendlela ezintsha zoyilo, ezichazwe kwitheyibhile engasezantsi:

Ubungakanani beTekhnoloji | Igama leTekhnoloji | Umsebenzi oPhambili kunye nendlela yokuSebenza

Ukuphuculwa koMbane wokuPhucula | Igumbi eliQhelekileyo | Inciphisa umthamo wegumbi lenkqubo enye ukuya kwisiqingatha segumbi langaphambili, okwenza kube nokwenzeka ukusasaza amagumbi amaninzi kwindawo enye, ngaloo ndlela inyusa umthamo wokusebenza kwindawo nganye yeyunithi.

Inkqubo yokudlulisa ngesantya esiphezulu | Iphucula indlela yokudlulisa kunye nesantya see-wafers phakathi kwamagumbi, inkxaso ephambili yokufikelela kwi-wafers ezingama-800 ngeyure (WPH).

Uqinisekiso loCoceko | ITekhnoloji ye-APAC | Itekhnoloji yegumbi ecocekileyo kakhulu ligama elidityanisiweyo lothotho lweetekhnoloji. Iitekhnoloji zayo eziphambili ziquka:

I-AMC Micro-chamber: Ukunciphisa umthamo wangaphakathi wegumbi ukuya kwisithathu selinye langaphambili, okwenza ukuba kukhawuleziswe ukutshintshwa kwegesi kwaye kuphuculwe ngokufanelekileyo ucoceko lokusingqongileyo.

I-ABG Airflow Balancing Baffle: Isetyenziselwa ukulinganisa ukuhamba komoya okucocekileyo okuvuthuzwa yi-high-efficiency particulate filter (FFU), ithintela imiphetho okanye iindawo ezifileyo ngaphakathi kwigumbi kwaye iqinisekise ukususwa ngokufanelekileyo kwezinto ezincinci.

Ukhuseleko lwe-ASP Advanced Splash: Ngokuyila ngokuchanekileyo, ukunciphisa ukutshiza ngamakhemikhali ngexesha lokutshiza ngamakhemikhali, ukuqinisekisa indawo yokucubungula iiwafer ecocekileyo.

I-APN Air Protection Nozzle: Ukusebenzisa "ikhethini yomoya" ngexesha lokomisa ukukhusela umphezulu we-wafer nokuthintela amabala amanzi abangelwa yintsalela yolwelo lokuphuma kwamanzi.

Ubonelelo lweeKhemikhali oluGuquguqukayo: Imithombo yeeKhemikhali inokulungiswa ngendlela eguquguqukayo. Zombini iinkqubo zeDynamic Direct Injection (DDI) kunye nezekhabhathi ziyafumaneka, nto leyo evumela abathengi ukuba bakhethe ngendlela eguquguqukayo ngokweemfuno ezithile zenkqubo.

Ukulungiswa okulula: Ulwakhiwo lokutsalwa: Igumbi lenkqubo lingatsalwa njengedrowa ukuze kube lula ukucoca, ukutshintsha izinto, kunye neminye imisebenzi yokulungisa, nto leyo enciphisa ngokufanelekileyo ixesha lokungasebenzi kwezixhobo. Iindawo zokusetyenziswa: Ukusuka kwiR&D ePhambili ukuya kwiMveliso eVulileyo

I-SU-3200 inoluhlu olubanzi lwezicelo, igubungela amanqanaba aphambili okwenziwa kwee-semiconductor.

IiChips zeLogic eziPhambili kunye neeMemori: I-SU-3200 isetyenziswa kwi-R&D nakwimveliso yeechips, kuquka i-7nm kunye neenodes eziPhambili ngakumbi, kwiinkqubo ze-front-end (FEOL) kunye ne-back-end (BEOL).

Izixhobo kunye neenkqubo eziphambili zeSemiconductor: Phakathi kweenkqubo ezininzi ezixhasayo kukucoca izixhobo ze-semiconductor zesizukulwana sesithathu ezifana neSiC (Silicon Carbide) kunye neGaN (Gallium Nitride).

Uphando Oluphezulu kunye neNtsebenziswano ye-Ecosystem: Ukusebenza okunamandla kwe-SU-3200 kuyenza ibe lukhetho lweziko eziphambili ze-R&D kwihlabathi liphela. Umzekelo, i-IBM isebenzise i-SU-3200 kwiziko layo lophando lwe-semiconductor e-Albany, eNew York. Ngaphezu koko, i-SCREEN isebenzisana ne-Applied Materials, ifaka i-SU-3200 kwiZiko layo le-META ukuze iphuhlise iinkqubo ze-chip eziphucukileyo.

Isikhundla seMarike kunye neMinikelo yeMbali

I-SU-3200 ayisiyomveliso ephumeleleyo nje kuphela kodwa ikwayinto ebalulekileyo ekusekeni isikhundla sobunkokeli kwimarike ye-SCREEN.

Ulawulo lweMarike: Emva kwempumelelo ye-SU-3200, i-SCREEN yaqinisa isikhundla sayo esiphambili kwicandelo lezixhobo zokucoca. Ngokwedatha esemthethweni ye-SCREEN, ukusukela ngoJulayi 2025, ukuthunyelwa kwayo okuqokelelweyo kwezixhobo zokucoca ze-semiconductor kudlule iiyunithi ezili-15,000, zibambe isabelo semarike sehlabathi jikelele kwiindawo ezininzi kubandakanya ukucoca nge-single-wafer, ukucoca ngebhetshi, kunye nokucoca nge-spin.

Intsika yeNgeniso: Kangangexesha elide, i-SU-3200 yayiyimveliso ebalaseleyo ye-SCREEN, kwaye ingeniso yeshishini layo lezixhobo zokucoca yayixhomekeke kakhulu kule modeli.