SEMES ekyuma ekiyonja wafer BLUEICE PRIME

SEMES’ BLUEICE PRIME nkola ya mm 300 mu bujjuvu ey’okwoza wafer emu ekoleddwa mu tekinologiya ow’omulembe (LPT) logic n’okukola memory chip. Yakolebwa era n’ekolebwa kkampuni ya SEMES, egaba ebyuma ebikulu wansi wa Samsung Electronics, era kitundu kikulu nnyo mu byuma okutumbula amakungula g’okufulumya mu bungi mu nkola ez’omulembe nga 2nm.

Enkola Ennungi: Okugerageranya Enkola n’Obusobozi obw’Eby’Omulembe

Superior Process Performance: Esobola okuggyawo obutundutundu ku ddaala lya 19nm, okulongoosa ennyo etching uniformity n’ebitundu ebisukka mu 40%.

High-Efficiency Capacity Design: Nga enkola ey’okwoza wafer emu eya mm 300, ekwata wafers ezisukka mu 500 buli ssaawa (WPH), etuukiriza bulungi ebyetaago by’okufulumya ebintu mu bungi.

Ebintu Ebikwata ku By’ekikugu: Dizayini Ez’obuyiiya Ennyingi Ezeetongodde

Enkola ya Phosphoric Acid ey’ebbugumu eringi ey’obuyiiya: Enkola yaayo enkulu ekozesa asidi wa phosphoric ow’ebbugumu eringi okukola wafer etching n’okugiggyamu. Okufuga okutuufu okufuuyira n’ebbugumu kukendeeza bulungi ku kusaasaana kw’enkola n’emiwendo gy’obulema, okulongoosa ennyo amakungula ga chip za 2nm.

**Independently Developed High-Temperature Chuck:** Tekinologiya ono alongoosa obumu bw’ebbugumu mu kiseera ky’okubugumya wafer, akendeeza nnyo ku bulema mu nkola, era avvuunuka obuzibu bw’enkola ez’ennono ez’okuyonja nga nnyogovu.

**Okufuga obucaafu mu ngeri ey’enjawulo:** Ekisenge kya NIC (Non-Interaction Clean) kiziyiza bulungi obucaafu obusalasala, nga kigatta ne tekinologiya wa SF-Aerosol (high-speed/uniform droplet) okusobola okuyonja mu mubiri.

**Highly Integrated Intelligent System:** Eriko APAC, AIS (Automatic Detection System), ne SEAS (Smart Equipment Analysis System), etuuka ku kufuga okutambula okutuufu n’okwekenneenya mu ngeri ey’amagezi embeera y’ebyuma.

**Ebitundu by'okukozesa:** Esinziira ku Samsung, eweereza bakasitoma ab'oku ntikko mu nsi yonna.

BLUEICE PRIME okusinga etunuulidde amakampuni ag’oku ntikko mu nsi yonna agakola logic chip foundries n’abakola memory. Nga ekozesa embeera ya kkampuni yaayo enkulu SEMES ng’ekitongole kya Samsung Group, ekyuma kino kiyungiddwa nnyo mu layini za Samsung ezisinga okukola wafer fab ez’omulembe. Ekizigo kyayo eky’okuyonja ekibisi kikola ensengekera y’obutonde enzijuvu n’ebyuma ebirala ebikulu eby’omu maaso nga lithography (OMEGA series) ne etching (MICHELAN series). Kinajjukirwa nti SEMES egaziyizza bizinensi yaayo okutuuka mu kisaawe kyonna eky’okukola HBM (High Bandwidth Memory), n’ekola bulungi n’okufulumya ekyuma ekigatta ebbugumu (TC Bonder) eky’okuteeka chip za HBM.

Mu bufunze, BLUEICE PRIME eraga amaanyi ga tekinologiya amangi aga SEMES mu kisaawe ky’ebyuma bya semiconductor. Kitundu kikulu nnyo mu kaweefube wa Samsung Group okunyweza ekifo kyayo ng’omukulembeze mu nsi yonna mu tekinologiya ow’omulembe ow’enkola era nga kye kimu ku bikozesebwa ebikulu ebiwagira amakolero ag’omulembe wansi wa 2nm