SEMES wafer cleaner BLUEICE PRIME

SEMES' BLUEICE PRIME is a 300mm fully automated single-wafer cleaning system designed for advanced process technology (LPT) logic and memory chip manufacturing. Developed and manufactured by SEMES, a core equipment supplier under Samsung Electronics, it is a key piece of equipment for improving mass production yields of cutting-edge processes such as 2nm.

Core Performance: Balancing Advanced Processes and Capacity

Superior Process Performance: Capable of removing particles at the 19nm level, significantly improving etching uniformity by over 40%.

High-Efficiency Capacity Design: As a 300mm single-wafer cleaning system, it handles over 500 wafers per hour (WPH), effectively meeting the demands of large-scale mass production.

Technical Features: Multiple Independently Developed Innovative Designs

Innovative High-Temperature Phosphoric Acid Process: Its core process utilizes high-temperature phosphoric acid for wafer etching and stripping. Precise control of spraying and temperature effectively reduces process dispersion and defect rates, significantly improving 2nm chip yields.

**Independently Developed High-Temperature Chuck:** This technology improves temperature uniformity during wafer heating, significantly reduces process defects, and overcomes the limitations of traditional wet cleaning methods.

**Comprehensive Contamination Control:** The NIC (Non-Interaction Clean) chamber effectively prevents cross-contamination, combined with SF-Aerosol (high-speed/uniform droplet) technology for physical cleaning.

**Highly Integrated Intelligent System:** Equipped with APAC, AIS (Automatic Detection System), and SEAS (Smart Equipment Analysis System), it achieves precise flow control and intelligent analysis of equipment status.

**Application Areas:** Based at Samsung, serving top global clients.

BLUEICE PRIME primarily targets top global logic chip foundries and memory manufacturers. Leveraging its parent company SEMES's status as a Samsung Group subsidiary, this equipment is deeply integrated into Samsung's most advanced wafer fab production lines. Its wet cleaning solution forms a complete ecosystem with other core front-end equipment such as lithography (OMEGA series) and etching (MICHELAN series). It's worth noting that SEMES has expanded its business scope to the entire HBM (High Bandwidth Memory) manufacturing field, successfully developing and mass-producing a thermal bonding machine (TC Bonder) for HBM chip stacking.

In summary, BLUEICE PRIME demonstrates SEMES's profound technological strength in the semiconductor equipment field. It is a crucial part of Samsung Group's efforts to solidify its position as a global leader in advanced process technologies and a key tool supporting cutting-edge manufacturing below 2nm