ASM DEK TQL SMT screen printer

DEK TQL is a high-performance fully automatic solder paste printer launched by ASM Assembly Systems (formerly DEK). It is designed for high-precision and high-capacity SMT production lines and is widely used in consumer electronics, automotive electronics, communication equipment and other fields. It is especially suitable for solder paste printing of fine-pitch PCBs such as 01005 components and 0.3mm pitch BGA.

2. DEK TQL core specifications

Προδιαγραφές παραμέτρων

Maximum PCB size 510 × 460 mm

Printing accuracy ±15μm (Cpk≥1.33)

Printing speed 50–300 mm/s (adjustable)

Scraper pressure range 5–20 kg (programmable)

Stencil thickness support 0.1–0.3 mm

Demolding speed 0.1–3 mm/s (adjustable)

Power requirements 220VAC / 50-60Hz, 1.5kW

Air source pressure 0.5–0.7 MPa

Vision system High-resolution CCD (supports 2D/3D SPI)

3. DEK TQL main features

1. High-precision printing

±15μm printing accuracy, supports fine components such as 01005, 0.3mm pitch BGA.

Closed-loop control system, real-time adjustment of scraper pressure to ensure uniform solder paste thickness.

2. High speed and high efficiency

The maximum printing speed is 300mm/s, which improves the UPH (unit hourly production capacity) of the production line.

Quick line change (<5 minutes), supporting automatic program switching.

3. Intelligent control

2D/3D SPI (solder paste detection) integration to reduce the outflow of defective products.

Automatic steel mesh cleaning (dry wipe/wet wipe/vacuum adsorption) to reduce solder paste residue.

4. Stable and reliable

Modular design (scraper, camera, cleaning system can be quickly replaced).

MES system docking to achieve data traceability and process optimization.

IV. DEK TQL core functions

Automatic PCB positioning

High-precision CCD visual alignment (Mark point recognition) to ensure accurate matching of steel mesh and PCB.

Intelligent scraper control

Pressure, speed, and angle are programmable to adapt to different solder pastes (including lead-free solder paste, glue, etc.).

Steel mesh tension management

Automatically detect steel mesh tension to avoid poor printing due to loose steel mesh.

3D solder paste detection (optional)

Real-time measurement of solder paste thickness and volume to prevent defects such as insufficient solder and pull tips.

Remote monitoring and data analysis

Support Industry 4.0, can connect to MES/ERP system, and optimize production parameters.

V. The role of DEK TQL in SMT production line

Improve yield

High-precision printing reduces poor soldering after SMT patch (such as cold soldering and bridging).

Improve efficiency

High-speed printing + fast line change, shorten production cycle.

Reduce cost

Reduce solder paste waste and rework rate.

Adapt to flexible production

Support multi-variety, small batch PCB production (such as customized needs of automotive electronics).

VI. Προφυλάξεις κατά τη χρήση

1. Equipment installation and environment

Temperature/humidity control: The recommended ambient temperature is 23±3℃ and the humidity is 40-60%RH.

Gas source stability: Ensure the air pressure is 0.5–0.7MPa to avoid fluctuations affecting printing quality.

Horizontal calibration: The equipment needs to be placed on a stable ground and the levelness should be checked regularly.

2. Operation specifications

Solder paste management: Allow to warm up for more than 4 hours and stir for 2-3 minutes before use.

Stencil cleaning: Perform wet wiping + vacuum adsorption cleaning after every 5-10 printings.

Scraper maintenance: Check the wear regularly. The life of a metal scraper is about 500,000 times.

3. Program optimization

Demolding speed: 0.3–1mm/s is recommended. Too fast will easily cause the solder paste to pull sharp.

Scraper angle: Usually set to 45–60°. Too small an angle may affect the tinning effect.

VII. Συνήθη σφάλματα και λύσεις

1. Printing deviation (Mark point recognition failure)

Πιθανοί λόγοι:

PCB Mark point pollution or insufficient reflection.

Camera lens is dirty or light source is abnormal.

Διάλυμα:

Clean PCB Mark point and adjust light source brightness.

Calibrate visual system and check camera focus.

2. Solder paste tip/insufficient solder

Πιθανοί λόγοι:

Demolding speed is too fast.

Steel mesh tension is insufficient or scraper pressure is uneven.

Διάλυμα:

Reduce demolding speed to 0.3mm/s.

Check steel mesh tension (recommended ≥35N/cm²) and adjust scraper level.

3. Steel mesh is blocked (solder paste residue)

Πιθανοί λόγοι:

Steel paste is dry or cleaning frequency is insufficient.

Steel mesh opening design is unreasonable (such as width-to-depth ratio <1.5).

Διάλυμα:

Increase wet wiping frequency and use special steel mesh cleaning agent.

Optimize the steel mesh opening design (recommended width-to-depth ratio ≥1.5).

4. Equipment alarm (air pressure/servo failure)

Πιθανές αιτίες:

Air leakage or insufficient air pressure.

Servo motor overheating or driver failure.

Treatment:

Check the air source pipeline and replace the damaged air pipe.

Clean the servo motor cooling fan and restart the system.

5. Abnormal scraper pressure

Πιθανές αιτίες:

Scraper sensor failure.

Scraper wear or deformation.

Treatment:

Calibrate the pressure sensor.

Replace the scraper (metal scrapers are recommended to be checked every 3 months).

VIII. Maintenance recommendations

Καθημερινή συντήρηση:

Clean the machine surface, track and residual solder paste on the steel mesh.

Check the pressure gauge and filter drainage.

Εβδομαδιαία συντήρηση:

Lubricate the linear guide and lead screw.

Check the scraper wear.

Μηνιαία συντήρηση:

Calibrate the visual system and scraper pressure sensor.

Check if the electrical connection is loose.

IX. Σύνοψη

DEK TQL has become the core equipment of high-end SMT production lines with its advantages of high precision, high speed and intelligence. Through standardized operation, preventive maintenance and rapid troubleshooting, equipment efficiency can be maximized and printing yield can be improved. For complex faults (such as servo system errors), it is recommended to contact our technical support or use original spare parts for repair.

If more detailed parameters or specific problem solutions are required, specific application scenarios can be provided for further analysis