ASM DEK TQL SMT ekyuma ekikuba ebitabo ku ssirini

DEK TQL ye printa ya solder paste ekola obulungi mu bujjuvu eya otomatiki eyatongozebwa kkampuni ya ASM Assembly Systems (eyali DEK). Ekoleddwa ku layini z’okufulumya SMT ezikola obulungi n’obusobozi obw’amaanyi era ekozesebwa nnyo mu byuma ebikozesebwa, ebyuma by’emmotoka, ebyuma by’empuliziganya n’emirimu emirala. Esaanira nnyo okukuba solder paste printing ya fine-pitch PCBs nga 01005 components ne 0.3mm pitch BGA.

2. DEK TQL ebikwata ku nsonga enkulu

Ebikwata ku Parameters

Sayizi ya PCB esinga obunene 510 × 460 mm

Obutuufu bw’okukuba ebitabo ±15μm (Cpk≥1.33)

Sipiidi y’okukuba ebitabo 50–300 mm/s (etereezebwa)

Puleesa y’okusenya okuva ku kkiro 5–20 (esobola okuteekebwateekebwa) .

Obuwanvu bwa stencil obuwanirira mm 0.1–0.3

Sipiidi y’okuggya ekibumbe 0.1–3 mm/s (etereezebwa)

Amaanyi ageetaagisa 220VAC / 50-60Hz, 1.5kW

Puleesa y’ensibuko y’empewo 0.5–0.7 MPa

Enkola y’okulaba CCD ey’obulungi obw’amaanyi (ewagira 2D/3D SPI)

3. Ebintu ebikulu ebya DEK TQL

1. Okukuba ebitabo mu ngeri entuufu ennyo

±15μm okukuba ebitabo obutuufu, ewagira ebitundu ebirungi nga 01005, 0.3mm eddoboozi BGA.

Enkola y’okufuga enzigale, okutereeza mu kiseera ekituufu puleesa y’okusenya okukakasa obuwanvu bwa solder paste obw’enjawulo.

2. Sipiidi ya waggulu ate nga ekola bulungi

Sipiidi esinga okukuba ebitabo eri 300mm/s, ekirongoosa UPH (unit hourly production capacity) eya layini y’okufulumya.

Okukyusa layini okw’amangu (

3. Okufuga mu ngeri ey’amagezi

2D/3D SPI (solder paste detection) okugatta okukendeeza ku kufuluma kw’ebintu ebiriko obuzibu.

Okwoza akatimba k’ekyuma mu ngeri ey’otoma (dry wipe/wet wipe/vacuum adsorption) okukendeeza ku bisigalira bya solder paste.

4. Enywevu era eyeesigika

Modular design (scraper, camera, enkola y’okuyonja esobola okukyusibwa amangu).

MES system docking okutuuka ku data okulondoola n’okulongoosa enkola.

IV. DEK TQL emirimu emikulu

Okuteeka PCB mu kifo kya otomatiki

High-precision CCD visual alignment (Mark point recognition) okukakasa okukwatagana okutuufu okw’akatimba k’ekyuma ne PCB.

Okufuga okusenya mu ngeri ey’amagezi

Puleesa, sipiidi, n’enkoona bisobola okuteekebwa mu pulogulaamu okutuukagana n’ebizigo bya solder eby’enjawulo (nga mw’otwalidde ne solder paste etaliimu lead, glue, n’ebirala).

Enzirukanya y’okusika omuguwa kw’akatimba k’ekyuma

Laba otomatiki okusika omuguwa kw’akatimba k’ekyuma okwewala okukuba obubi olw’akatimba k’ekyuma akatambula.

Okuzuula ekizigo kya solder mu ngeri ya 3D (eky’okwesalirawo) .

Okupima mu kiseera ekituufu obuwanvu n’obunene bwa solder paste okuziyiza obulema nga solder obutamala n’ensonga z’okusika.

Okulondoola okuva ewala n’okwekenneenya data

Okuwagira Industry 4.0, esobola okuyungibwa ku nkola ya MES/ERP, n'okulongoosa parameters z'okufulumya.

V. Omulimu gwa DEK TQL mu layini y’okufulumya SMT

Okulongoosa amakungula

Okukuba ebitabo mu ngeri entuufu kukendeeza ku kusoda obubi oluvannyuma lwa SMT patch (nga okusoda mu nnyonta n’okukola bridge).

Okwongera ku bulungibwansi

Okukuba ebitabo ku sipiidi + okukyusa layini amangu, okukendeeza ku cycle y’okufulumya.

Okukendeeza ku nsaasaanya

Kendeeza ku kasasiro wa solder paste n’okuddamu okukola.

Okumanyiira okufulumya ebintu mu ngeri ekyukakyuka

Okuwagira okufulumya PCB ez’enjawulo ez’enjawulo, ez’ekibinja ekitono (nga ebyetaago ebikoleddwa ku mutindo gw’ebyuma by’emmotoka).

VI. Okwegendereza mu kukozesa

1. Okuteeka ebyuma n’obutonde bw’ensi

Okufuga ebbugumu/obunnyogovu: Ebbugumu erisengekeddwa eri 23±3°C ate obunnyogovu buli 40-60%RH.

Okutebenkera kw’ensibuko ya ggaasi: Kakasa nti puleesa y’empewo eri 0.5–0.7MPa okwewala enkyukakyuka ezikosa omutindo gw’okukuba ebitabo.

Horizontal calibration: Ebyuma byetaaga okuteekebwa ku ttaka erinywevu era obuwanvu bwabyo bulina okukeberebwa buli kiseera.

2. Ebikwata ku nkola y’emirimu

Enzirukanya ya solder paste: Kiriza okubuguma okumala essaawa ezisukka mu 4 era onyige okumala eddakiika 2-3 nga tonnaba kugikozesa.

Okwoza stencil: Kola wet wiping + vacuum adsorption cleaning oluvannyuma lwa buli 5-10 okukuba ebitabo.

Okuddaabiriza ekyuma ekisekula: Kebera buli kiseera nga kyambala. Obulamu bw’ekyuma ekisekula ekyuma buba emirundi nga 500,000.

3. Okulongoosa pulogulaamu

Sipiidi y’okuggya ekibumbe: 0.3–1mm/s esengekeddwa. Sipiidi ennyo kijja kwanguyirwa okuleetera ekikuta kya solder okusika ennyo.

Enkoona y’okusenya: Ebiseera ebisinga eteekebwa ku 45–60°. Enkoona entono ennyo eyinza okukosa enkola y’okukola bbaati.

VII. Ensobi eza bulijjo n’okugonjoola ebizibu

1. Okukyama okukuba ebitabo (Okulemererwa okutegeera obubonero) .

Ensonga eziyinza okubaawo:

PCB Mark point obucaafu oba obutafumiitiriza bumala.

Lenzi ya kkamera ncaafu oba ensibuko y’ekitangaala si ya bulijjo.

Okugonjoola:

Yoza PCB Mark point era otereeze okumasamasa kw’ensibuko y’ekitangaala.

Kalibrate enkola y’okulaba era okebere kkamera focus.

2. Solder paste tip/solder obutamala

Ensonga eziyinza okubaawo:

Demolding speed ya mangu nnyo.

Steel mesh tension temala oba scraper pressure tekwatagana.

Okugonjoola:

Kendeeza ku sipiidi ya demolding okutuuka ku 0.3mm/s.

Kebera okusika kw’akatimba k’ekyuma (okusemba ≥35N/cm2) era otereeze omutindo gw’okusenya.

3. Akatimba k’ekyuma kazibiddwa (ebisigadde bya solder paste) .

Ensonga eziyinza okubaawo:

Steel paste nkalu oba emirundi gy’okwoza tegimala.

Dizayini y’okuggulawo akatimba k’ekyuma si ya magezi (nga omugerageranyo gw’obugazi n’obuziba <1.5).

Okugonjoola:

Yongera ku mirundi gy’okusiimuula ennyogovu era kozesa ekirungo eky’enjawulo eky’okwoza akatimba k’ekyuma.

Okulongoosa dizayini y’okuggulawo akatimba k’ekyuma (omugerageranyo gw’obugazi n’obuziba ogusemba ≥1.5).

4. Alaamu y’ebyuma (puleesa y’empewo/okulemererwa kwa servo) .

Ebiyinza okuvaako ensonga eno:

Okukulukuta kw’empewo oba puleesa y’empewo obutamala.

Servo motor okubuguma ennyo oba ddereeva okulemererwa.

Obujjanjabi:

Kebera payipu y’ensibuko y’empewo era okyuse payipu y’empewo eyonoonese.

Yoza servo motor cooling fan era oddemu okutandika enkola.

5. Puleesa y’okusenya etali ya bulijjo

Ebiyinza okuvaako ensonga eno:

Sensulo ya scraper okulemererwa.

Scraper okwambala oba okukyukakyuka.

Obujjanjabi:

Kaliba sensa ya puleesa.

Kikyuseemu ekyuma ekisekula (ebyuma ebisekula kirungi okukeberebwa buli luvannyuma lwa myezi 3).

VIII. Ebiteeso ku ndabirira

Okuddaabiriza buli lunaku:

Okwoza kungulu w’ekyuma, track ne residual solder paste ku steel mesh.

Kebera ekipima puleesa n’amazzi agafuluma mu ffilta.

Obudde bw'emirimu egibadde:

Siiga ku linear guide ne lead screw.

Kebera engeri scraper gye yambala.

Obudde bw'omwaka obudde ku bulamu:

Kalibrate enkola y’okulaba ne sensa ya puleesa y’okusenya.

Kebera oba omukutu gw’amasannyalaze guyidde.

IX. Okubumbako

DEK TQL efuuse ebyuma ebikulu mu layini z’okufulumya SMT ez’omulembe n’ebirungi byayo eby’obutuufu obw’amaanyi, sipiidi n’amagezi. Okuyita mu nkola ey’omutindo, okuddaabiriza okuziyiza n’okugonjoola ebizibu mu bwangu, obulungi bw’ebyuma busobola okulinnyisibwa era n’amakungula g’okukuba ebitabo gasobola okulongoosebwa. Ku nsobi enzibu (nga ensobi mu nkola ya servo), kirungi okutuukirira abayambi baffe ab’ekikugu oba okukozesa sipeeya ow’olubereberye okuddaabiriza.

Singa ebipimo ebisingawo ebikwata ku nsonga oba eby’okugonjoola ebizibu ebitongole byetaagibwa, embeera ez’enjawulo ez’okukozesa zisobola okuweebwa okwongera okwekenneenya