ASM E BY DEK umshicileli wokuncamathisela

I-DEK E yi-DEK sisizukulwana esitsha somshicileli wokuncamathelisa we-solder ozenzekela ngokugqibeleleyo othe waqalwa yi-ASM Assembly Systems (eyayifudula iyi-DEK). Yenzelwe i-SMT yanamhlanje (i-teknoloji ye-surface mount) imigca yokuvelisa kwaye ifanele ukuchaneka kwe-solder paste ukuprintwa kwee-PCB ezinoxinano oluphezulu (ezifana neebhodi ze-motherboard zefowuni, i-automotive electronics, kunye neemodyuli ze-5G). Le modeli iphuculwe ngakumbi ngesiseko se-DEK TQL, ibonelela ngesantya esiphezulu, ukuchaneka, kunye nemisebenzi ekrelekrele ukuhlangabezana neemfuno ze-Industry 4.0.

2. Umgaqo wokusebenza

PCB transmission kunye nokubeka

I-PCB ingena kwindawo yokuprinta ngomzila wothumelo, igxininiswe yi-clamping mechanism, kwaye ikhamera yeCCD enesisombululo esiphezulu iyaqaphela iNqaku lokulungelelanisa ngokuchanekileyo.

Steel mesh bonding

Umnatha wentsimbi kunye ne-PCB ziboshwe nge-vacuum adsorption okanye i-clamping yomatshini ukuqinisekisa ukuba akukho msantsa (isitshixo sokuchaphazela umgangatho wokushicilela).

Ukuprintwa kwe-solder paste

I-scraper (intsimbi okanye i-polyurethane) ityhala i-solder paste kwi-set pressure, i-angle, kunye nesantya, kwaye ivuza ngentsimbi yokuvula i-mesh kwi-PCB pad.

Ukwakhiwa kunye nokufumanisa

I-mesh yensimbi ihlukaniswe kwi-PCB (isantya sokuchithwa sihlengahlengiswa), kwaye ezinye iimodeli zinokuxhotyiswa nge-3D SPI (ukubona i-solder paste) ukujonga umgangatho wokushicilela ngexesha langempela.

III. Iingenelo ezingundoqo

Inkcazelo Eluncedo

Ukuchaneka kwe-Ultra-high ± 15μm ukuchaneka kokushicilela (Cpk≥1.33), ixhasa amacandelo e-01005 kunye ne-0.3mm pitch BGA.

Ukuveliswa kwesantya esiphezulu ukuya kwi-400mm / s isantya sokushicilela, ixesha lokutshintsha umgca

Ulawulo olulumkileyo oluvaliweyo lwexesha lokwenene lohlengahlengiso loxinzelelo lwe-scraper kunye nesantya sokubunjwa ukuze kuqinisekiswe ukuhambelana.

I-Modular design Scrapers, iinkqubo ezibonakalayo, kunye neemodyuli zokucoca zingatshintshwa ngokukhawuleza ukunciphisa ixesha lokuphumla.

Ishishini 4.0 elihambelanayo Ixhasa i-MES/ERP docking ukuphumeza ukulandeleka kwedatha kunye nokubeka iliso kude.

4. IiNgcaciso eziphambili

Iinkcazo zeeParameters

Ubungakanani obukhulu bePCB 510 × 460 mm

Ukuchaneka koshicilelo ±15μm (imifuziselo ye-3D SPI inokufikelela ±10μm)

Isantya soshicilelo 50–400 mm/s (enocwangciso)

Uxinzelelo lwe-scraper luluhlu lwe-5-30 kg (impendulo yoxinzelelo olukrelekrele)

Inkxaso yokuqina kwestencil 0.1-0.3 mm

Isantya sokumisa 0.1–5 mm/s (esinokulungiswa)

Iimfuno zamandla 220VAC/50-60Hz, 2.0kW

Uxinzelelo lomthombo womoya 0.5-0.7 MPa

5. Iimpawu eziphambili

1. Inkqubo ye-Intelligent scraper

Ukulawulwa koxinzelelo oluguquguqukayo: Lungisa ngokuzenzekelayo uxinzelelo lwe-scraper ngokwe-steel mesh tension ukuphepha ukuvuza kwe-solder paste okanye i-solder eyaneleyo.

Uyilo lwe-scraper oluphindwe kabini: Ixhasa indlela enye / indlela-yendlela yokushicilela ukuhlangabezana neemfuno ezahlukeneyo zenkqubo.

2. Ulungelelwaniso oluphezulu olubonakalayo

Ikhamera ye-CCD ye-10μm-level: Ixhasa ulungelelwaniso oluchanekileyo lwe-PCB kunye ne-mesh yensimbi, kwaye isenokuchongwa nokuba indawo yophawu ingcolisekile kancinane.

Ukudityaniswa kwe-3D SPI (ukhetho): Ukufunyanwa kwexesha langempela lobunzima be-solder paste kunye nomthamo wokuthintela iimveliso ezineziphene ukuba zingaphumi kwinkqubo yokupakisha.

3. Ukucocwa komnatha wentsimbi okuzenzekelayo ngokupheleleyo

Ukucoca ngeendlela ezininzi: ukosula okomileyo, ukusula okumanzi, indibaniselwano ye-vacuum adsorption ukunciphisa intsalela ye-solder paste (inokusetwa ukuba icoceke ngokuzenzekelayo emva kokushicilelwa kwe-N).

4. Uyilo olusebenziseka lula

Isikrini sokuchukumisa i-HMI: Ujongano lokusebenza komzobo, xhasa ukucofa okukodwa kweresiphi umnxeba.

Ukutshintsha komgca okhawulezayo: Ukutshintsha ubungakanani bePCB ngokuzenzekelayo kulungelelaniswa ukunciphisa iimpazamo zabantu.

VI. Imisebenzi kunye neendima

1. Imisebenzi engundoqo

Ukuchaneka okuphezulu kokuprinta kwe-solder yokunamathisela: Qinisekisa ukuthembeka kwe-welding yamacandelo e-fine-pitch.

Inkqubo yobukrelekrele yokuphucula: Rekhoda ngokuzenzekelayo iiparamitha zokuprinta kwaye ucebise ezona zicwangciso zibalaseleyo nge-algorithms ye-AI.

Ukuthintela isiphene: I-3D SPI impendulo yexesha langempela ukunciphisa izinga lokusebenza kwakhona.

2. Indima kumgca wokuvelisa we-SMT

Phucula isivuno: Nciphisa iziphene ze-welding ezifana ne-cold soldering kunye ne-bridging.

Ukunciphisa iindleko: Nciphisa inkunkuma ye-solder kunye nokunciphisa imfuno yokungenelela ngesandla.

Imveliso eguquguqukayo: Ukulungelelanisa kwiintlobo ezininzi, ii-odolo ezincinci zebhetshi (ezifana neemfuno ze-automotive electronics).

VII. Imiqathango yokusetyenziswa

1. Okusingqongileyo kunye nofakelo

Ubushushu kunye nolawulo lokufuma: 23±3℃, 40-60%RH, ukuthintela intlama ye-solder ukuba yomiswe.

Uzinzo lomthombo womoya: Uxinzelelo lomoya kufuneka luzinze kwi-0.5–0.7MPa, kwaye ukuguquguquka kuya kubangela ushicilelo olungalinganiyo.

2. Iinkcukacha zokusebenza

Ulawulo lwe-Solder paste: Phinda ushushubeze iiyure ezi-4 + ugxobhoze imizuzu emi-3 ukunqanda i-agglomeration.

Ukugcinwa komnatha wentsimbi: Jonga uxinzelelo lwemihla ngemihla (≥35N/cm²) kwaye ucoce iindawo ezivulekileyo rhoqo.

Ukugcinwa kwe-scraper: I-Metal scrapers itshintshwa rhoqo emva kweenyanga ze-3, kwaye i-polyurethane scrapers ihlolwe ukuba inxibe iveki nganye.

3. Ukuphucula inkqubo

Isantya sokumisa: i-0.3-1mm / s iyacetyiswa, ngokukhawuleza kwaye kulula ukuyitsala incam.

I-angle ye-scraper: ngokuqhelekileyo i-45-60 °, i-angle encinci kakhulu ichaphazela i-tin.

8. Iimpazamo eziqhelekileyo kunye nezisombululo

1. Impazamo: Ulungelelwaniso lombono aluphumelelanga

Unobangela onokwenzeka:

Phawula ungcoliseko lwenqaku okanye umboniso ongonelanga.

Ilensi yekhamera imdaka okanye umthombo wokukhanya awuqhelekanga.

Isisombululo:

Coca indawo yePCB Mark kwaye ulungise ukukhanya komthombo wokukhanya.

Lungisa kwakhona ugxininiso lwekhamera.

2. Impazamo: Impazamo yoxinzelelo lweSqueegee

Unobangela onokwenzeka:

Ukungaphumeleli kwenzwa ye-squeegee okanye i-scraper deformation.

Uxinzelelo lomoya olunganelanga lubangela ukuguquguquka koxinzelelo.

Isisombululo:

Ukulinganisa inzwa yoxinzelelo.

Jonga indlela yomoya kwaye ubuyisele i-scraper egugileyo.

3. Impazamo: Impazamo yokuBamba ngeStencil

Unobangela onokwenzeka:

Istencil ayibekwanga ngokuchanekileyo okanye isilinda esibambekayo sinempazamo.

Isisombululo:

Phinda ulayishe i-stencil kwaye ukhangele indlela yokudibanisa.

Coca kwaye uthambise iileyili zesilinda.

4. Imposiso: Imposiso Yenkqubo Yomoya (ukusilela kwenkqubo yomoya)

Unobangela onokwenzeka:

Uxinzelelo olungonelanga lomthombo womoya okanye ukuvuza kombhobho womoya.

Isisombululo:

Jonga uxinzelelo lwemveliso ye-compressor yomoya (≥0.5MPa).

Jonga ukuba ujongano lombhobho womoya luyavuza na.

IX. Iingcebiso zesondlo

Izinto zogcino Isiqulatho sokuSebenza rhoqo

Landelela ukucoca Daily Sula umkhondo ngelaphu elingenathuli ukunqanda intsalela ye-solder paste.

Ukufunyaniswa koxinzelelo lwestencil Rhoqo Ngeveki Sebenzisa imitha yoxinzelelo ukulinganisa nokuqinisekisa ≥35N/cm².

Ukuhlolwa kwe-scraper Qho ngeNyanga yokunxiba kunye nokutshintsha xa kukho imfuneko.

Ulungelelwaniso lwesixokelelwano esibonakalayo Ngekota Sebenzisa ibhodi yokulinganisa eqhelekileyo ukunyenyisa iiparamitha zekhamera.

Ukukhupha isihluzo somoya Ngenyanga Thintela ukufuma ekungeneni kumalungu omoya.

X. Isishwankathelo

I-DEK E nge-DEK lukhetho olufanelekileyo kwimigca yemveliso ye-SMT ephezulu kunye nokuchaneka okuphezulu, ulawulo olukrelekrele, kunye ne-Industry 4.0 ehambelanayo. Ngokusebenza okusemgangathweni, ukugcinwa kothintelo, kunye nokucombulula iingxaki ngokukhawuleza, ukusebenza kakuhle kwezixhobo kunye nemveliso yoshicilelo inokwandiswa. Ngeziphoso ezinzima (ezifana neempazamo zenkqubo ye-servo), kucetyiswa ukuba uqhagamshelane ne-ASM yenkxaso yezobuchwepheshe esemthethweni okanye usebenzise ii-original spare parts ukulungisa.